High Resolution Label-Free Sensor
    12.
    发明申请
    High Resolution Label-Free Sensor 审中-公开
    高分辨率无标签传感器

    公开(公告)号:US20120301914A1

    公开(公告)日:2012-11-29

    申请号:US13480523

    申请日:2012-05-25

    IPC分类号: G02B6/00 C12Q1/02 G01N21/17

    摘要: An optical sensor for label-independent detection, having improved spatial resolution and reduced angular sensitivity, the sensor including: a substrate; a waveguide grating adjacent the substrate; and a waveguide coat layer adjacent or over the waveguide grating, the waveguide coat layer having a thickness (W) of from 30 nm to 300 nm, the waveguide grating having a teeth height (H) of from 0.2×W to 1×W, and for example, a waveguide core thickness (Wcore=W−H) from 5 nm to 50 nm. Also disclosed is a well-plate article, a well-plate reader system, and methods of using the well-plate and sensor articles, as defined herein.

    摘要翻译: 一种用于标签独立检测的光学传感器,具有改善的空间分辨率和降低的角度灵敏度,所述传感器包括:基板; 邻近衬底的波导光栅; 以及与所述波导光栅相邻或相邻的波导涂层,所述波导涂层的厚度(W)为30nm〜300nm,所述波导光栅的齿高(H)为0.2×W〜1×W, 例如,5nm至50nm的波导芯厚度(Wcore = W-H)。 还公开了一种井板制品,井板读取器系统以及如本文所定义的使用井板和传感器制品的方法。

    QUALITY CONTROL OF THE FRIT FOR OLED SEALING
    15.
    发明申请
    QUALITY CONTROL OF THE FRIT FOR OLED SEALING 审中-公开
    OLED密封件的质量控制

    公开(公告)号:US20100118912A1

    公开(公告)日:2010-05-13

    申请号:US12267737

    申请日:2008-11-10

    IPC分类号: G01N25/18

    CPC分类号: G01N25/72 H01L51/5246

    摘要: A method of finding defects in sealing material formed as a frame line on a glass plate includes irradiating the frame line of sealing material. A temperature of the irradiated sealing material is measured and a change of the temperature caused by a nonuniformity in sealing material is detected. Another aspect features a method of hermetically sealing a thin film device between glass plates. Sealing material is dispensed on a cover glass plate in the form of a frame line cell. The sealing material is pre-sintered onto the cover glass plate and cooled. A laser beam is moved around the frame line on the sealing material. A temperature of the sealing material contacted with the laser beam is measured. A change in the temperature (ΔT) caused by a nonuniformity in the sealing material is measured. Further aspects include a feedback process, infrared imaging and use of delta temperature data to increase sensitivity of temperature measurement data.

    摘要翻译: 在玻璃板上形成为框线的密封材料中发现缺陷的方法包括照射密封材料的框线。 测量照射的密封材料的温度,并检测由密封材料不均匀引起的温度变化。 另一方面的特征在于在玻璃板之间气密密封薄膜装置的方法。 密封材料以框线形电池的形式分配在盖玻璃板上。 将密封材料预先烧结到盖玻璃板上并冷却。 激光束围绕密封材料上的框架线移动。 测量与激光束接触的密封材料的温度。 测量由密封材料不均匀引起的温度变化(&Dgr; T)。 其他方面包括反馈过程,红外成像和使用增量温度数据以增加温度测量数据的灵敏度。

    Systems and methods for measuring the stress profile of ion-exchanged glass
    19.
    发明授权
    Systems and methods for measuring the stress profile of ion-exchanged glass 有权
    用于测量离子交换玻璃的应力分布的系统和方法

    公开(公告)号:US09140543B1

    公开(公告)日:2015-09-22

    申请号:US13463322

    申请日:2012-05-03

    IPC分类号: G06F19/00 G01L1/24 G01B11/16

    CPC分类号: G01B11/16 G01L1/242

    摘要: Systems and methods for measuring the stress profile of ion-exchanged glass are disclosed, based on the TM and TE guided mode spectra of the optical waveguide formed in the ion-exchanged glass. The method includes digitally defining from the TM and TE guided mode spectra positions of intensity extrema, and calculating respective TM and TE effective refractive indices from these positions. The method also includes calculating TM and TE refractive index profiles nTM(z) and nTE(z) using either an inverse WKB calculation or a fitting process that employs assumed functions for nTM(z) and nTE(z). The method also includes calculating the stress profile S(z)=[nTM(z)−nTE(z)]/SOC, where SOC is a stress optic coefficient for the glass substrate. Systems for performing the method are also disclosed.

    摘要翻译: 基于在离子交换玻璃中形成的光波导的TM和TE引导模式谱,公开了用于测量离子交换玻璃的应力分布的系统和方法。 该方法包括从强度极值的TM和TE引导模式光谱位置数字定义,以及从这些位置计算各自的TM和TE有效折射率。 该方法还包括使用逆WKB计算或采用nTM(z)和nTE(z)的假定函数的拟合过程来计算TM和TE折射率分布nTM(z)和nTE(z)。 该方法还包括计算应力分布S(z)= [nTM(z)-nTE(z)] / SOC,其中SOC是玻璃基板的应力光学系数。 还公开了用于执行该方法的系统。

    Methods and apparatus for packaging electronic components

    公开(公告)号:US08552642B2

    公开(公告)日:2013-10-08

    申请号:US12884335

    申请日:2010-09-17

    IPC分类号: H01J1/62 H01J63/04

    CPC分类号: H01L51/5246

    摘要: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.