公开(公告)号：US20240074149A1

公开(公告)日：2024-02-29

申请号：US18312795

申请日：2023-05-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yangdoo KIM ,  Dongwook Kim ,  Sangwuk Park ,  Minkyu Suh ,  Geonyeop Lee ,  Dokeun Lee ,  Jungpyo Hong

IPC: H10B12/00

CPC classification number: H10B12/315 ,  H10B12/0335

Abstract: An integrated circuit (IC) device may include a conductive area on a substrate; a first electrode connected to the conductive area on the substrate, a width of the first electrode in a lateral direction gradually increasing toward the substrate; a second electrode on the substrate, the second electrode including a silicon germanium (SiGe) film, the SiGe film surrounding the first electrode; and a dielectric film between the first electrode and the second electrode. A content of a component of the SiGe film may vary according to a distance from the substrate.

公开(公告)号：US20240040806A1

公开(公告)日：2024-02-01

申请号：US18125928

申请日：2023-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonsung Kim ,  Jihwang Kim ,  Jeongho Lee ,  Dongwook Kim ,  Wonkyoung Choi ,  Yunseok Choi

IPC: H10B80/00 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/36

CPC classification number: H10B80/00 ,  H01L23/5383 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/16 ,  H01L23/36 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253

Abstract: A semiconductor package includes a lower package, an upper package on the lower package, and an inter-package connector between the lower package and the upper package. The lower package includes a first redistribution structure, a first semiconductor chip mounted on a first mounting region of the first redistribution structure, a second semiconductor chip mounted on a second mounting region of the first redistribution structure, a molding layer on the first redistribution structure and in contact with a side wall of the first semiconductor chip and a side wall of the second semiconductor chip, and a conductive post passing through the molding layer and electrically connected to the first semiconductor chip through a first redistribution pattern of the first redistribution structure. The upper package is on the molding layer, vertically overlaps with the second mounting region of the first redistribution structure, and does not cover the first semiconductor chip.

公开(公告)号：US11710673B2

公开(公告)日：2023-07-25

申请号：US17376883

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin Yim ,  Dongwook Kim ,  Hyunki Kim ,  Jongbo Shim ,  Jihwang Kim ,  Sungkyu Park ,  Yongkwan Lee ,  Byoungwook Jang

IPC: H01L23/12 ,  H01L23/538

CPC classification number: H01L23/12 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386

Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.

公开(公告)号：USD978099S1

公开(公告)日：2023-02-14

申请号：US29795014

申请日：2021-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Sinwi Moon ,  Jaewook Yoo ,  Daehun Jung ,  Byungmin Woo ,  Dongwook Kim ,  Jeewon Kim

公开(公告)号：US11157095B2

公开(公告)日：2021-10-26

申请号：US16724805

申请日：2019-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sun Ok Jung ,  Dongwook Kim ,  Minjung Kim ,  Sookjin Kim ,  Jin-Gil Yang ,  Inji Jin

IPC: G06F3/0354 ,  G16H10/65 ,  A61B5/00 ,  A61B5/0245 ,  A61B5/0205 ,  G06F3/01 ,  G16H40/63 ,  G06F1/26 ,  G06F3/038 ,  G16H50/20 ,  A61B5/01 ,  A61B5/11 ,  A61B5/021 ,  A61B5/024 ,  A61B5/318

Abstract: An electronic device, accessory device and method using the same are disclosed herein. The accessory device is stowable in the electronic device, and includes at least a first sensor, a second sensor, a communication interface and a processor. The method includes receiving, through the communication interface, information from the electronic device corresponding to an application executed in the electronic device, in response to the received information, obtaining the first data through the first sensor when the received information is a first information and obtaining the second data through the second sensor when the information is a second information, and transmitting, to the electronic device, data based on at least one of the first data and the second data.

公开(公告)号：USD1040774S1

公开(公告)日：2024-09-03

申请号：US29838016

申请日：2022-05-10

Applicant: Samsung Electronics Co., Ltd.

Designer： Jaeneung Lee ,  Chulyong Cho ,  Dongwook Kim

Abstract: FIG. 1 is a front perspective view of a television, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 of FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 of FIG. 5;
FIG. 11 is an enlarged view of the encircled portion 11 of FIG. 8;
FIG. 12 is a perspective view thereof in an environment of use; and,
FIG. 13 is another perspective view thereof in an environment of use.
The even-dash broken lines in FIGS. 3 to 8, 10 and 11 depict portions of the television that form no part of the claimed design.
The dot-dash broken lines encircling enlarged portions of FIGS. 1, 5 and 8-11 form no part of the claimed design.
The even-dash broken lines in FIGS. 12 and 13 illustrate environmental structure that form no part of the claimed design.

公开(公告)号：USD1034533S1

公开(公告)日：2024-07-09

申请号：US29856227

申请日：2022-10-12

Applicant: Samsung Electronics Co., Ltd.

Designer： Bo-Kyung Seong ,  Gyoosang Choi ,  Tae-Hun Kim ,  Dongwook Kim

Abstract: FIG. 1 is a front perspective view of a remote controller showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the encircled portion 11 in FIG. 1;
FIG. 12 is an enlarged view of the encircled portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the encircled portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the encircled portion 14 in FIG. 5;
FIG. 15 is an enlarged view of the encircled portion 15 in FIG. 5; and,
FIG. 16 is an enlarged view of the encircled portion 16 in FIG. 6.
The evenly-dashed broken lines in the figures depict portions of the remote controller which form no part of the claimed design.
The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

公开(公告)号：US20240147698A1

公开(公告)日：2024-05-02

申请号：US18368635

申请日：2023-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geonyeop Lee ,  Dongwook Kim ,  Yangdoo Kim ,  Sangki Nam ,  Sangwuk Park ,  Minkyu Suh ,  Dokeun Lee ,  Sungho Jang ,  Jungpyo Hong

IPC: H10B12/00

CPC classification number: H10B12/315 ,  H10B12/0335

Abstract: A semiconductor device includes; a lower structure, lower electrodes on the lower structure, wherein each lower electrode includes a first lower electrode and a second lower electrode on the first lower electrode and electrically connected to the first lower electrode, an upper electrode covering the lower electrodes, and a dielectric film between the lower electrodes and the upper electrode, wherein the first lower electrode includes a pillar portion and a protruding portion on the pillar portion, wherein protruding portion has a complex shape that contacts the second lower electrode.

公开(公告)号：USD1024066S1

公开(公告)日：2024-04-23

申请号：US29842855

申请日：2022-06-16

Applicant: Samsung Electronics Co., Ltd.

Designer： Dongwook Kim ,  Chul-Yong Cho ,  Tae-Hun Kim ,  Jisoo Kim ,  Gyoosang Choi ,  Bo-Kyung Seong

Abstract: FIG. 1 is a front perspective view of a monitor showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the encircled portion in FIG. 2;
FIG. 12 is an enlarged view of the encircled portion 12 in FIG. 3;
FIG. 13 is an enlarged view of the encircled portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the encircled portion in FIG. 4;
FIG. 15 is an enlarged view of the encircled portion in FIG. 5;
FIG. 16 is an enlarged view of the encircled portion in FIG. 6;
FIG. 17 is an enlarged view of the encircled portion in FIG. 7;
FIG. 18 is an enlarged view of the encircled portion in FIG. 8;
FIG. 19 is another front view thereof showing the display screen of the monitor rotated in an alternate position; and,
FIG. 20 is an enlarged view of the encircled portion in FIG. 19.
Dot-dash broken lines represent the boundaries of the enlarged portions and form no part of the claimed design. All other broken lines seen in the drawings depict portions of the monitor that form no part of the claimed design.

公开(公告)号：USD1015336S1

公开(公告)日：2024-02-20

申请号：US29842863

申请日：2022-06-16

Applicant: Samsung Electronics Co., Ltd.

Designer： Dongwook Kim ,  Chul-Yong Cho ,  Tae-Hun Kim ,  Jisoo Kim ,  Gyoosang Choi ,  Bo-Kyung Seong

Abstract: FIG. 1 is a front perspective view of a monitor showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion in FIG. 4;
FIG. 11 is an enlarged view of the encircled portion in FIG. 6;
FIG. 12 is an enlarged view of the encircled portion in FIG. 8; and,
FIG. 13 is another front view of the monitor shown in an alternate position.
The evenly-dashed broken lines in the figures depict portions of the monitor which form no part of the claimed design.
The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.