Trench MOSFET and method for fabricating same
    11.
    发明授权
    Trench MOSFET and method for fabricating same 有权
    沟槽MOSFET及其制造方法

    公开(公告)号:US08536645B2

    公开(公告)日:2013-09-17

    申请号:US13031505

    申请日:2011-02-21

    IPC分类号: H01L29/78 H01L21/336

    摘要: According to an exemplary embodiment, a trench field-effect transistor (trench FET) includes a trench formed in a semiconductor substrate, the trench including a gate dielectric disposed therein. A source region is disposed adjacent the trench. The trench FET also has a gate electrode including a lower portion disposed in the trench and a proud portion extending laterally over the source region. A silicide source contact can extend vertically along a sidewall of the source region. Also, a portion of the gate dielectric can extend laterally over the semiconductor substrate. The trench FET can further include a silicide gate contact formed over the proud portion of the gate electrode.

    摘要翻译: 根据示例性实施例,沟槽场效应晶体管(沟槽FET)包括形成在半导体衬底中的沟槽,沟槽包括设置在其中的栅极电介质。 源极区域邻近沟槽设置。 沟槽FET还具有包括设置在沟槽中的下部的栅电极和在源极区域上横向延伸的骄傲部分。 硅化物源接触件可以沿着源极区域的侧壁垂直延伸。 此外,栅极电介质的一部分可以在半导体衬底上横向延伸。 沟槽FET还可以包括形成在栅电极的骄傲部分上的硅化物栅极接触。

    Trench MOSFET and Method for Fabricating Same
    12.
    发明申请
    Trench MOSFET and Method for Fabricating Same 有权
    沟槽MOSFET及其制造方法

    公开(公告)号:US20120211825A1

    公开(公告)日:2012-08-23

    申请号:US13031505

    申请日:2011-02-21

    IPC分类号: H01L29/78 H01L21/336

    摘要: According to an exemplary embodiment, a trench field-effect transistor (trench FET) includes a trench formed in a semiconductor substrate, the trench including a gate dielectric disposed therein. A source region is disposed adjacent the trench. The trench FET also has a gate electrode including a lower portion disposed in the trench and a proud portion extending laterally over the source region. A silicide source contact can extend vertically along a sidewall of the source region. Also, a portion of the gate dielectric can extend laterally over the semiconductor substrate. The trench FET can further include a silicide gate contact formed over the proud portion of the gate electrode.

    摘要翻译: 根据示例性实施例,沟槽场效应晶体管(沟槽FET)包括形成在半导体衬底中的沟槽,沟槽包括设置在其中的栅极电介质。 源极区域邻近沟槽设置。 沟槽FET还具有包括设置在沟槽中的下部的栅电极和在源极区域上横向延伸的骄傲部分。 硅化物源接触件可以沿着源极区域的侧壁垂直延伸。 此外,栅极电介质的一部分可以在半导体衬底上横向延伸。 沟槽FET还可以包括形成在栅电极的骄傲部分上的硅化物栅极接触。

    Flip chip semiconductor device and process of its manufacture
    13.
    发明授权
    Flip chip semiconductor device and process of its manufacture 有权
    倒装芯片半导体器件及其制造工艺

    公开(公告)号:US08154105B2

    公开(公告)日:2012-04-10

    申请号:US11524178

    申请日:2006-09-20

    申请人: Ling Ma

    发明人: Ling Ma

    IPC分类号: H01L29/40

    摘要: A semiconductor die and method of making it are provided. The die includes a first via extending through the entire thickness of the die and a first via electrode disposed inside the via electrically connecting an electrode at a top surface of the die with another electrode disposed at a bottom surface of the die.

    摘要翻译: 提供半导体管芯及其制造方法。 芯片包括延伸穿过芯片的整个厚度的第一通孔和布置在通孔内部的第一通孔电极,电极将模具的顶表面处的电极与设置在管芯的底表面处的另一个电极连接。

    Semiconductor device including a voltage controlled termination structure and method for fabricating same
    14.
    发明申请
    Semiconductor device including a voltage controlled termination structure and method for fabricating same 有权
    包括电压控制终端结构的半导体器件及其制造方法

    公开(公告)号:US20110163373A1

    公开(公告)日:2011-07-07

    申请号:US12655668

    申请日:2010-01-04

    IPC分类号: H01L29/78 H01L21/336

    摘要: According to one embodiment, a semiconductor device including a voltage controlled termination structure comprises an active area including a base region of a first conductivity type formed in a semiconductor body of a second conductivity type formed over a first major surface of a substrate of the second conductivity type, a termination region formed in the semiconductor body adjacent the active area and including the voltage controlled termination structure. The voltage controlled termination structure includes an electrode electrically connected to a terminal of the semiconductor device. In one embodiment, the electrode of the voltage controlled termination structure is electrically connected to a gate terminal of the semiconductor device. In one embodiment, the electrode of the voltage controlled termination structure is electrically connected to a source terminal of the semiconductor device.

    摘要翻译: 根据一个实施例,包括电压控制终端结构的半导体器件包括有源区,该有源区包括形成在第二导电类型的半导体本体中的第一导电类型的基极区,形成在第二导电性的衬底的第一主表面上 类型,形成在与有源区相邻的半导体本体中并且包括电压控制的端接结构的端接区。 电压控制终端结构包括电连接到半导体器件的端子的电极。 在一个实施例中,电压控制终端结构的电极电连接到半导体器件的栅极端子。 在一个实施例中,电压控制终端结构的电极电连接到半导体器件的源极端子。

    Method of adjusting recession of an element of a slider
    15.
    发明授权
    Method of adjusting recession of an element of a slider 有权
    调整滑块元件的凹陷的方法

    公开(公告)号:US07549212B2

    公开(公告)日:2009-06-23

    申请号:US11685429

    申请日:2007-03-13

    IPC分类号: G11B5/127

    摘要: A method and apparatus are provided for adjusting recession of an element, such as a pole tip, in a transducer structure formed in a plurality of thin film layers on an edge of a slider. A pre-stressed structure is formed as part of the plurality of thin film layers on the edge of the slider. The pre-stressed structure has a level of material stress. The recession is measured relative to a bearing surface of the slider, and then the level of material stress is adjusted as a function of the measured to effect a corresponding change in the recession.

    摘要翻译: 提供一种方法和装置,用于调节在滑块的边缘上形成在多个薄膜层中的换能器结构中的元件(例如极尖)的凹陷。 在滑块的边缘上形成预应力结构作为多个薄膜层的一部分。 预应力结构具有材料应力水平。 相对于滑块的支承表面测量凹陷,然后根据所测量的材料应力的水平来调节以实现经济衰退的相应变化。

    Buck Converter Power Package
    17.
    发明申请
    Buck Converter Power Package 有权
    降压转换器电源包

    公开(公告)号:US20140118032A1

    公开(公告)日:2014-05-01

    申请号:US13666854

    申请日:2012-11-01

    IPC分类号: H02M3/155

    摘要: One exemplary disclosed embodiment comprises a semiconductor package including a vertical conduction control transistor and a vertical conduction sync transistor. The vertical conduction control transistor may include a control source, a control gate, and a control drain that are all accessible from a bottom surface, thereby enabling electrical and direct surface mounting to a support surface. The vertical conduction sync transistor may include a sync drain on a top surface, which may be connected to a conductive clip that is coupled to the support surface. The conductive clip may also be thermally coupled to the control transistor. Accordingly, all terminals of the transistors are readily accessible through the support surface, and a power circuit, such as a buck converter power phase, may be implemented through traces of the support surface. Optionally, a driver IC may be integrated into the package, and a heatsink may be attached to the conductive clip.

    摘要翻译: 一个示例性的公开的实施例包括包括垂直导通控制晶体管和垂直导通同步晶体管的半导体封装。 垂直传导控制晶体管可以包括控制源,控制栅极和控制漏极,其都可从底表面接近,从而使电和直接表面安装到支撑表面。 垂直导通同步晶体管可以包括顶表面上的同步漏极,其可连接到耦合到支撑表面的导电夹子。 导电夹子也可以热耦合到控制晶体管。 因此,晶体管的所有端子容易通过支撑表面接近,并且诸如降压转换器电源相的功率电路可以通过支撑表面的迹线来实现。 可选地,驱动器IC可以集成到封装中,并且散热器可以附接到导电夹子。

    MATRIX VIEW OF ITEMS
    19.
    发明申请
    MATRIX VIEW OF ITEMS 审中-公开
    MATRIX查看项目

    公开(公告)号:US20110161354A1

    公开(公告)日:2011-06-30

    申请号:US12937664

    申请日:2008-04-25

    申请人: Ling Ma

    发明人: Ling Ma

    IPC分类号: G06F17/30 G06F3/048

    CPC分类号: G06F16/9038

    摘要: Apparatus, systems, and methods may operate to present a plurality of searched items by a plurality of points in a matrix view, which includes a first axis and a second axis, respectively representing a price attribute and one of other attributes of the plurality of items. Additional apparatus, systems, and methods are disclosed.

    摘要翻译: 装置,系统和方法可以操作以通过矩阵视图中的多个点呈现多个搜索项目,该矩阵视图包括分别表示价格属性和多个项目的其他属性之一的第一轴和第二轴 。 公开了附加装置,系统和方法。