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公开(公告)号：US20190308332A1
公开(公告)日：2019-10-10
申请号：US16377083
申请日：2019-04-05
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN , Tae Hwan SONG
Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.
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公开(公告)号：US20170338383A1
公开(公告)日：2017-11-23
申请号：US15468717
申请日：2017-03-24
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: H01L33/486 , H01L21/481 , H01L21/4846 , H01L23/00 , H01L23/498 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/81385 , H01L2224/83385 , H01L2224/83439 , H01L2224/85439 , H01L2933/0033 , H01L2933/0066
Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.
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公开(公告)号：US20240222418A1
公开(公告)日：2024-07-04
申请号：US18537830
申请日：2023-12-13
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: H01L27/15 , H01L33/44 , H01L33/62 , H01L2933/0025 , H01L2933/0066
Abstract: Proposed is a vertically stacked electronic device that enables the implementation of high-resolution displays by stacking individual LEDs vertically, and a method for manufacturing the vertically stacked electronic device.
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公开(公告)号：US20240192253A1
公开(公告)日：2024-06-13
申请号：US18284524
申请日：2022-03-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: G01R1/06761 , G01R1/07342
Abstract: Proposed are an electrically conductive contact pin formed by stacking a plurality of metal layers and a manufacturing method therefor, in which the electrically conductive contact pin has improved physical or electrical characteristics.
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公开(公告)号：US20220411340A1
公开(公告)日：2022-12-29
申请号：US17851061
申请日：2022-06-28
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Young Heum EOM , Tae Hwan SONG
Abstract: Proposed are a part having a corrosion-resistant layer that minimizes peeling off and particle generation of a porous ceramic layer, a manufacturing process apparatus having the same, and a method of manufacturing the part.
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Patent Agency Ranking
公开(公告)号：US20210199696A1
公开(公告)日：2021-07-01
申请号：US17131443
申请日：2020-12-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.
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公开(公告)号：US20190165219A1
公开(公告)日：2019-05-30
申请号：US16198383
申请日：2018-11-21
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a substrate for an optical device. The substrate has a cavity for mounting an optical element. The cavity has a sloped wall surface having a surface roughness Ra controlled to fall within a range of 1 nm≤Ra≤100 nm, thereby increasing the surface reflectance inside the cavity in which the optical element is mounted and thus minimizing the loss of light emitted from the optical element. Further disclosed is an optical device package including the same substrate.
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公开(公告)号：US20180074033A1
公开(公告)日：2018-03-15
申请号：US15702666
申请日：2017-09-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
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公开(公告)号：US20230352229A1
公开(公告)日：2023-11-02
申请号：US18298936
申请日：2023-04-11
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
CPC classification number: H01F27/2804 , H01F27/29 , H01F41/041 , H01F2027/2809
Abstract: Proposed are an inductor and a manufacturing method thereof. More particularly, proposed are an inductor capable of mass production by simplifying the manufacturing process while satisfying the needs for miniaturization and low resistance, and a manufacturing method thereof.
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公开(公告)号：US20210251077A1
公开(公告)日：2021-08-12
申请号：US17166768
申请日：2021-02-03
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Sung Hyun BYUN , Tae Hwan SONG
Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.
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