公开(公告)号：US20150054692A1

公开(公告)日：2015-02-26

申请号：US14463516

申请日：2014-08-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Ryong Choi ,  Hyung Jin Jeon ,  Sung Yong An ,  Kang Heon Hur ,  Jung Wook Seo

IPC: H01Q1/24 ,  H01Q7/06 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  H01Q1/44 ,  H01Q7/06

Abstract: There is provided an antenna module formed to correspond to an opening formed in a frame, including: a coil conductor part disposed in the opening of the frame when viewed on a plane; and a substrate including the coil conductor part formed thereon. The coil conductor part is wound outside a non-conductive portion of the substrate.

Abstract translation: 提供了一种形成为对应于形成在框架中的开口的天线模块，包括：当在平面上观察时设置在框架的开口中的线圈导体部分; 以及包括形成在其上的线圈导体部的基板。 线圈导体部分被卷绕在衬底的非导电部分的外部。

公开(公告)号：US20140042604A1

公开(公告)日：2014-02-13

申请号：US13673910

申请日：2012-11-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jin Jeon ,  Jong Yun Lee ,  Kyoung Moo Harr

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L25/0652 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Disclosed herein is a three-dimensional (3D) semiconductor package. The 3D semiconductor package includes a printed circuit board, a main interposer that is formed on the printed circuit board, a semiconductor device that is formed on the main interposer, and a support interposer that is disposed on the same plane as a plane of the semiconductor device, or disposed between the main interposer and the semiconductor device. Here, each of the main interposer, the semiconductor device, and the support interposer may include a through-via formed based on a thickness direction of the printed circuit board.

Abstract translation: 本文公开了三维（3D）半导体封装。 3D半导体封装包括印刷电路板，形成在印刷电路板上的主要内插器，形成在主插入件上的半导体器件和与半导体器件的平面配置在同一平面上的支撑插入器 或者设置在主插入器和半导体器件之间。 这里，主插入器，半导体器件和支撑插入件中的每个可以包括基于印刷电路板的厚度方向形成的通孔。

公开(公告)号：US20130029031A1

公开(公告)日：2013-01-31

申请号：US13632614

申请日：2012-10-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jin Jeon ,  Jong In Ryu ,  Seung Wan Shin ,  Seon Hee Moon ,  Young Do Kweon ,  Seung Wook Park

IPC: H05K3/00

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2225/06572 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/0979 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.

Abstract translation: 一种用于制造插入件的方法包括在包括树脂或陶瓷的绝缘板中形成通孔; 同时在绝缘板的顶表面上形成用于第一上再分配层的抗蚀剂，以及在绝缘板的底表面上的下再分布层的电阻器; 电镀铜以填充通孔并同时沿着设计的电路图形形成第一上再分配层和下再分布层; 以及形成第一上保护层和下保护层以暴露所述第一上再分布层的一部分和所述下再分布层的一部分。

公开(公告)号：US11935682B2

公开(公告)日：2024-03-19

申请号：US16566227

申请日：2019-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jin Jeon ,  Seon Woo Oh ,  Soon Kwang Kwon

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/292 ,  H01F27/32 ,  H01F41/041 ,  H01F2027/2809

Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.

公开(公告)号：US11342110B2

公开(公告)日：2022-05-24

申请号：US16031216

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Woo Oh ,  Hyung Jin Jeon ,  Jung Wook Seo ,  Young Seuck Yoo ,  Byoung Hwa Lee ,  Kwang Sun Choi ,  Kun Ho Koo

IPC: H01F27/29 ,  H01F27/06 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04 ,  H01F1/37

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.