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    Proximity and ranging sensor
    12.
    发明授权
    Proximity and ranging sensor 有权
    接近和测距传感器

    公开(公告)号：US09525094B2

    公开(公告)日：2016-12-20

    申请号：US14671707

    申请日：2015-03-27

    Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

    Inventor： Eric Saugier ,  Wing Shenq Wong ,  David Gani

    IPC: H01L31/167 ,  H01L31/02 ,  H01L25/16 ,  H01S5/022 ,  H01S5/183 ,  H01L31/18

    CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

    Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

    Image sensor device with sensing surface cavity and related methods
    13.
    发明授权
    Image sensor device with sensing surface cavity and related methods 有权
    具有感应表面腔的图像传感器装置及相关方法

    公开(公告)号：US09525002B2

    公开(公告)日：2016-12-20

    申请号：US14589210

    申请日：2015-01-05

    Applicant: STMICROELECTRONICS PTE LTD

    Inventor： Wing Shenq Wong

    IPC: H01L31/0232 ,  H01L27/146

    CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/16235 ,  H01L2924/00014

    Abstract: An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface.

    Abstract translation: 图像传感器装置可以包括互连层，由互连层承载并具有图像感测表面的图像传感器IC，以及侧向围绕图像传感器IC并且覆盖图像传感器IC的上表面的封装材料，直到图像感测 表面。 图像传感器装置可以包括光学板，其具有由封装材料的上表面承载并与图像感测表面对准的周边下表面，光学板在图像感测表面上方间隔开以限定内部空腔，并且透镜 组件耦合到封装材料并与图像感测表面对齐。

    Molded range and proximity sensor with optical resin lens
    15.
    发明授权
    Molded range and proximity sensor with optical resin lens 有权

    公开(公告)号：US10684389B2

    公开(公告)日：2020-06-16

    申请号：US16107911

    申请日：2018-08-21

    Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

    Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

    IPC: H01L31/167 ,  G01V8/12 ,  H01L25/16

    Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

    MOLDED RANGE AND PROXIMITY SENSOR WITH OPTICAL RESIN LENS
    17.
    发明申请
    MOLDED RANGE AND PROXIMITY SENSOR WITH OPTICAL RESIN LENS 审中-公开
    具有光学树脂镜片的成型范围和近似传感器

    公开(公告)号：US20170052277A1

    公开(公告)日：2017-02-23

    申请号：US14832971

    申请日：2015-08-21

    Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

    Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

    IPC: G01V8/12 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/16 ,  H01L25/16

    CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

    Abstract translation: 一种用于形成具有光学树脂透镜的模制接近传感器的方法及由此形成的结构。 将光传感器芯片放置在诸如印刷电路板的基板上，并且诸如激光二极管的二极管位于光传感器芯片的顶部上并电连接到光传感器芯片上的焊盘。 液体形式的透明光学树脂以光传感器芯片上的光传感器阵列以及发光二极管上的方式被施加。 在光学树脂固化之后，将模塑料施加到整个组件上，然后抛光组件以露出透镜并且具有与模塑料的顶表面齐平的顶表面。

    Overmold with single attachment using optical film
    18.
    发明授权
    Overmold with single attachment using optical film 有权
    使用光学膜进行单次附着的包覆成型

    公开(公告)号：US08779443B2

    公开(公告)日：2014-07-15

    申请号：US13629379

    申请日：2012-09-27

    Applicant: STMicroelectronics Pte Ltd.

    Inventor： Wing Shenq Wong ,  Hk Looi

    IPC: H01L27/15

    CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

    Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

    OVERMOLD WITH SINGLE ATTACHMENT USING OPTICAL FILM
    19.
    发明申请
    OVERMOLD WITH SINGLE ATTACHMENT USING OPTICAL FILM 有权
    使用光学膜进行单独连接

    公开(公告)号：US20140084308A1

    公开(公告)日：2014-03-27

    申请号：US13629379

    申请日：2012-09-27

    Applicant: STMICROELECTRONICS PTE LTD.

    Inventor： Wing Shenq Wong ,  Hk Looi

    IPC: H01L33/48

    CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

    Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

    Molded range and proximity sensor with optical resin lens
    20.
    发明授权
    Molded range and proximity sensor with optical resin lens 有权

    公开(公告)号：US11137517B2

    公开(公告)日：2021-10-05

    申请号：US16890778

    申请日：2020-06-02

    Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS PTE LTD

    Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

    IPC: H01L25/16 ,  H01L31/167 ,  G01V8/12

    Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

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