SOLID-STATE IMAGING DEVICE
    11.
    发明公开

    公开(公告)号:US20230223410A1

    公开(公告)日:2023-07-13

    申请号:US18107834

    申请日:2023-02-09

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage; and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    IMAGING DEVICE
    12.
    发明申请
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20200177787A1

    公开(公告)日:2020-06-04

    申请号:US16782411

    申请日:2020-02-05

    Abstract: An imaging device includes a pixel including a photoelectric converter, where the pixel captures first data in a first exposure period and captures second data in a second exposure period different from the first exposure period, the first exposure period and the second exposure period being included in a frame period. A sensitivity of the photoelectric converter in the first exposure period is different from a sensitivity of the photoelectric converter in the second exposure period, and the imaging device generates multiple-exposure image data including at least the first data and the second data.

    IMAGING DEVICE
    15.
    发明公开
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20230224600A1

    公开(公告)日:2023-07-13

    申请号:US18180708

    申请日:2023-03-08

    Abstract: An imaging device including: a first imaging cell including a first photoelectric converter that generates a first signal; and a second imaging cell including: a second photoelectric converter that generates a second signal; and a capacitor having a first and second terminal, the first terminal electrically coupled to second photoelectric converter. An area of the first photoelectric converter is greater than an area of the second photoelectric converter in a plan view, the first imaging cell has a first number of saturation charges, and the second imaging cell has a second number of saturation charges, the first number of saturation charges is greater than the second number of saturation charges, and the capacitor has capacitance that causes the second number of saturation charges of the second imaging cell to become greater than the first number of saturation charges of the first imaging cell.

    IMAGING DEVICE AND IMAGE ACQUISITION DEVICE
    18.
    发明申请

    公开(公告)号:US20190051684A1

    公开(公告)日:2019-02-14

    申请号:US16164590

    申请日:2018-10-18

    Abstract: An imaging device includes a pixel comprising a photoelectric conversion layer having a first surface and a second surface opposite to the first surface; a pixel electrode on the first surface; an auxiliary electrode on the first surface, the auxiliary electrode being spaced from the pixel electrode; an upper electrode on the second surface, the upper electrode facing the pixel electrode and the auxiliary electrode; and an amplification transistor having a gate coupled to the pixel electrode. The imaging device also includes voltage application circuitry that generates a first voltage and a second voltage different from the first voltage, the voltage application circuitry being coupled to the auxiliary electrode. The voltage application circuitry selectively supplies either the first voltage or the second voltage to the auxiliary electrode.

    SOLID-STATE IMAGING DEVICE
    19.
    发明申请

    公开(公告)号:US20190013340A1

    公开(公告)日:2019-01-10

    申请号:US16130664

    申请日:2018-09-13

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix; a vertical signal line provided for each column, conveying a pixel signal; a power line provided for each column, proving a power supply voltage;and a feedback signal line provided for each column, conveying a signal from a peripheral circuit to a pixel, in which each of the pixels includes: an N-type diffusion layer; a photoelectric conversion element above the N-type diffusion layer; and a charge accumulation node between the N-type diffusion layer and the photoelectric conversion element, accumulating signal charge generated in the photoelectric conversion element, the feedback signal line, a metal line which is a part of the charge accumulation node, the vertical signal line, and the power line are disposed in a second interconnect layer, and the vertical signal line and the power line are disposed between the feedback signal line and the metal line.

    IMAGING DEVICE
    20.
    发明申请
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20180227527A1

    公开(公告)日:2018-08-09

    申请号:US15946448

    申请日:2018-04-05

    Inventor: Tokuhiko TAMAKI

    Abstract: An imaging device, including: a semiconductor substrate; a first pixel including a first photoelectric converter that converts incident light into first charges, a first charge detection circuit on the semiconductor substrate, the first charge detection circuit electrically connected to the first photoelectric converter and detecting the first charges, and a first capacitive element electrically connected to the first photoelectric converter, the first capacitive element storing at least a part of the first charges; and a second pixel comprising a second photoelectric converter that converts incident light into second charges, and a second charge detection circuit on the semiconductor substrate, the second charge detection circuit electrically connected to the second photoelectric converter and detecting the second charges, wherein the first capacitive element is at least partially located between the first photoelectric converter and the second photoelectric converter when viewed from a normal direction of the semiconductor substrate.

Patent Agency Ranking