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公开(公告)号：US11146104B2
公开(公告)日：2021-10-12
申请号：US16862850
申请日：2020-04-30
Applicant: STMicroelectronics S.r.l.
Inventor： Roberto La Rosa , Alessandro Finocchiaro
Abstract: A radiofrequency-powered device such as a wireless passive sensor node, for instance, comprises a radiofrequency energy harvesting circuit configured to be coupled to an antenna to harvest radiofrequency energy captured by the antenna from a radiofrequency signal. The radiofrequency energy harvesting circuit is configured to be coupled to an energy storage component to store therein energy harvested via the radiofrequency energy harvesting circuit. The device comprises user circuitry configured to be supplied with energy harvested via the radiofrequency energy harvesting circuit and to operate in accordance with one of a plurality of configurations as a function of configuration data supplied thereto. A receiver circuit coupled to the radiofrequency energy harvesting circuit is configured to receive a configuration data signal modulating the radiofrequency signal and supply to the user circuitry configuration data extracted from the configuration data signal received.
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公开(公告)号：US11056914B2
公开(公告)日：2021-07-06
申请号：US16849370
申请日：2020-04-15
Applicant: STMicroelectronics S.r.l.
Inventor： Roberto La Rosa , Alessandro Finocchiaro
IPC: H01F27/42 , H01F37/00 , H01F38/00 , H02J50/00 , H02J50/20 , H02J50/40 , H02J7/00 , H02J7/34 , H02J7/35
Abstract: A first Radio-Frequency-to-Direct-Current (RF2DC) transducer receives a first signal from a sensing antenna and generates energy stored by an energy storage circuit. An energy transfer circuit is controllably switched between an energy storage state where energy is stored in the energy storage state and an energy transfer state where stored energy is transferred to a load. The voltage at the energy storage circuit is alternatively variable between an upper value and a lower value around a voltage setting point. A second RF2DC transducer, which is a down-scaled replica of the first RF2DC transducer, produces a second signal indicative of an open-circuit voltage of the first RF2DC transducer. The voltage setting point is set as a function of the second signal indicative of the open-circuit voltage of the first RF2DC transducer.
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公开(公告)号：US20180342574A1
公开(公告)日：2018-11-29
申请号：US16052777
申请日：2018-08-02
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Alessandro Finocchiaro
IPC: H01L49/02 , H01L23/00 , G01R31/28 , H01L23/66 , H01L23/58 , H01L23/528 , H01L29/06 , H01L23/544 , H01L25/065 , G01R31/302 , H01L21/66
CPC classification number: H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.
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公开(公告)号：US20170154948A1
公开(公告)日：2017-06-01
申请号：US15431877
申请日：2017-02-14
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Alessandro Finocchiaro
IPC: H01L49/02 , H01L23/66 , H01L23/528 , G01R31/302 , H01L23/00 , H01L21/66 , G01R31/28 , H01L23/58 , H01L29/06
CPC classification number: H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Another conductive structure extends in the peripheral portion on different planes of metallizations and forms a seal ring.
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15.发明授权Method and device for monitoring at least a characteristic of a block made of a building material 有权用于监测由建筑材料制成的块的至少特征的方法和装置公开(公告)号：US09335286B2
公开(公告)日：2016-05-10
申请号：US13770492
申请日：2013-02-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giovanni Girlando , Alessandro Finocchiaro , Bruno Murari
CPC classification number: G01N27/00 , G01M5/0083 , H04Q9/00 , H04Q2209/88
Abstract: A monitoring device includes an electric supply line to be buried in the block of building material, to convey signals and to be AC supplied so as to generate voltage and current stationary waveforms. The device also includes primary inductors coupled to the electric supply line at positions corresponding to peaks of at least one of the voltage and current stationary waveforms. The device also includes integrated monitoring circuits to be buried in the block of building material, with each integrated monitoring circuit including an integrated sensor to sense at least one physical characteristic, and a secondary inductor magnetically coupled to a respective primary inductor to supply the integrated sensor, and communicate through the electric supply line.
Abstract translation: 监控装置包括要埋在建筑材料块中的电力供应线，以传送信号并且被供电以产生电压和电流静止波形。 该装置还包括在对应于电压和电流静止波形中的至少一个的峰值的位置处耦合到电源线的初级电感器。 该装置还包括要埋在建筑材料块中的集成监控电路，每个集成监控电路包括用于感测至少一个物理特性的集成传感器，以及磁耦合到相应的初级电感器的次级电感器，以提供集成传感器 ，并通过电源线进行通信。
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Patent Agency Ranking
16.发明授权Passive monitoring device of the inner pressure in a block of building material 有权被动监测装置内部压力在一块建筑材料中公开(公告)号：US09234808B2
公开(公告)日：2016-01-12
申请号：US13851671
申请日：2013-03-27
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giovanni Girlando , Alessandro Finocchiaro , Bruno Murari
Abstract: A monitoring device is for the inner pressure distribution of building material in a building structure. The device may include planar sensing capacitors to be buried in contact with the building material, with each sensing capacitor including a pair of plates and a dielectric material layer therebetween adapted to undergo elastic deformation under pressure without deforming plastically. The device may also include a protection box to be buried in the building material, a dielectric material enclosed in the protection box, and connection terminals protruding from the protection box. Pairs of metal vias are buried in the dielectric material enclosed within the protection box, with each pair connecting the plates of a respective planar sensing capacitor to respective connection terminals.
Abstract translation: 监测装置用于建筑结构中的建筑材料的内部压力分布。 该装置可以包括要与建筑材料接触的平面感测电容器，每个感测电容器包括一对板和介于其之间的电介质材料层，适于在压力下经受弹性变形而不会塑性变形。 该装置还可以包括要埋在建筑材料中的保护盒，封闭在保护盒中的电介质材料以及从保护盒突出的连接端子。 金属通孔对被埋在封装在保护箱内的电介质材料中，每对将相应的平面感测电容器的板连接到相应的连接端子。
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公开(公告)号：US11959995B2
公开(公告)日：2024-04-16
申请号：US17395080
申请日：2021-08-05
Applicant: STMicroelectronics S.r.l.
Inventor： Alessandro Finocchiaro , Alessandro Parisi , Andrea Cavarra , Giuseppe Papotto , Giuseppe Palmisano
IPC: G01S13/34 , G01S13/931 , H03B5/12 , H03L7/193 , G01S13/00
CPC classification number: G01S13/34 , G01S13/931 , H03B5/1231 , H03L7/193
Abstract: A PLL has a tunable resonator including an inductance and variable capacitance coupled between first and second nodes, and capacitances coupleable between the nodes. A control node is coupled to the variable capacitance and receives a control signal for tuning the resonator. A biasing circuit biases the resonator to generate an output. A PFD circuit senses timing offset of the output with respect to a reference and asserts first or second digital signals dependent on the sign of the timing offset. A charge pump generates the control signal based on the first and second digital signals. A timer asserts a timing signal in response to a pulse sensed in a reset signal and de-asserts the timing signal after a time interval. A calibrator couples selected capacitances between the first and second nodes as a function of the second digital signal, in response to assertion of the timing signal.
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公开(公告)号：US11879963B2
公开(公告)日：2024-01-23
申请号：US18108993
申请日：2023-02-13
Applicant: STMicroelectronics S.r.l.
Inventor： Alessandro Parisi , Andrea Cavarra , Alessandro Finocchiaro , Giuseppe Papotto , Giuseppe Palmisano
CPC classification number: G01S13/584 , G01S7/4056 , G01S13/931 , H03B5/1212 , H03B5/1228 , H03B5/1243 , H03B5/1265 , H03B5/1293 , H03L7/099 , H03L7/101 , H03L7/103 , H03L7/193
Abstract: Disclosed herein is a tunable resonant circuit including an inductance directly electrically connected in series between first and second nodes, a variable capacitance directly electrically connected between the first and second nodes, and a set of switched capacitances coupled between the first and second nodes. The set of switched capacitances includes a plurality of capacitance units, each capacitance unit comprising a first capacitance for that capacitance unit directly electrically connected between the first node and a switch and a second capacitance for the capacitance unit directly electrically connected between the switch and the second node. Control circuitry is configured to receive an input control signal and connected to control the switches of the set of switched capacitances. A biasing circuit is directly electrically connected to the tunable resonance circuit at the first and second nodes.
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公开(公告)号：US10424633B2
公开(公告)日：2019-09-24
申请号：US16052777
申请日：2018-08-02
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Alessandro Finocchiaro
IPC: H01L49/02 , G01R31/28 , G01R31/302 , H01L21/66 , H01L23/528 , H01L23/00 , H01L23/58 , H01L23/66 , H01L29/06 , H01L23/544 , H01L25/065
Abstract: A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.
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公开(公告)号：US10068961B2
公开(公告)日：2018-09-04
申请号：US15431877
申请日：2017-02-14
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Alessandro Finocchiaro
IPC: H01L21/00 , H01L49/02 , H01L23/58 , H01L23/66 , H01L23/528 , H01L29/06 , H01L23/00 , H01L21/66 , G01R31/28 , G01R31/302
Abstract: An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Another conductive structure extends in the peripheral portion on different planes of metallizations and forms a seal ring.
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