公开(公告)号：USD834769S1

公开(公告)日：2018-11-27

申请号：US29585910

申请日：2016-11-30

申请人： Jian Wen

设计人： Jian Wen

公开(公告)号：US08713057B2

公开(公告)日：2014-04-29

申请号：US13340335

申请日：2011-12-29

申请人： Yan Qi ,  Yu Xu ,  Olli Pekka Kostamaa ,  Jian Wen

发明人： Yan Qi ,  Yu Xu ,  Olli Pekka Kostamaa ,  Jian Wen

IPC分类号： G06F17/30

CPC分类号： G06F17/30079 ,  G06F17/30545 ,  G06F17/30557

摘要： Techniques for data assignment from an external distributed file system (DFS) to a database management system (DBMS) are provided. Data blocks from the DFS are represented as first nodes and access module processors of the DBMS are represented as second nodes. A graph is produced with the first and second nodes. Assignments are made for the first nodes to the second nodes based on evaluation of the graph to integrate the DFS with the DBMS.

摘要翻译： 提供了从外部分布式文件系统（DFS）到数据库管理系统（DBMS）的数据分配技术。 来自DFS的数据块被表示为第一节点，并且DBMS的访问模块处理器被表示为第二节点。 使用第一和第二节点生成图形。 基于图的评估将第一个节点分配给第二个节点，以将DFS与DBMS集成。

公开(公告)号：US20130049181A1

公开(公告)日：2013-02-28

申请号：US13220898

申请日：2011-08-30

申请人： Jian Wen ,  Darrel R. Frear ,  William G. McDonald

发明人： Jian Wen ,  Darrel R. Frear ,  William G. McDonald

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49544 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.

摘要翻译： 提供了具有增强的模具锁定特征的半导体器件引线框架。 引线框架具有沿着标志边缘的可弯曲边缘特征的标志。 每个边缘特征被成形为抵抗将模具材料封装在边缘特征的平面内的运动。 通过弯曲边缘特征的一部分，在多个平面中提供了标志的改进的模具锁定。

公开(公告)号：US07815802B2

公开(公告)日：2010-10-19

申请号：US11885181

申请日：2006-02-28

申请人： Jian Wen ,  Jerome P. Ferrance ,  James P. Landers

发明人： Jian Wen ,  Jerome P. Ferrance ,  James P. Landers

IPC分类号： B01D15/08

CPC分类号： B01J20/103 ,  B01J20/26 ,  B01J20/264 ,  B01J20/28014 ,  B01J20/28042 ,  B01J20/3278 ,  B01J2220/58 ,  B01J2220/82

摘要： The present invention relates to the fabrication of a grafted, UV photo-polymerized silica-based monolithic column and the use of such column for the extraction of DNA. In one embodiment, a method is provided for fabricating a silica-based monolithic column, wherein a vessel is filled with a polymerization mixture that is formed into monolithic solid phase for DNA extraction through in situ photo-polymerization.

摘要翻译： 本发明涉及一种接枝的UV光聚合二氧化硅基整体柱的制造，以及这种柱用于提取DNA的用途。 在一个实施方案中，提供了一种用于制造二氧化硅基整体柱的方法，其中容器填充有聚合混合物，其通过原位光聚合形成用于DNA提取的整体固相。

公开(公告)号：US07147966B2

公开(公告)日：2006-12-12

申请号：US10305804

申请日：2002-11-27

申请人： Zhifeng Ren ,  Jian Wen ,  Jinghua Chen ,  Zhongping Huang ,  Dezhi Wang

发明人： Zhifeng Ren ,  Jian Wen ,  Jinghua Chen ,  Zhongping Huang ,  Dezhi Wang

IPC分类号： H01M4/02 ,  H01M4/96 ,  B05D5/12 ,  C25B11/12

CPC分类号： H01G9/155 ,  B82Y10/00 ,  B82Y30/00 ,  H01L51/0048 ,  H01L51/0052 ,  H01M4/133 ,  H01M4/137 ,  H01M4/366 ,  H01M4/583 ,  H01M4/602 ,  H01M4/663 ,  H01M4/96 ,  Y02E60/13 ,  Y10S977/742 ,  Y10S977/857 ,  Y10S977/948

摘要： The present invention provides conductive carbon nanotube (CNT) electrode materials comprising aligned CNT substrates coated with an electrically conducting polymer, and the fabrication of electrodes for use in high performance electrical energy storage devices. In particular, the present invention provides conductive CNTs electrode material whose electrical properties render them especially suitable for use in high efficiency rechargeable batteries. The present invention also provides methods for obtaining surface modified conductive CNT electrode materials comprising an array of individual linear, aligned CNTs having a uniform surface coating of an electrically conductive polymer such as polypyrrole, and their use in electrical energy storage devices.

公开(公告)号：US20060043649A1

公开(公告)日：2006-03-02

申请号：US10987257

申请日：2004-11-12

申请人： Zhifen Ren ,  Jian Wen ,  Jing Lao ,  Wenzhi Li

发明人： Zhifen Ren ,  Jian Wen ,  Jing Lao ,  Wenzhi Li

IPC分类号： B28B3/00 ,  B28B1/00

CPC分类号： B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B2202/06 ,  C04B35/62847 ,  C04B35/6286 ,  C04B35/62863 ,  C04B35/62892 ,  C04B35/62897 ,  C04B2235/5268 ,  C04B2235/5288 ,  D01F9/12 ,  D01F11/12 ,  Y10S977/752 ,  Y10T428/25 ,  Y10T428/2913 ,  Y10T428/2918 ,  Y10T428/292 ,  Y10T428/2975 ,  Y10T428/2982 ,  Y10T428/30

摘要： The present invention relates generally to reinforced carbon nanotubes, and more particularly to reinforced carbon nanotubes having a plurality of microparticulate carbide or oxide materials formed substantially on the surface of such reinforced carbon nanotubes composite materials. In particular, the present invention provides reinforced carbon nanotubes (CNTs) having a plurality of boron carbide nanolumps formed substantially on a surface of the reinforced CNTs that provide a reinforcing effect on CNTs, enabling their use as effective reinforcing fillers for matrix materials to give high-strength composites. The present invention also provides methods for producing such carbide reinforced CNTs.

公开(公告)号：US06311033B1

公开(公告)日：2001-10-30

申请号：US09503098

申请日：2000-02-11

申请人： Jian Wen ,  Hazen Hoyt, III

发明人： Jian Wen ,  Hazen Hoyt, III

IPC分类号： G03G1500

CPC分类号： G03G15/0152 ,  G03G15/0163 ,  G03G2215/017 ,  G03G2215/0497

摘要： In the embodiment disclosed in the specification, an electrophotographic exposure and development arrangement has a flexible transparent photoreceptor belt driven between two support rollers and along four printing stations at each of which the photosensitive surface of the photoreceptor is charged, exposed to a light image corresponding to a selected color, and developed with toner of the corresponding color to produce a composite multicolor image which is transferred to a substrate and subsequently fixed on the substrate. At each printing station an exposure unit has a curved belt support surface which is engaged by the photoreceptor belt passing through the printing station between the exposure location and a development location with a curvature and length selected to minimize the effect of ripples or irregularities in the position of the photosensitive surface of the photoreceptive belt resulting from a set taken by the photoreceptor belt when held stationery against a supporting number.

摘要翻译： 在本说明书中公开的实施例中，电子照相曝光和显影装置具有在两个支撑辊之间驱动的柔性透明感光带，并且沿着四个印刷台，其中感光体的感光表面被充电，暴露于对应于 选择的颜色，并用相应颜色的调色剂显影以产生复合多色图像，其转印到基底上并随后固定在基底上。 在每个印刷站处，曝光单元具有弯曲的带支撑表面，该弯曲的带支撑表面通过曝光位置与显影位置之间的感光带接合，所述显影位置具有选定的曲率和长度，以最小化位置上的波纹或不规则性的影响 感光带的感光表面由保持的文具上的感光带所带的组合抵抗支持数量而产生。

公开(公告)号：USD923327S1

公开(公告)日：2021-06-29

申请号：US29702457

申请日：2019-08-20

申请人： Jian Wen

设计人： Jian Wen

公开(公告)号：USD896510S1

公开(公告)日：2020-09-22

申请号：US29697913

申请日：2019-07-12

申请人： Jian Wen

设计人： Jian Wen

公开(公告)号：US20140264793A1

公开(公告)日：2014-09-18

申请号：US13794841

申请日：2013-03-12

申请人： Kai Yun Yow ,  Alexander M. Arayata ,  Jian Wen

发明人： Kai Yun Yow ,  Alexander M. Arayata ,  Jian Wen

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49565 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06163 ,  H01L2224/06165 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.

摘要翻译： 半导体封装包括引线框架，半导体管芯，在管芯和引线框架之间提供电连接的接合线以及封装引线框架，管芯和接合线的模具化合物。 引线框架包括间隔开的第一和第二框架构件，每个具有内周边缘和相对的外周边缘，间隔开的引线焊盘，设置在第一和第二框架构件的内周边缘之间，以及导电引线设置在靠近外部 每个第一和第二框架构件的周边边缘。 芯片安装在引线板上。