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公开(公告)号：US06198093B1
公开(公告)日：2001-03-06
申请号：US09196394
申请日：1998-11-19
IPC分类号： G01J350
CPC分类号： H01L27/14632 , G01J3/51 , G01J3/513 , H01L27/14621 , H01L27/14687
摘要： The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.
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公开(公告)号：US5521125A
公开(公告)日：1996-05-28
申请号：US328789
申请日：1994-10-28
申请人： Brian T. Ormond , Josef E. Jedlicka
发明人： Brian T. Ormond , Josef E. Jedlicka
IPC分类号： H01L21/304 , H01L21/78
CPC分类号： H01L21/78 , H01L21/3043
摘要： A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.
摘要翻译： 用于从晶圆制造半导体芯片的晶片设计和切割技术。 一系列氧化物层沉积在硅衬底表面的第一和第二区域中。 这些区域由其中没有氧化物层的街道分开，并且连续的氧化物层形成具有与硅衬底的表面垂直的表面的垂直壁。 冲击吸收材料沉积在街上，在其中形成凹面弯月面。 当晶片切成芯片时，吸震材料阻止硅颗粒轨迹运动。
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13.发明授权Assembly for mounting semiconductor chips in a full-width-array image scanner 失效用于将半导体芯片安装在全宽阵列图像扫描器中的组件
公开(公告)号：US5545913A
公开(公告)日：1996-08-13
申请号：US330299
申请日：1994-10-17
IPC分类号： H01L25/04 , H01L31/0203 , H01L31/00
CPC分类号： H01L25/042 , H01L24/32 , H01L31/0203 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/10158
摘要： An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along a surface of a support substrate. A plurality of semiconductor chips is disposed along the elongated bead, each semiconductor chip including a linear array of photosensors on a front surface thereof, and a back surface attached to the support substrate by the electrically conductive adhesive. A connection block is disposed along another portion of the elongated bead, the block including a first surface contacting the bead, a second surface, and a conductor extending from the first surface to the second surface.
摘要翻译： 组件有助于安装一组邻接的半导体芯片，例如对准的芯片，以在数字扫描器或复印机中形成光传感器的单个全页宽线性阵列。 导电粘合剂的细长珠沿着支撑基底的表面延伸。 多个半导体芯片沿着细长的凸条设置，每个半导体芯片包括前表面上的光电传感器的线性阵列和通过导电粘合剂附着到支撑基板的后表面。 连接块沿着细长的胎圈的另一部分设置，该块包括接触胎圈的第一表面，第二表面和从第一表面延伸到第二表面的导体。
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公开(公告)号：US06316284B1
公开(公告)日：2001-11-13
申请号：US09656879
申请日：2000-09-07
IPC分类号： H01L2100
CPC分类号： H01L27/14643 , H01L27/14685
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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15.发明授权Architecture for color space transformation to compensate for relative chip-to-chip spectral variations on a butted full-width array sensor bar 有权用于色彩空间转换的架构，用于补偿对接全宽阵列传感器条上的相对芯片到芯片的光谱变化公开(公告)号：US06266438B1
公开(公告)日：2001-07-24
申请号：US09162097
申请日：1998-09-28
IPC分类号： G06K900
CPC分类号： H04N1/56 , H01L27/14601 , H04N1/603
摘要： A color space transformation device includes a sensor bar. The sensor bar includes a plurality of sensor chips. Each sensor chip scans a unique section of an original image to produce first data in a first color space. A memory means stores groups of coefficients. Each group of coefficients corresponds to one of the sensor chips. A processor independently transforms each of the sections of the first data to a respective section of a second data. The transformation is performed as a function of one of the groups of coefficients corresponding to the sensor chip which produced the first data.
摘要翻译： 色空间变换装置包括传感器条。 传感器棒包括多个传感器芯片。 每个传感器芯片扫描原始图像的唯一部分以在第一颜色空间中产生第一数据。 存储器装置存储系数组。 每组系数对应于传感器芯片之一。 处理器将第一数据的每个部分独立地变换为第二数据的相应部分。 作为与产生第一数据的传感器芯片对应的系数组之一的函数执行变换。
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16.发明授权
公开(公告)号：US4954197A
公开(公告)日：1990-09-04
申请号：US330664
申请日：1989-03-30
IPC分类号： H04N1/028 , B41J3/28 , B41J3/44 , H01L21/58 , H01L27/146
CPC分类号： B41J2/155 , H01L24/29 , H01L24/83 , B41J2002/14362 , B41J2202/20 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , Y10T156/1089 , Y10T156/1092 , Y10T156/1759 , Y10T29/49901 , Y10T29/53178 , Y10T29/53552
摘要： A process for fabricating a full width array in which plural smaller chips are bonded end-to-end onto the metallic covering of an elongated substrate by an electrically conductive heat activated adhesive, in which a photocurable adhesive is used to temporarily retain the smaller chips in position while the heat activated adhesive is cured, the process accommodating the inability to cure the photocurable adhesive through the opaque chips and substrate covering by locating the photocurable adhesive so that it extends outside of the boundary of the smaller chips and forms an adhesive fillet or bridge between one side of the smaller chips and the substrate when cured by ultraviolet light.In an alternate embodiment, the photocurable adhesive is located within the boundary of the smaller chips initially but is squeezed out from below the smaller chips to form the exposed adhesive bridge when the smaller chips are placed on the substrate.
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公开(公告)号：US06252220B1
公开(公告)日：2001-06-26
申请号：US09299122
申请日：1999-04-26
申请人： Josef E. Jedlicka , Debra S. Vent
发明人： Josef E. Jedlicka , Debra S. Vent
IPC分类号： H01L2700
CPC分类号： H01L27/1462 , H01L27/14632 , H01L27/14687
摘要： The present invention relates to a sensor cover glass for covering photosensitive chips for generating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other digital imaging device or system. More specifically, the present invention relates to providing a sensor cover glass with an infrared filter material for blocking infrared light from reaching the photosensitive chips. This system is particularly applicable to color input imaging devices or systems.
摘要翻译： 本发明涉及用于覆盖用于从原始图像产生电信号的感光芯片的传感器盖玻璃，例如可以在数字扫描仪，复印机，传真机或其他数字成像设备或系统中找到。 更具体地说，本发明涉及提供具有用于阻挡红外光到达感光芯片的红外滤光材料的传感器盖玻璃。 该系统特别适用于彩色输入成像设备或系统。
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公开(公告)号：US6165813A
公开(公告)日：2000-12-26
申请号：US416127
申请日：1995-04-03
IPC分类号： G02B27/00 , B41J2/155 , B41J2/16 , H01L21/98 , H01L27/14 , H01L29/06 , H01L33/00 , H04N1/028 , H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： H01L25/50 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , B41J2202/19 , B41J2202/20 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.
摘要翻译： 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。
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公开(公告)号：US5604362A
公开(公告)日：1997-02-18
申请号：US603513
申请日：1996-02-20
IPC分类号： G02B5/20 , H01L21/02 , H01L27/14 , H01L31/0216 , H01L27/148
CPC分类号： H01L31/02162
摘要： In a photosensitive chip suitable for full-color imaging, separate photosites on the chip correspond to different primary colors in an original image. Each primary-color photosite is filtered with a polyimide doped to a particular primary color. The red-filtering layer and the blue-filtering layer are left on the non-photosensitive portions of the main surface of the chip, and together serve as a non-reflective area which prevents stray reflections from the chip. The chip is further provided with a base layer of infrared-filtering polyimide.
摘要翻译： 在适用于全彩色成像的感光芯片中，芯片上的独立照片对应于原始图像中的不同原色。 用掺杂到特定原色的聚酰亚胺过滤每个原色的光亮度。 红色滤光层和蓝色滤色层留在芯片的主表面的非感光部分上，并且一起用作防止来自芯片的杂散反射的非反射区域。 芯片还设置有红外滤光聚酰亚胺的基层。
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20.发明授权Method of fabricating image sensor dies and the like for use in assembling arrays 失效制造用于组装阵列的图像传感器管芯等的方法
公开(公告)号：US5219796A
公开(公告)日：1993-06-15
申请号：US787444
申请日：1991-11-04
IPC分类号： H01L21/304 , H01L21/78 , H01L31/18
CPC分类号： H01L21/78 , H01L21/304 , H01L31/1804 , Y02E10/547 , Y10S148/028
摘要： An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.
摘要翻译： 用于形成具有允许模具与其它类似模具组装的面的单个模具的改进方法，以形成具有最小碎裂和断裂的一个和/或二维扫描阵列，其中晶片的活性侧被蚀刻以形成具有 与模具相邻的槽的壁具有相对宽的表面以便于锯切，在与每个分隔槽相对的晶片的不活动侧中切割宽槽，并且通过沿着分隔槽锯切切割晶片，锯定位成使得 面对模具的锯片的侧面与宽壁的中点对准，从而在锯切壁的下半部分时，其余的凹槽被消除，留下壁的上半部分以防止锯切过程中的开裂和碎裂。
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