公开(公告)号：US20170323872A1

公开(公告)日：2017-11-09

申请号：US15523812

申请日：2015-11-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Matthias Sabathil ,  Matthias Sperl ,  Björn Hoxhold

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/167 ,  H01L21/565 ,  H01L23/291 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/3185 ,  H01L33/20 ,  H01L33/382 ,  H01L33/385 ,  H01L33/387 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body, the chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, the optoelectronic component includes an upper insulation layer extending over the first top side metallization, and the optoelectronic component includes a second top side metallization arranged above the upper insulation layer and electrically insulated with respect to the first top side metallization by the upper insulation layer.