公开(公告)号：US10026685B2

公开(公告)日：2018-07-17

申请号：US14866111

申请日：2015-09-25

Applicant: QUALCOMM Incorporated

Inventor： Zhang Jin ,  Tao Yang ,  Tsai-Pi Hung ,  Mohammad Farazian

IPC: H01L23/522 ,  H03H7/00 ,  H01L23/528

Abstract: Metal-oxide-metal (MOM) type capacitors include a first terminal configured to receive a first voltage, the first terminal being formed on a first dielectric layer; a first set of fingers formed on the first dielectric layer, the first set of fingers being coupled to the first terminal via a conductive trace formed on a second dielectric layer; a second terminal configured to receive second voltage, the second terminal being formed on the first dielectric layer; and a second set of fingers formed on the first dielectric layer, the second set of fingers being coupled to the second terminal, wherein the fingers of the second set are interspersed with the fingers of the first set.

公开(公告)号：US10886608B2

公开(公告)日：2021-01-05

申请号：US15922827

申请日：2018-03-15

Applicant: QUALCOMM Incorporated

Inventor： Jeong II Kim ,  Jorge Fabrega Sanchez ,  Mohammad Ali Tassoudji ,  Abbas Abbaspour-Tamijani ,  Yu-Chin Ou ,  Zhang Jin ,  Thomas Myers

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q25/00 ,  H01Q21/00 ,  H01Q13/10 ,  H01Q15/24

Abstract: In an aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a transceiver, a memory, and at least one processor coupled to the memory and configured to execute instructions stored in the memory to control the transceiver. In another aspect, an apparatus may be an apparatus for wireless communication. The apparatus for wireless communication may include a patch antenna coupled to the transceiver. The patch antenna includes a patch, a ground plane substantially located with respect to the patch, a probe feed coupled to the patch, and a slot-coupled feed configured to couple to the patch.

公开(公告)号：US10511278B2

公开(公告)日：2019-12-17

申请号：US15959824

申请日：2018-04-23

Applicant: QUALCOMM Incorporated

Inventor： Haitao Cheng ,  Zhang Jin

IPC: H03H7/42 ,  H01F27/29 ,  H01F27/42

Abstract: Certain aspects of the present disclosure are generally directed to a structure for a balanced-unbalanced (balun) transformer. For example, certain aspects of the present disclosure provide a transformer that generally includes a first winding having a first terminal coupled to an input node and a second terminal coupled to a reference potential node. The transformer may also include a first impedance coupled between a center tap of the first winding and the reference potential node, and a second winding magnetically coupled to the first winding and having a first terminal coupled to a first differential node of a differential output pair, a second terminal coupled to a second differential node of the differential output pair, and a center tap coupled to the reference potential node.

公开(公告)号：US10236573B2

公开(公告)日：2019-03-19

申请号：US15687065

申请日：2017-08-25

Applicant: QUALCOMM Incorporated

Inventor： Haitao Cheng ,  Zhang Jin

IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q1/22

Abstract: A capacitor radio frequency (RF) shielding structure may include a ground plane partially surrounding a coupling capacitor in an RF signal path. The ground plane may include a first ground plane portion extending between a positive terminal of the RF signal path and a negative terminal of the RF signal path. The ground plane may include a second ground plane portion extending between the positive terminal and the negative terminal of the RF signal path. The second ground plane portion may be opposed the first ground plane portion. The capacitor RF shielding structure may also include a patterned shielding layer electrically contacting the first ground plane portion and/or the second ground plane portion. The patterned shielding layer may electrically disconnecting a return current path over the patterned shielding layer to confine a return current to flowing over the first ground plane portion or the second ground plane portion.

公开(公告)号：US20170093362A1

公开(公告)日：2017-03-30

申请号：US14866111

申请日：2015-09-25

Applicant: QUALCOMM Incorporated

Inventor： Zhang Jin ,  Tao Yang ,  Tsai-Pi Hung ,  Mohammad Farazian

IPC: H03H7/00 ,  H01L23/528 ,  H01L23/522

CPC classification number: H01L23/5223 ,  H01L23/5227 ,  H01L23/5286 ,  H03H7/004

Abstract: Metal-oxide-metal (MOM) type capacitors include a first terminal configured to receive a first voltage, the first terminal being formed on a first dielectric layer; a first set of fingers formed on the first dielectric layer, the first set of fingers being coupled to the first terminal via a conductive trace formed on a second dielectric layer; a second terminal configured to receive second voltage, the second terminal being formed on the first dielectric layer; and a second set of fingers formed on the first dielectric layer, the second set of fingers being coupled to the second terminal, wherein the fingers of the second set are interspersed with the fingers of the first set.

公开(公告)号：US09312927B2

公开(公告)日：2016-04-12

申请号：US14076298

申请日：2013-11-11

Applicant: QUALCOMM Incorporated

Inventor： Maulin Pareshbhai Bhagat ,  Thomas Andrew Myers ,  Lan Nan ,  Zhang Jin

IPC: H04B5/00 ,  H03H7/01 ,  H01F38/14 ,  H01L23/522 ,  H01L23/64 ,  H01L49/02 ,  H01L23/66 ,  H01L27/10

CPC classification number: H04B5/0075 ,  H01F38/14 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L27/101 ,  H01L28/10 ,  H01L2223/6661 ,  H01L2223/6688 ,  H01L2924/0002 ,  H03H7/0115 ,  H01L2924/00

Abstract: A tunable guard ring for improved circuit isolation is disclosed. In an exemplary embodiment, an apparatus includes a closed loop guard ring formed on an integrated circuit and magnetically coupled by a selected coupling factor to a first inductor formed on the integrated circuit. The apparatus also includes a tunable capacitor forming a portion of the closed loop guard ring and configured to reduce magnetic field coupling from the first inductor to a second inductor.

Abstract translation: 公开了一种用于改善电路隔离的可调保护环。 在一个示例性实施例中，一种装置包括形成在集成电路上的闭环保护环，并通过选定的耦合因素磁耦合到​​形成在集成电路上的第一电感器。 该装置还包括形成闭环保护环的一部分的可调电容器，并且被配置为减小从第一电感器到第二电感器的磁场耦合。

公开(公告)号：US09130529B2

公开(公告)日：2015-09-08

申请号：US14157553

申请日：2014-01-17

Applicant: QUALCOMM Incorporated

Inventor： Ehab Ahmed Sobhy Abdel Ghany ,  Sang Hyun Woo ,  Wingching Vincent Leung ,  Zhang Jin ,  Li-Chung Chang

IPC: H04B1/18 ,  H04B1/10 ,  H03G3/30 ,  H03F3/19 ,  H03F1/26 ,  H03F3/193 ,  H03F3/68

CPC classification number: H03G3/3036 ,  H03F1/26 ,  H03F3/19 ,  H03F3/193 ,  H03F3/68 ,  H03F2200/294 ,  H03F2200/372 ,  H03F2200/451

Abstract: A device includes a first and a second low noise amplifier (LNA), a first degenerative inductance coupled between the first LNA and ground by a first ground connection, and a second degenerative inductance coupled between the second LNA and ground by a second ground connection, the first and second degenerative inductances configured to establish negative inductive coupling between the first and second degenerative inductances.

Abstract translation: 器件包括第一和第二低噪声放大器（LNA），通过第一接地连接耦合在第一LNA和地之间的第一退化电感，以及通过第二接地连接耦合在第二LNA与地之间的第二退化电感， 第一和第二退化电感被配置为在第一和第二退化电感之间建立负电感耦合。