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公开(公告)号：US11442142B2
公开(公告)日：2022-09-13
申请号：US16795977
申请日：2020-02-20
发明人： Giuseppe Papotto , Egidio Ragonese , Claudio Nocera , Alessandro Finocchiaro , Giuseppe Palmisano
摘要： An input receives a radio frequency (RF) signal having an interfering component superimposed thereon. The RF signal is mixed with a local oscillator (LO) signal and down-converted to an intermediate frequency (IF) to generate a mixed signal which includes a frequency down-converted interfering component. The mixed signal is amplified by an amplifier to generate an output signal. A feedback loop processes the output signal to generate a correction signal for cancelling the frequency down-converted interfering component at the input of the amplifier. The feedback loop includes a low-pass filter and a amplification circuit which outputs the correction signal.
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公开(公告)号：US09419071B2
公开(公告)日：2016-08-16
申请号：US14926269
申请日：2015-10-29
IPC分类号： H01L49/02 , H01L23/66 , G01R31/28 , G01R31/302 , H01L21/66 , H01L23/528 , H01L23/00 , H01L23/58 , H01L29/06
CPC分类号： H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.
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公开(公告)号：US10964646B2
公开(公告)日：2021-03-30
申请号：US15854456
申请日：2017-12-26
摘要： A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite bottom surface. An antenna is formed in an interconnect layer formed above the semiconductor substrate, where the antenna is coupled to circuitry. A seal ring is formed around a periphery of the interconnect layer. The seal ring is disposed around the antenna and the circuitry. A trench with a solid-state insulating material is formed. The trench extends vertically into the semiconductor substrate and extends laterally across the IC.
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公开(公告)号：US10044290B2
公开(公告)日：2018-08-07
申请号：US15160674
申请日：2016-05-20
摘要： An energy harvester circuit operates to harvest energy in battery-less electrical apparatus. The circuit includes a string of capacitors coupled to a circuit input to receive energy to be harvested. A string of transistors are coupled as pumping transistors to respective ones of the capacitors in the string of capacitors. A compensation coupling circuit is coupled between each transistor in the string of pumping transistors and one of a subsequent or a preceding transistor in the string of pumping transistors.
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公开(公告)号：US09607912B2
公开(公告)日：2017-03-28
申请号：US15208269
申请日：2016-07-12
IPC分类号： H01L21/00 , H01L21/66 , G01R31/28 , G01R31/302 , H01L23/528 , H01L23/00 , H01L23/58 , H01L23/66 , H01L49/02 , H01L29/06 , H01L23/544 , H01L25/065
CPC分类号： H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Magnetic trench structures are provided adjacent the integrated antenna.
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公开(公告)号：US11604267B2
公开(公告)日：2023-03-14
申请号：US17395016
申请日：2021-08-05
发明人： Alessandro Parisi , Andrea Cavarra , Alessandro Finocchiaro , Giuseppe Papotto , Giuseppe Palmisano
摘要： An oscillator includes a tunable resonant circuit having an inductance and a variable capacitance coupled between first and second nodes, and a set of capacitances selectively coupleable between the first and second nodes. An input control node receiving an input control signal is coupled to the variable capacitance and set of capacitances. The tunable resonant circuit is tunable based on the input control signal. A biasing circuit biases the tunable resonant circuit to generate a variable-frequency output signal between the first and second nodes. A voltage divider generates a set of different voltage thresholds, and a set of comparator circuits with hysteresis compares the input control signal to the set of different voltage thresholds to generate a set of control signals. The capacitances in the set of capacitances are selectively coupleable between the first and second nodes as a function of control signals in the set of control signals.
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公开(公告)号：US20160322269A1
公开(公告)日：2016-11-03
申请号：US15208269
申请日：2016-07-12
IPC分类号： H01L21/66 , H01L23/66 , H01L25/065 , H01L23/544 , H01L29/06
CPC分类号： H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Magnetic trench structures are provided adjacent the integrated antenna.
摘要翻译： 衬底上的集成电路包括围绕有源区并且靠近划线的位置的周边部分，其与在同一晶片上实现的其它集成电路分开。 集成电路包括至少一个导电结构，其从衬底开始在金属化的不同平面上的周边部分中延伸并形成集成天线。 在集成天线附近提供磁沟结构。
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公开(公告)号：US20160049459A1
公开(公告)日：2016-02-18
申请号：US14926269
申请日：2015-10-29
CPC分类号： H01L28/10 , G01R31/2834 , G01R31/2889 , G01R31/3025 , H01L22/32 , H01L22/34 , H01L23/528 , H01L23/544 , H01L23/564 , H01L23/585 , H01L23/66 , H01L24/05 , H01L25/0657 , H01L29/0642 , H01L2223/6677 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit.
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公开(公告)号：US10424633B2
公开(公告)日：2019-09-24
申请号：US16052777
申请日：2018-08-02
IPC分类号： H01L49/02 , G01R31/28 , G01R31/302 , H01L21/66 , H01L23/528 , H01L23/00 , H01L23/58 , H01L23/66 , H01L29/06 , H01L23/544 , H01L25/065
摘要： A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.
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公开(公告)号：US10068961B2
公开(公告)日：2018-09-04
申请号：US15431877
申请日：2017-02-14
IPC分类号： H01L21/00 , H01L49/02 , H01L23/58 , H01L23/66 , H01L23/528 , H01L29/06 , H01L23/00 , H01L21/66 , G01R31/28 , G01R31/302
摘要： An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Another conductive structure extends in the peripheral portion on different planes of metallizations and forms a seal ring.
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