摘要:
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要:
Method and system of a detachable nose faceplate. At least some of the illustrative embodiments are methods including orientating a faceplate having an aperture therein, orientating a detachable nose in one of a plurality of possible orientations, aligning the detachable nose with the faceplate, and attaching the detachable nose to the faceplate.
摘要:
The invention relates generally to a device designed for the comfort of a pet or other small animal during travel. More specifically, the present invention relates to a device that can function a pet carrier designed and sized for travel on a public or private transportation vehicle that comprises one or more reversibly expandable and collapsible sections that, when expanded, increase the interior space of the pet carrier and, when collapsed, are substantially flush with the sides or top of the carrier to which they are attached.
摘要:
Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.
摘要:
A Rapid Single-Flux-Quantum (“RSFQ”) encoder output interface device is provided. The RSFQ output interface device includes a variable phase multi-junction voltage controlled oscillator (VCO) that provides multiple clock signals having similar frequencies based on a DC bias current setting. The multiple clock signals are phase shifted from one other based on a flux bias current setting. The clock signals are then mixed together according to logic states of a data stream to provide an encoded output data stream. The encoded output data stream can be in a phase shifted keying (PSK) format. The PSK format can be provided in binary, quadrature or other PSK formats. The Single-Flux-Quantum (SFQ) voltage pulses of the encoded output data stream are converted to a voltage level appropriate for transmitting over a wire.
摘要:
A superconducting infrared photodetector employing SQUID (Superconducting Quantum Interference Device) measurement of fluxon flow in thin superconducting granular films to provide sensitive, low-noise detection of infrared radiation. The superconducting infrared photodetector includes a plurality of superconducting detector elements connected in parallel or series, means for supplying a bias current to the detector elements, and a digital or analog SQUID readout circuit. Each detector element includes a thin granular film of superconducting material which forms a randomly connected array of weakly coupled superconductors. The weakly coupled superconductors promote the formation of oppositely-polarized fluxons, which are driven to opposite sides of the film when subjected to the bias current. Incident radiation causes an increase in this fluxon flow, generating a voltage change. The voltage change is measured by the SQUID readout circuit to provide a sensitive, low-noise measurement of the amount of radiation incident on the detector elements.
摘要:
An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
摘要:
Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.
摘要:
Packaged semiconductor light emitting device are provided including a reflector having a lower sidewall portion defining a reflective cavity. A light emitting device is positioned in the reflective cavity. A first quantity of cured encapsulant material having a first index of refraction is provided in the reflective cavity including the light emitting device. A second quantity of cured encapsulant material having a second index of refraction, different from the first index of refraction, is provided on the first quantity of cured encapsulant material. The first and second index of refraction are selected to provide a buried lens in the reflective cavity.