公开(公告)号：US20170092557A1

公开(公告)日：2017-03-30

申请号：US15050289

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： Yvon Imbs ,  Laurent Schwarz ,  David Auchere ,  Laurent Marechal

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/768 ,  H01L23/66 ,  H01L21/3105 ,  H01L21/56 ,  H01L23/498 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73257 ,  H01L2224/8538 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

公开(公告)号：US20170062299A1

公开(公告)日：2017-03-02

申请号：US15050253

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/3105 ,  H01L23/66 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L21/3105 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

Abstract translation: 电子设备包括具有安装面和电连接网络的支撑板。 集成电路芯片安装在安装面上并连接到电气连接网络。 封装块嵌入集成电路芯片。 由导电材料制成的附加元件至少部分地嵌入在封装块内。 附加导电元件具有平行于支撑板延伸的主要部分，并具有与集成电路芯片电连接的次级部分。 在密封块中形成开口，并且次级部分延伸到该开口中以形成电连接。 附加导电元件可以是天线。

公开(公告)号：US10116037B2

公开(公告)日：2018-10-30

申请号：US15668816

申请日：2017-08-04

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01L21/44 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/66 ,  H01L23/498 ,  H01L21/56

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

公开(公告)号：US10103079B2

公开(公告)日：2018-10-16

申请号：US15659078

申请日：2017-07-25

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Yvon Imbs ,  Laurent Schwarz ,  David Auchere ,  Laurent Marechal

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L21/3105 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.

公开(公告)号：US09754851B2

公开(公告)日：2017-09-05

申请号：US15050253

申请日：2016-02-22

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David Auchere ,  Laurent Marechal ,  Yvon Imbs ,  Laurent Schwarz

IPC: H01L23/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66 ,  H01Q1/22 ,  H01L21/3105 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L21/3105 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

公开(公告)号：US09402331B2

公开(公告)日：2016-07-26

申请号：US14512214

申请日：2014-10-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Yvon Imbs

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20 ,  H05K1/14 ,  H01L23/473 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K7/20 ,  H01L23/473 ,  H01L23/49816 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/73204 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/064 ,  H01L2924/00014

Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

Abstract translation: 电子设备包括由绝缘材料制成并具有电连接网络的衬底晶片。 集成电路芯片安装在基板晶片的顶侧。 衬底晶片包含内部管道。 导管由位于基板晶片顶侧的覆盖沟槽形成。 沟槽包含导热材料，例如是流体。 偏离沟槽的衬底晶片顶部的开口允许在集成电路和电连接网络之间形成电连接。