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公开(公告)号：US20210114867A1
公开(公告)日：2021-04-22
申请号：US17072813
申请日：2020-10-16
Applicant: STMicroelectronics S.r.l.
Inventor： Enri DUQI , Fabrizio CERINI , Lorenzo BALDO
Abstract: A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.
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12.发明申请公开(公告)号：US20200148530A1
公开(公告)日：2020-05-14
申请号：US16730480
申请日：2019-12-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Bruno MURARI , Sebastiano CONTI
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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公开(公告)号：US20170253477A1
公开(公告)日：2017-09-07
申请号：US15602760
申请日：2017-05-23
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Lorenzo BALDO , Enri DUQI , Flavio Francesco VILLA
CPC classification number: B81B7/0045 , B81B3/0072 , B81B2201/0228 , B81B2201/025 , B81B2203/0127 , B81B2203/0163 , B81B2203/0315 , B81B2207/012 , B81C1/00182 , B81C1/00325 , B81C2201/0116 , B81C2201/0173 , B81C2203/0785 , G02B26/0858
Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
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14.发明申请MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVITY AND CORRESPONDING MANUFACTURING PROCESS 有权具有降低应力敏感性的微电子传感器装置和相应的制造工艺公开(公告)号：US20170073220A1
公开(公告)日：2017-03-16
申请号：US15074755
申请日：2016-03-18
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI
IPC: B81B7/00
CPC classification number: B81B7/0054 , B81B3/0051 , B81B7/0048 , B81B7/008 , B81B2201/0264 , B81C1/00325 , H01L2224/48091 , H01L2924/00014
Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
Abstract translation: MEMS装置设置有：支撑基座，其具有与外部环境接触的底面; 传感器芯片，其是半导体材料并且集成了微机械检测结构; 传感器框架，其布置在所述传感器模具周围并且机械地联接到所述支撑基座的顶表面; 以及盖，其布置在传感器模具的上方并且机械地联接到传感器框架的顶表面，盖的顶表面与外部环境接触。 传感器模具与传感器框架机械分离。
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15.发明公开公开(公告)号：US20230356999A1
公开(公告)日：2023-11-09
申请号：US18308562
申请日：2023-04-27
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Filippo DANIELE , Lorenzo BALDO , Davide MAERNA , Enri DUQI
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B7/008
Abstract: A microelectromechanical device includes a support structure, a microelectromechanical system die, incorporating a microstructure and a connection structure between the microelectromechanical system die and the support structure. The connection structure includes a spacer structure, joined to the support structure, and a film applied to one face of the spacer structure opposite to the support structure. The spacer structure laterally delimits at least in part a cavity and the film extends on the cavity, at a distance from the support structure. The microelectromechanical system die is joined to the film on the cavity.
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Patent Agency Ranking
16.发明公开公开(公告)号：US20230314257A1
公开(公告)日：2023-10-05
申请号：US18169818
申请日：2023-02-15
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri DUQI , Patrick FEDELI , Nicolo' MANCA , Silvia ADORNO
IPC: G01L27/00
CPC classification number: G01L27/005 , H02J50/10
Abstract: Method for determining a first and a second calibrated value of atmospheric pressure, performed by an electronic apparatus comprising a fixed device and a first and a second movable device comprising respectively a first and a second movable barometer. The method comprises: determining whether the movable devices are being inductively charged by the fixed device; if so, acquiring respective measured values of atmospheric pressure through the movable barometers, and a reference value of atmospheric pressure in a common reference point of the electronic apparatus, the movable barometers being at respective predefined height differences with respect to the common reference point; calculating respective pressure differences as a function of the measured values of atmospheric pressure and of the reference value of atmospheric pressure; and when the movable devices are not being charged, acquiring new measured values of atmospheric pressure through the movable barometers, and determining the respective calibrated values of atmospheric pressure as a function of the new measured values of atmospheric pressure and of the pressure differences.
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公开(公告)号：US20220411256A1
公开(公告)日：2022-12-29
申请号：US17843483
申请日：2022-06-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Paolo FERRARI , Flavio Francesco VILLA , Enri DUQI , Igor VARISCO , Filippo D'ERCOLI
Abstract: MEMS device formed in a semiconductor body which is monolithic and has a first and a second main surface. A buried cavity extends into the semiconductor body below and at a distance from the first main surface. A diaphragm extends between the buried cavity and the first main surface of the semiconductor body and has a buried face facing the buried cavity. A diaphragm insulating layer extends on the buried face of the diaphragm and a lateral insulating region extends into the semiconductor body along a closed line, between the first main surface and the diaphragm insulating layer, above the buried cavity. The lateral insulating region laterally delimits the diaphragm and forms, with the diaphragm insulating layer, a diaphragm insulating region which delimits the diaphragm and electrically insulates it from the rest of the wafer.
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公开(公告)号：US20220185661A1
公开(公告)日：2022-06-16
申请号：US17684317
申请日：2022-03-01
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Marco DEL SARTO , Lorenzo BALDO
Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.
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19.发明申请公开(公告)号：US20220163383A1
公开(公告)日：2022-05-26
申请号：US17530785
申请日：2021-11-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Michele VAIANA , Enri DUQI , Maria Eloisa CASTAGNA
Abstract: Radiation sensor including a detection assembly and a chopper assembly, which are mechanically coupled to delimit a main cavity; and wherein the chopper assembly includes: a suspended movable structure, which extends in the main cavity; and an actuation structure, which is electrically controllable to cause a change of position of the suspended movable structure. The detection unit includes a detection structure, which faces the main cavity and includes a number of detection devices. The suspended movable structure includes a first shield of conductive material, which shields the detection devices from the radiation, the shielding of the detection devices being a function of the position of the suspended movable structure.
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公开(公告)号：US20190242772A1
公开(公告)日：2019-08-08
申请号：US16260723
申请日：2019-01-29
Applicant: STMicroelectronics S.r.l.
Inventor： Enri DUQI , Lorenzo BALDO
CPC classification number: G01L19/141 , B81B7/0051 , B81B7/007 , B81C1/00182 , G01L9/0052 , G01L9/0054 , G01L19/0007 , G01L19/0084 , G01L19/12 , G01L19/145
Abstract: A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.
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