公开(公告)号：US11934853B2

公开(公告)日：2024-03-19

申请号：US17263591

申请日：2019-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungseok Lee ,  Jingu Kang ,  Kihun Heo ,  Hyojong Kim ,  Hakryoul Kim ,  Hyunjoon Kim ,  Donggyu Ahn ,  Haewook Lee ,  Kwanhee Jeong ,  Mooyoung Kim ,  Minjung Kim

IPC: G06F9/455

CPC classification number: G06F9/45504 ,  G06F9/45558 ,  G06F2009/45562 ,  G06F2009/45583 ,  G06F2009/45591

Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.

公开(公告)号：US11880700B2

公开(公告)日：2024-01-23

申请号：US17263591

申请日：2019-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungseok Lee ,  Jingu Kang ,  Kihun Heo ,  Hyojong Kim ,  Hakryoul Kim ,  Hyunjoon Kim ,  Donggyu Ahn ,  Haewook Lee ,  Kwanhee Jeong ,  Mooyoung Kim ,  Minjung Kim

IPC: G06F9/455

CPC classification number: G06F9/45504 ,  G06F9/45558 ,  G06F2009/45562 ,  G06F2009/45583 ,  G06F2009/45591

Abstract: Various embodiments of the present invention relate to a method for managing a memory in a Java execution environment, and an electronic device for performing same, and an electronic device may comprise a processor and a memory electrically connected to the processor, wherein: the memory is configured to store multiple Java application programs, and stores instructions that, when executed, cause the processor to execute a virtual machine configured to execute at least one Java application stored in the memory; and when generation of an object is detected during execution of the Java application, the virtual machine executed by the processor generates a reference for the generated object, identifies an application, which has generated the object by a threshold or more, on the basis of the generated reference, and provides information on the identified application to the processor. Other embodiments may also be possible.

公开(公告)号：US20220285328A1

公开(公告)日：2022-09-08

申请号：US17648424

申请日：2022-01-20

Applicant: Samsung Electronics Co., LTD

Inventor： DONGKYU KIM ,  Daeho Lee ,  Seokhyun Lee ,  Minjung Kim ,  Taewon Yoo

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a lower semiconductor chip disposed on a lower redistribution substrate, lower solder patterns disposed between the lower redistribution substrate and the lower semiconductor chip, conductive structures disposed on the lower redistribution substrate, a lower molding layer disposed on the lower redistribution substrate and covering a top surface of the lower semiconductor chip, an upper redistribution substrate disposed on the lower molding layer and electrically connected to the conductive structures, an upper semiconductor chip disposed on the upper redistribution substrate, upper solder patterns disposed between the upper redistribution substrate and the upper semiconductor chip, and an upper molding layer disposed on the upper redistribution substrate and covering a sidewall of the upper semiconductor chip. The number of the conductive structures is greater than that of chip pads of the upper semiconductor chip.

公开(公告)号：US20220165778A1

公开(公告)日：2022-05-26

申请号：US17363931

申请日：2021-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minjung Kim ,  Dongkyu Kim ,  Kyounglim Suk ,  Jaegwon Jang ,  Hyeonjeong Hwang

IPC: H01L27/146

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 μm to 1 mm. The second distance is equal to or less than 0.1 mm.

公开(公告)号：US11265033B2

公开(公告)日：2022-03-01

申请号：US16851940

申请日：2020-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shinhyuck Kang ,  Hyunil An ,  Wookwang Lee ,  Jaebyeong Han ,  Minjung Kim

IPC: H04B1/18 ,  H04B1/00 ,  H04R1/10 ,  G06F3/16 ,  H04M1/72409

Abstract: A method of operating the electronic device is provided. The electronic device includes a universal serial bus (USB) connector connectable to an external electronic device including a radio reception circuit configured to receive a radio signal and to convert the received radio signal into a digital signal, and a signal processing circuit configured to generate a sound corresponding to the digital signal based on a control signal transmitted by the electronic device, and a processor. The processor may be configured to: receive information of the external electronic device in response to detecting that the external electronic device is connected to the USB connector, determine whether the external electronic device is capable of processing the radio signal based on the information of the external electronic device, activate a radio framework configured to control a radio reception function of the external electronic device in response to identifying that the external electronic device is capable of processing the radio signal, and control the external electronic device based on the operation of the USB framework, which receives the control signal generated by the radio framework. In addition, various embodiments are possible.

公开(公告)号：US11157095B2

公开(公告)日：2021-10-26

申请号：US16724805

申请日：2019-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun Ok Jung ,  Dongwook Kim ,  Minjung Kim ,  Sookjin Kim ,  Jin-Gil Yang ,  Inji Jin

IPC: G06F3/0354 ,  G16H10/65 ,  A61B5/00 ,  A61B5/0245 ,  A61B5/0205 ,  G06F3/01 ,  G16H40/63 ,  G06F1/26 ,  G06F3/038 ,  G16H50/20 ,  A61B5/01 ,  A61B5/11 ,  A61B5/021 ,  A61B5/024 ,  A61B5/318

Abstract: An electronic device, accessory device and method using the same are disclosed herein. The accessory device is stowable in the electronic device, and includes at least a first sensor, a second sensor, a communication interface and a processor. The method includes receiving, through the communication interface, information from the electronic device corresponding to an application executed in the electronic device, in response to the received information, obtaining the first data through the first sensor when the received information is a first information and obtaining the second data through the second sensor when the information is a second information, and transmitting, to the electronic device, data based on at least one of the first data and the second data.

公开(公告)号：US20210115334A1

公开(公告)日：2021-04-22

申请号：US16946495

申请日：2020-06-24

Applicant: Samsung Electronics Co., Ltd. ,  Dongwoo Fine-Chem Co., Ltd.

Inventor： Kihun Song ,  Jungmin Oh ,  Hyosan Lee ,  Hyojoong Yoon ,  Minjung Kim ,  Jongwook Baek

IPC: C09K13/06 ,  H01L21/3213 ,  H01L27/108

Abstract: Metal-containing film etchant compositions may include hydrogen peroxide (H2O2), a phosphoric acid compound, a heterocyclic organic amine compound including at least one heteroatom in a ring, and water. Manufacturing methods of an integrated circuit (IC) may include performing a dry etch process on a conductive structure including a metal nitride film and a metal film to form a conductive pattern intermediate product and performing a wet etch process on the conductive pattern intermediate product using an etching atmosphere providing a higher etch selectivity with respect to the metal nitride film than the metal film. The etching atmosphere may include an etchant composition including hydrogen peroxide, a phosphoric acid compound, a heterocyclic organic amine compound including at least one heteroatom in a ring, and water.

公开(公告)号：US12237256B2

公开(公告)日：2025-02-25

申请号：US18183062

申请日：2023-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Lim Suk ,  Keung Beum Kim ,  Dongkyu Kim ,  Minjung Kim ,  Seokhyun Lee

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a redistribution substrate and a semiconductor chip thereon. The redistribution substrate includes a ground under-bump pattern, signal under-bump patterns laterally spaced apart from the ground under-bump pattern, first signal line patterns disposed on the signal under-bump patterns and coupled to corresponding signal under-bump patterns, and a first ground pattern coupled to the ground under-bump pattern and laterally spaced apart from the first signal line pattern. Each of the signal and ground under-bump patterns includes a first part and a second part formed on the first part and that is wider than the first part. The second part of the ground under-bump pattern is wider than the second part of the signal under-bump pattern. The ground under-bump pattern vertically overlaps the first signal line patterns. The first ground pattern does not vertically overlap the signal under-bump patterns.

公开(公告)号：US11868428B2

公开(公告)日：2024-01-09

申请号：US17340134

申请日：2021-06-07

Applicant: Samsung Electronics Co., Ltd. ,  Seoul National University R&DB Foundation

Inventor： Seon Min Rhee ,  Jaekyeom Kim ,  Gunhee Kim ,  Minjung Kim ,  Dongyeon Woo ,  Seungju Han

IPC: G06V10/40 ,  G06F18/211 ,  G06N3/08 ,  G06F21/34 ,  G06F18/22 ,  G06F18/214 ,  G06V10/74 ,  G06V10/774 ,  G06V10/82 ,  G06V40/16

CPC classification number: G06F18/211 ,  G06F18/214 ,  G06F18/22 ,  G06F21/34 ,  G06N3/08 ,  G06V10/40 ,  G06V10/74 ,  G06V10/774 ,  G06V10/82 ,  G06V40/172

Abstract: A neural network includes a drop layer configured to drops feature values. A method of computation using the neural network includes extracting feature data from input data using a first portion of a neural network, generating compressed representation data of the extracted feature data by dropping a feature value from the extracted feature data at a drop layer of the neural network based on a drop probability corresponding to the feature value, and indicating an inference result from the compressed representation data using a second portion of the neural network.

公开(公告)号：US11694936B2

公开(公告)日：2023-07-04

申请号：US17235997

申请日：2021-04-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjung Kim ,  Kyoung Lim Suk ,  Seokhyun Lee

IPC: H01L21/683 ,  H01L21/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L22/32 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/12 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L2221/6835 ,  H01L2224/16227

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a redistribution substrate that includes a chip region and an edge region around the chip region, and a semiconductor chip on the chip region of the redistribution substrate. The redistribution substrate includes a plurality of dielectric layers that are vertically stacked, a plurality of redistribution patterns on the chip region and in each of the dielectric layers, and a redistribution test pattern on the edge region and at a level the same as a level of at least one of the redistribution patterns.