Display device and method of manufacturing the same

    公开(公告)号:US11594559B2

    公开(公告)日:2023-02-28

    申请号:US17157184

    申请日:2021-01-25

    Abstract: A display device may include a first gate electrode disposed on a substrate, a buffer layer disposed on the first gate electrode, a first active pattern on the buffer layer, the first active pattern overlapping the first gate electrode and including an oxide semiconductor, a second active pattern on the buffer layer, spaced apart from the first active pattern, and including an oxide semiconductor, the second active pattern including a channel region, and a source region and a drain region, a source pattern and a drain pattern respectively at ends of the first active pattern, a first insulation pattern disposed on the first active pattern, a second insulation pattern disposed on the channel region, a first oxygen supply pattern on the first insulation pattern, a second oxygen supply pattern on the second insulation pattern, and a second gate electrode on the second oxygen supply pattern.

    Display device and method for manufacturing the same

    公开(公告)号:US11469283B2

    公开(公告)日:2022-10-11

    申请号:US16952762

    申请日:2020-11-19

    Abstract: A display device is provided. The display device includes a substrate, a first active layer of a first transistor and a second active layer of a second transistor which are disposed on the substrate, a first gate insulating layer disposed on the first active layer, an oxide layer disposed on the first gate insulating layer and including an oxide semiconductor, a first gate electrode disposed on the oxide layer, a second gate insulating layer disposed on the first gate electrode and the second active layer, and a second gate electrode which overlaps the second active layer in a thickness direction of the substrate and is disposed on the second gate insulating layer, where the oxide layer overlaps the first active layer and does not overlap the second active layer in the thickness direction.

    Sputtering device and method of forming layer using the same
    14.
    发明授权
    Sputtering device and method of forming layer using the same 有权
    溅射装置及其形成方法

    公开(公告)号:US09410234B2

    公开(公告)日:2016-08-09

    申请号:US14670403

    申请日:2015-03-26

    CPC classification number: C23C14/044 H01J37/34 H01J37/3447

    Abstract: Provided are a sputtering device and a method of forming a layer using the same.The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

    Abstract translation: 提供溅射装置和使用其形成层的方法。 使用溅射装置形成层的方法包括:将基板放置在室内; 使用溅射工艺将从面向衬底的靶发射的靶颗粒沉积在衬底上; 并且水平移动多个屏蔽杆,其安装在设置在基板和靶之间的屏蔽掩模中,并且在溅射过程期间沿着第一方向彼此分离。

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