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    CAMERA MODULE
    12.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号：US20230176314A1

    公开(公告)日：2023-06-08

    申请号：US17861749

    申请日：2022-07-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Se Yeon HWANG ,  Kyung Ho LEE ,  Seok Hwan KIM ,  Seung Jae SONG

    IPC: G02B7/02

    CPC classification number: G02B7/021 ,  G03B5/00

    Abstract: A camera module includes: a housing defining an internal space; a first lens module disposed in the internal space to move along an optical axis direction, the first lens module including at least one first bearing member; a second lens module disposed in the internal space to move along the optical axis direction, the second lens module including at least one second bearing member; a shaft disposed in the housing and supporting a first side of the first lens module and contacting the at least one first bearing member and supporting a first side of the second lens module and contacting the at least one second bearing member; at least one first ball member supporting a second side of the first lens module; and at least one second ball member supporting a second side of the second lens module.

    FORCE SENSING DEVICE AND ELECTRONIC DEVICE INCLUDING FORCE SENSING DEVICE
    13.
    发明申请
    FORCE SENSING DEVICE AND ELECTRONIC DEVICE INCLUDING FORCE SENSING DEVICE 有权

    公开(公告)号：US20220170805A1

    公开(公告)日：2022-06-02

    申请号：US17217325

    申请日：2021-03-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Man KIM ,  Se Yeon HWANG ,  Kyung Ho LEE ,  Seok Hwan KIM ,  Chul Kyu KIM ,  Han KIM

    IPC: G01L5/164 ,  G01L5/166

    Abstract: A force sensing device includes a support member including: a sensor support portion to which a force sensor is coupled on one surface of the support member; and a frame coupling portion extending from the sensor support portion. The force sensing device further includes: a frame disposed to face another surface of the support member, and disposed to be spaced apart from the support member; and at least one spacing member disposed between the support member and the frame, and spacing the support member apart from the frame. The force sensor is not disposed in the frame coupling portion. The spacing member is disposed between the frame coupling portion and the frame.

    FAN-OUT SEMICONDUCTOR PACKAGE
    14.
    发明申请
    FAN-OUT SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190096825A1

    公开(公告)日：2019-03-28

    申请号：US15938181

    申请日：2018-03-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Man KIM ,  Han KIM ,  Kyung Ho LEE

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

    Abstract: A fan-out semiconductor package includes a wiring portion, semiconductor chips, a dummy chip, and an encapsulant. The wiring portion includes an insulating layer, conductive patterns formed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns. The semiconductor chips are disposed on one region of the wiring portion, and the dummy chip is disposed on another region thereof and has a thickness smaller than those of the semiconductor chips. The encapsulant encapsulates at least portions of the semiconductor chips and the dummy chip. An upper surface of the wiring portion is disposed below a center line of the fan-out semiconductor package, and the thickness t of the dummy chip is such that T/2≤t≤3T/2 in which T is a distance from the upper surface of the wiring portion to the center line of the fan-out semiconductor package.

    FAN-OUT SEMICONDUCTOR PACKAGE
    15.
    发明申请
    FAN-OUT SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20180331054A1

    公开(公告)日：2018-11-15

    申请号：US16042644

    申请日：2018-07-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Han KIM ,  Kyung Moon JUNG ,  Seok Hwan KIM ,  Kyung Ho LEE ,  Kang Heon HUR

    IPC: H01L23/00

    Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

    HORIZONTAL LINEAR VIBRATOR
    17.
    发明申请
    HORIZONTAL LINEAR VIBRATOR 有权
    水平线性振动器

    公开(公告)号：US20140152126A1

    公开(公告)日：2014-06-05

    申请号：US13874383

    申请日：2013-04-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Jin KIM ,  Jun Kun CHOI ,  Jae Woo JUN ,  Ki Suk WOO ,  Kwang Hyung LEE ,  Je Hyun BANG ,  Seok Jun PARK ,  Kyung Ho LEE

    IPC: H02K33/02

    CPC classification number: H02K33/16 ,  B06B1/045 ,  H02K33/02

    Abstract: The present invention provides a horizontal linear vibrator which can reduce the thickness but increase vibration strength while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The casing defines an internal space therein. The bracket is disposed under the casing. A cylindrical coil is provided on the bracket. The vibration unit has a magnet, a yoke and a weight. The yoke contains the magnet therein and is open on the lower end thereof. The weight is coupled to the outer surface of the yoke. The springs are coupled to sidewall plates of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction.

    Abstract translation: 本发明提供一种水平线性振动器，其可以减小厚度但增加振动强度，同时保证足够长的寿命和令人满意的响应度。 水平线性振动器包括壳体，支架，振动单元和弹簧。 壳体在其中限定内部空间。 支架设置在外壳下方。 支架上设有圆柱形线圈。 振动单元具有磁体，磁轭和重量。 磁轭在其中包含磁体，并且在其下端是开放的。 重物耦合到轭的外表面。 弹簧联接到壳体或支架的侧壁板。 弹簧弹性地支撑振动单元以允许振动单元在水平方向上振动。

    ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
    18.
    发明申请
    ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件封装及其制造方法

    公开(公告)号：US20140145322A1

    公开(公告)日：2014-05-29

    申请号：US14069906

    申请日：2013-11-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Nam HWANG ,  Suk Jin HAM ,  Seung Wan WOO ,  Po Chul KIM ,  Kyung Ho LEE

    IPC: H01L23/08 ,  H01L21/56

    CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511

    Abstract: Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art.

    Abstract translation: 本文公开了一种电子部件封装及其制造方法。 电子部件封装包括：基板; 设置在所述基板的至少一个表面上的连接构件; 通过所述连接部件与所述基板连接的有源元件; 以及覆盖有源元件的暴露表面的成型部件，其中，所述模制部件由热膨胀系数为8〜15ppm /℃，导热率为1〜5W / m℃的第一材料形成 因此，与使用根据现有技术的EMC的成型部件的情况相比，可能显着降低翘曲并且可以提高有源元件的散热性能。

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