公开(公告)号：US20150305159A1

公开(公告)日：2015-10-22

申请号：US14440016

申请日：2013-10-25

Applicant: ROHM CO., LTD.

Inventor： Hiroki YAMAMOTO ,  Keishi WATANABE ,  Hiroshi TAMAGAWA

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/40 ,  H01L22/14 ,  H01L22/20 ,  H01L23/5223 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0629 ,  H01L27/0676 ,  H01L27/101 ,  H01L27/2409 ,  H01L28/40 ,  H01L29/66189 ,  H01L29/94 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/162 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10045 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract translation: 根据本发明的片状电容器包括衬底，形成在衬底上的一对外部电极，连接在一对外部电极之间的电容器元件和连接在该对外部电极之间并与电容器并联的双向二极管 元件。 此外，根据本发明的电路组件包括根据本发明的片状电容器和具有焊盘焊接到外部电极的焊盘的安装基板，在与衬底的前表面相对的安装表面上。