公开(公告)号：US20190393139A1

公开(公告)日：2019-12-26

申请号：US16562288

申请日：2019-09-05

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/62 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20190387591A1

公开(公告)日：2019-12-19

申请号：US16480327

申请日：2018-01-31

Applicant: ROHM CO., LTD.

Inventor： Kenichi FUKUMOTO ,  Koji Katsura ,  Ryosuke Kanemitsu ,  Junichi ITAI ,  Nobuaki MATSUI ,  Seiji NAKASHIMA ,  Kouji Miyamoto

IPC: H05B33/08

Abstract: An LED drive circuit drives an LED module. The LED module has a light-emitting diode, and an identification unit having characteristic information relating to light-emitting characteristics of the light-emitting diode. The LED drive circuit includes a detection unit and a drive circuit. The detection unit is provided for detecting characteristic information, and generates a detection signal that corresponds to the characteristic information. The drive circuit generates drive current by a drive signal supplied according to the characteristic information based on the detection signal, and supplies the drive current to drive the light-emitting diode.

公开(公告)号：US20180218967A1

公开(公告)日：2018-08-02

申请号：US15938660

申请日：2018-03-28

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L33/64 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/50 ,  H01L23/48 ,  H01L25/075

CPC classification number: H01L23/49503 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20180076371A1

公开(公告)日：2018-03-15

申请号：US15818202

申请日：2017-11-20

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L25/075 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20140103375A1

公开(公告)日：2014-04-17

申请号：US14108922

申请日：2013-12-17

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62

CPC classification number: H01L23/49503 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

Abstract translation: 半导体发光器件包括半导体光源，围绕半导体光源的树脂封装以及固定到树脂封装的引线。 引线设置有用于接合半导体光源的裸片接合焊盘以及与裸片接合焊盘相对的暴露表面。暴露表面被暴露表面的面内方向上的树脂封装围绕。