摘要:
The image capture period of an imaging cell, or the total time that an imaging cell is exposed to light energy, is substantially increased by utilizing a non-volatile memory (NVM), such as an electrically-erasable, programmable, read-only-memory (EEPROM) structure. The NVM structure stores and integrates charges that are proportional to the absorbed photons over a large number of sequential integration periods.
摘要:
A photodiode comprises a first terminal formed in a surface of a semiconductor substrate; a second terminal formed in the substrate surface and spaced apart from the first terminal; and a plurality of adjacent alternating N-type and P-type diffusion regions formed in the substrate surface between the first terminal and the second terminal.
摘要:
Methods and structures provide galvanic isolation for electrical systems using a wide oxide filled trench, and that allows power across the system divide with a transformer, and that transmits data at a high baud rate using an optical link. The system solution allows the integration of all of these elements onto a single semiconductor substrate in contrast to currently available galvanic isolation systems that require multiple individual silicon die that are connected by wire bonds and are relatively slow.
摘要:
Methods and structures provide galvanic isolation for electrical systems using a wide oxide filled trench, and that allows power across the system divide with a transformer, and that transmits data at a high baud rate using an optical link. The system solution allows the integration of all of these elements onto a single semiconductor substrate in contrast to currently available galvanic isolation systems that require multiple individual silicon die that are connected by wire bonds and are relatively slow.
摘要:
A power transistor structure uses metal drain and source strips with non-uniform widths to reduce variations in current density across the power transistor structure. The reductions in current density, in turn, reduce the source-to-drain turn on resistance and maximize the overall current carrying capacity of power transistor structure.
摘要:
A multiple-layer diffusion junction capacitor structure includes multiple layers of inter-digitated P-type dopant and N-type dopant formed in a semiconductor substrate. An opening in a hard mask is formed taking care to control the angle of the sidewall using a dry, anisotropic etching process. P-type and N-type dopant are then implanted at positive and negative shallow angles, respectively, each with a different energy and dose. By utilizing the properly determined implant angles, implant energies and implant doses for each of the dopant types, a high capacitance and high density diode junction capacitor, with inter-digitated N-type and P-type regions in the vertical direction is provided.
摘要:
When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the likelihood of punch through occurring between two regions of the rectifier is substantially reduced by forming the emitter of one transistor adjacent to the tails of the sinker down region of the other transistor.
摘要:
A single junction interdigitated photodiode utilizes a stack of alternating highly doped first regions of a first conductivity type and highly doped second regions of a second conductivity type, which are formed below and contact the first regions, to collect photons. In addition, a highly doped sinker of a first conductivity type contacts each first region, and a highly doped sinker of a second conductivity type contacts each second region.
摘要:
A charge pump circuit in which at least one of the switching elements takes the form of a LVTSCR. The switching on and off of the LVTSCRs may be achieved by making use of a pulsed input and relying on the triggering and holding voltages of the LVTSCRs to switch on and off.
摘要:
When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the likelihood of punch through occurring between two regions of the rectifier is substantially reduced by forming the emitter of one transistor adjacent to the tails of the sinker down region of the other transistor.