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Patent Agency Ranking
公开(公告)号：US20170301453A1
公开(公告)日：2017-10-19
申请号：US15232325
申请日：2016-08-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Hui JO , Han LEE , Mi Sun HWANG , Jeong Min CHO , Myung Sam KANG , Seok Hwan AHN , Tae Hoon KIM
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/041 , H01F2027/2809
Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.
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公开(公告)号：US20140017397A1
公开(公告)日：2014-01-16
申请号：US14030579
申请日：2013-09-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Sun HWANG , Jae Joon Lee , Myung Sam Kang
IPC: H05K3/10
CPC classification number: H05K3/10 , H05K1/0271 , H05K1/09 , H05K3/4602 , H05K2201/0338 , H05K2201/0352 , H05K2201/068 , H05K2201/09136
Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.
Abstract translation: 制造印刷电路板的方法包括：布置芯层，其中在多个绝缘构件之间布置有具有不同热膨胀系数的金属层的至少两层的至少两层的弯曲防止部分; 形成电路图案，以便在芯层的内部和芯层的外表面中的至少一个上具有期望的图案; 以及形成包括露出所述芯层上的电路图案的开口部分的绝缘层。
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公开(公告)号：US20230354513A1
公开(公告)日：2023-11-02
申请号：US18217791
申请日：2023-07-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung BYUN , Mi Sun HWANG , Jung Soo KIM , Jin Won LEE , Duck Young MAENG
CPC classification number: H05K1/0298 , H05K1/036 , H05K1/185 , H05K1/115 , H05K2201/0141 , H05K1/0366 , H05K1/111
Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.
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公开(公告)号：US20210185819A1
公开(公告)日：2021-06-17
申请号：US16820172
申请日：2020-03-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Sun HWANG , Deok Man KANG , Jun Hyeong JANG
IPC: H05K1/18
Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
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公开(公告)号：US20210183774A1
公开(公告)日：2021-06-17
申请号：US16814197
申请日：2020-03-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung BYUN , Chang Hwa PARK , Sang Ho JEONG , Je Sang PARK , Mi Sun HWANG , Yong Duk LEE , Jin Won LEE , Yeo Il PARK
IPC: H01L23/538 , H01L23/31 , H01L25/065 , H01L23/522
Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.
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