公开(公告)号：US20170309606A1

公开(公告)日：2017-10-26

申请号：US15489031

申请日：2017-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan LEE ,  Kundae YEOM ,  Jongho LEE ,  Hogeon SONG

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16141 ,  H01L2225/06517 ,  H01L2225/06572

Abstract: In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.

公开(公告)号：US20170131374A1

公开(公告)日：2017-05-11

申请号：US15347110

申请日：2016-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Sang-cheon CHOI ,  Jongho LEE ,  Jeehun KIM ,  Yoonho NAM

IPC: G01R33/48 ,  G01R33/567

CPC classification number: G01R33/4828 ,  G01R33/482 ,  G01R33/561 ,  G01R33/5611 ,  G01R33/5616

Abstract: A magnetic resonance imaging (MRI) apparatus, including a scanner configured to emit at least one radio frequency (RF) signal to an object during one repetition time (TR), and to receive echo signals emitted from the object; and a controller configured to transmit one or more control signals to the scanner to control the scanner, wherein the controller may be further configured to control the scanner to emit an RF excitation pulse and a refocusing pulse to the object during the one TR, control the scanner to receive a first echo signal corresponding to a first line of a k-space before an echo time (TE), and to receive a second echo signal corresponding to a second line of the k-space after the TE, and reconstruct a magnetic resonance (MR) image based on the k-space.

公开(公告)号：US20140210467A1

公开(公告)日：2014-07-31

申请号：US14167152

申请日：2014-01-29

Applicant: The Trustees of the University of Pennsylvania ,  Samsung Electronics Co., Ltd.

Inventor： Jin Young HWANG ,  Joon Soo KIM ,  Jae Moon JO ,  Yang Lim CHOI ,  Jongho LEE

IPC: G01R33/56

CPC classification number: G01R33/56 ,  G01R33/5602 ,  G01R33/5615 ,  G01R33/56536

Abstract: An MRI system acquires a susceptibility-weighted image by acquiring a first RF echo signal in a first echo time for providing an image exclusive of susceptibility-weighting and acquiring a second RF echo signal in a second echo time longer than the first echo time for providing an image including susceptibility-weighting. A compensation gradient field is applied for compensating for field inhomogeneity and in response, a third RF echo signal is acquired in a third echo time longer than the second echo time. First, second and third images are generated in response to data derived from the first, second and third RF echo signals respectively and data of the first, second and third images is combined to provide image data representing an image compensating for magnetic resonance signal attenuation in the second image.

Abstract translation: MRI系统通过在第一回波时间中获取第一RF回波信号来获取敏感度加权图像，以提供除了敏感度加权之外的图像，并且以比第一回波时间长的第二回波时间获取第二RF回波信号，以提供 包括敏感度加权的图像。 应用补偿梯度场来补偿场不均匀性，作为响应，在比第二回波时间长的第三回波时间中获取第三RF回波信号。 首先，响应于分别从第一，第二和第三RF回波信号导出的数据产生第二和第三图像，并且组合第一，第二和第三图像的数据以提供表示补偿磁共振信号衰减的图像的图像数据 第二个图像。

公开(公告)号：US20240236509A9

公开(公告)日：2024-07-11

申请号：US18402321

申请日：2024-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjae JI ,  Sanghyun YEO ,  Jaeseok LEE ,  Jihyung HA ,  Moonkyu KIM ,  Jaegyeong MA ,  Byungduck SEO ,  Sunghoo LEE ,  Jongho LEE ,  Seungcheol JEONG

IPC: H04N23/81 ,  F24C15/00 ,  H04N23/52

CPC classification number: H04N23/811 ,  F24C15/006 ,  H04N23/52 ,  F24C14/02

Abstract: A cooking apparatus includes a case, a cooking chamber formed inside the case, a camera configured to obtain an image inside of the cooking chamber, a transparent member, a camera cooling fan configured to blow air toward the camera, a motor configured to rotate the camera cooling fan, and a controller to be electrically connected to the camera and the motor. The controller is configured to operate the camera to obtain a first image inside of the cooking chamber, configured to identify foreign substance-related information of a lens of the camera or the transparent member based on the first image, and configured to control an operation of the motor to perform a cleaning mode, in which the camera cooling fan is rotated at a first rotation speed for a first rotation time, based on the determining that the foreign substance is present.

公开(公告)号：US20230178518A1

公开(公告)日：2023-06-08

申请号：US17889053

申请日：2022-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Raehyung DO ,  Seunghyun GO ,  Jungsik LEE ,  Jongho LEE ,  Younghun CHEONG ,  Cheolsoo HAN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2224/48227 ,  H01L2224/49176 ,  H01L2224/4911 ,  H01L2224/49421 ,  H01L2224/49422 ,  H01L2224/49426 ,  H01L2225/06562 ,  H01L2224/49052 ,  H01L2224/48091 ,  H01L2224/05624 ,  H01L24/05 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85484 ,  H01L2224/85466 ,  H01L24/85 ,  H01L2224/45144 ,  H01L24/45

Abstract: A semiconductor package comprising a substrate including substrate pads on a top surface thereof, a first upper semiconductor chip on the substrate and including conductive chip pads, and bonding wires coupled to the substrate pads and the first upper semiconductor chip. The bonding wires include first and second bonding wires. The substrate has a first region between the conductive chip pads and the substrate pads, and a second region between the first region and the substrate pads. The second bonding wire has a maximum vertical level on the first region of the substrate. On the first region of the substrate, the first bonding wire is at a level higher than that of the second bonding wire. On the second region of the substrate, the second bonding wire is at a level higher than that of the first bonding wire.

公开(公告)号：US20220324730A1

公开(公告)日：2022-10-13

申请号：US17727259

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungha PARK ,  Junggeun LEE ,  Wanku KANG ,  Jongho LEE

IPC: C02F1/461 ,  G01N33/18 ,  C02F1/467 ,  C02F1/00

Abstract: A sterilized water generator to control some of a plurality of electrolysis modules not to perform electrolysis on water brought into the sterilized water generator. The sterilized water generator includes a water inlet pipe through which water flows in; a water outlet pipe through which sterilized water flows out; a plurality of electrolysis modules arranged in parallel between the water inlet pipe and the water outlet pipe and configured to turn the water brought in through the water inlet pipe to the sterilized water; and a controller configured to control a forward voltage not to be applied to a first electrolysis module of the plurality of electrolysis modules, control the forward voltage to be applied to a second electrolysis module of the plurality of electrolysis modules, and change electrolysis modules corresponding to the first and second electrolysis modules of the plurality of electrolysis modules based on a lapse of time.

公开(公告)号：US20220228310A1

公开(公告)日：2022-07-21

申请号：US17577102

申请日：2022-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjin CHO ,  Kanghyun LEE ,  Byoungyull YANG ,  Jongho LEE ,  Sanggyu JUNG

IPC: D06F39/10 ,  D06F39/08 ,  B01D35/02 ,  D06F23/02 ,  B01D29/23 ,  B01D29/58 ,  B01D35/30 ,  B01D37/04

Abstract: A filter device includes a case, an external filter disposed inside the case to filter substances introduced into the case and configured to be movable with respect to the case, and an internal filter disposed inside the external filter to filter the substances introduced into the case and configured to be movable with respect to the external filter.

公开(公告)号：US20220093673A1

公开(公告)日：2022-03-24

申请号：US17306267

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Raehyung DO ,  Jongho LEE ,  Kundae YEOM

IPC: H01L27/146 ,  H05K3/40 ,  H05K1/03 ,  H04N5/374

Abstract: An image sensor package includes a circuit board, an image sensor chip on the circuit board, a stack bump structure on the image sensor chip, a bonding wire connecting the circuit board to the stack bump structure, a dam element on the image sensor chip and covering both the stack bump structure and the bonding wire, and a molding element contacting the dam element on the circuit board and covering both the image sensor chip and the bonding wire.

公开(公告)号：US20210183816A1

公开(公告)日：2021-06-17

申请号：US16936882

申请日：2020-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonho JUN ,  Un-Byoung KANG ,  Sunkyoung SEO ,  Jongho LEE ,  Young Kun JEE

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package may include first and second substrates, which are vertically stacked, a semiconductor device layer on a bottom surface of the second substrate to face a top surface of the first substrate, upper chip pads and an upper dummy pad on the top surface of the first substrate, penetration electrodes, which each penetrate the first substrate and are connected to separate, respective upper chip pads, lower chip pads on a bottom surface of the semiconductor device layer and electrically connected to separate, respective upper chip pads, and a lower dummy pad on the bottom surface of the semiconductor device layer and electrically isolated from the upper dummy pad. A distance between the upper and lower dummy pads in a horizontal direction that is parallel to the first substrate may be smaller than a diameter of the lower dummy pad.

公开(公告)号：US20200180980A1

公开(公告)日：2020-06-11

申请号：US16705745

申请日：2019-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho LEE ,  Kookjeong SEO ,  Hyesoon YANG ,  Jungsoo LIM

IPC: C02F1/44 ,  C02F1/00 ,  B01D61/02 ,  B01D61/12

Abstract: Disclosed is a water purifier. The water purifier includes a water quality sensor configured to measure quality of water that is suppled from a water supply source, a first filter configured to filter by a first method, a second filter configured to filter by a second method, a flow path shifting valve configured to selectively supply water that is supplied from the water supply source to the first filter or the second filter, and a processor configured to control the flow path shifting valve based on a water quality value that is measured by the sensor.