DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFACTURING METHOD OF THE ANISOTROPIC CONDUCTIVE FILM

    公开(公告)号:US20170338198A1

    公开(公告)日:2017-11-23

    申请号:US15365979

    申请日:2016-12-01

    Abstract: A display device including pads; an anisotropic conductive film on the pads; and a connection member bonded to the pads through the film, the connection member including bumps, the film includes a supporting layer including a plurality of conductive particles having a part protruded from a first and second surface of the support layer; a first adhesive layer contacting the first surface and the part of each conductive particle protruding from the first surface; and a second adhesive layer contacting the second surface and the part of each conductive particle protruding from the second surface, and wherein the first or second adhesive layer is positioned at both of a first and second region of the display device, the first region being a region in which the pads and the bumps are overlapped and the second region being a region in which the pads and the bumps are not overlapped.

    PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20180004031A1

    公开(公告)日:2018-01-04

    申请号:US15636797

    申请日:2017-06-29

    Abstract: A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines.

    BONDING APPARATUS AND METHOD FOR USING THE SAME

    公开(公告)号:US20190198476A1

    公开(公告)日:2019-06-27

    申请号:US16127376

    申请日:2018-09-11

    Abstract: A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.

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