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    ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件封装及其制造方法

    公开(公告)号：US20140145322A1

    公开(公告)日：2014-05-29

    申请号：US14069906

    申请日：2013-11-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Nam HWANG ,  Suk Jin HAM ,  Seung Wan WOO ,  Po Chul KIM ,  Kyung Ho LEE

    IPC: H01L23/08 ,  H01L21/56

    CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511

    Abstract: Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art.

    Abstract translation: 本文公开了一种电子部件封装及其制造方法。 电子部件封装包括：基板; 设置在所述基板的至少一个表面上的连接构件; 通过所述连接部件与所述基板连接的有源元件; 以及覆盖有源元件的暴露表面的成型部件，其中，所述模制部件由热膨胀系数为8〜15ppm /℃，导热率为1〜5W / m℃的第一材料形成 因此，与使用根据现有技术的EMC的成型部件的情况相比，可能显着降低翘曲并且可以提高有源元件的散热性能。

    CAMERA MODULE
    6.
    发明申请
    CAMERA MODULE 有权
    相机模块

    公开(公告)号：US20160142595A1

    公开(公告)日：2016-05-19

    申请号：US14642803

    申请日：2015-03-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Po Chul KIM ,  Yoo Chang KIM ,  Jung Seok LEE ,  Sung Hoon KIM ,  Man Su KIM ,  Jae Ho BAIK ,  Kyeong Jun KIM ,  Myung Ki LEE

    IPC: H04N5/225

    CPC classification number: H04N5/2252 ,  H04N5/2254 ,  H04N5/2257

    Abstract: A camera module includes a housing having a guide groove formed therein, the guide groove being extended lengthwise in an optical axis direction, a lens barrel mounted in the housing and having a guide protrusion inserted into the guide groove, and an elastic member disposed on the guide groove so that the guide protrusion may be prevented from being separated from the guide groove.

    Abstract translation: 相机模块包括具有形成在其中的引导槽的壳体，所述引导槽沿光轴方向纵向延伸，镜筒安装在所述壳体中并且具有插入所述引导槽中的引导突起，以及弹性构件， 引导槽，使得可以防止引导突起与引导槽分离。

    ACTUATOR AND CAMERA MODULE INCLUDING THE SAME
    7.
    发明申请
    ACTUATOR AND CAMERA MODULE INCLUDING THE SAME 审中-公开
    执行器和摄像机模块，包括它们

    公开(公告)号：US20160246029A1

    公开(公告)日：2016-08-25

    申请号：US14951675

    申请日：2015-11-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yoo Chang KIM ,  Kyeong Jun KIM ,  Jung Seok LEE ,  Sung Hoon KIM ,  Man Su KIM ,  Jae Ho BAIK ,  Po Chul KIM ,  Myung Ki LEE

    IPC: G02B7/08 ,  G02B27/64

    CPC classification number: G02B7/08

    Abstract: An actuator and camera module having a carrier accommodating a lens portion; a magnet disposed on an outer circumferential surface of the carrier; a housing comprising an opening formed in an upper surface of the housing wherein lateral surfaces of the carrier and the magnet are disposed within the housing; a coil portion disposed on a lateral surface of the housing configured to face the magnet; a flexible printed circuit board comprising a terminal portion, formed on one surface of the flexible printed circuit board, configured to supply power to the coil portion, wherein the flexible printed circuit board is coupled to the housing; and a reinforcing portion protruding from a lower surface of the housing to support a rear surface of the terminal portion.

    Abstract translation: 一种致动器和相机模块，具有容纳透镜部分的载体; 设置在所述载体的外周面上的磁体; 壳体，其包括形成在所述壳体的上表面中的开口，所述载体和所述磁体的侧表面设置在所述壳体内; 设置在壳体的侧表面上的线圈部分，构造成面对磁体; 柔性印刷电路板，包括形成在所述柔性印刷电路板的一个表面上的端子部分，其构造成向所述线圈部分供电，其中所述柔性印刷电路板耦合到所述壳体; 以及从所述壳体的下表面突出以支撑所述端子部分的后表面的加强部分。

    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
    9.
    发明申请
    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE 审中-公开
    测量温度系统和测量温度的方法

    公开(公告)号：US20140184782A1

    公开(公告)日：2014-07-03

    申请号：US14142714

    申请日：2013-12-27

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Seung Wan WOO ,  Po Chul KIM ,  Young Nam HWANG ,  Kyung Ho LEE ,  Suk Jin HAM

    IPC: H01L21/66 ,  H05K1/02

    CPC classification number: H01L22/12 ,  G01B11/167 ,  G01B11/254 ,  G01B11/306 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample.

    Abstract translation: 本文公开了一种用于测量翘曲的系统和用于测量翘曲的方法。 用于测量翘曲的系统包括：加热试样的加热板部分; 以及设置在样本和照相机之间以便与样本间隔开预定距离的参考门控部分，其中参考光栅部分包括彼此间隔开预定间隔的多条电线，从而 准确地测量翘曲而不受样品产生的烟雾影响。

    SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体芯片封装及其制造方法

    公开(公告)号：US20140061891A1

    公开(公告)日：2014-03-06

    申请号：US13800662

    申请日：2013-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Po Chul KIM ,  Kyung Ho Lee ,  Seung Wan Woo ,  Young Nam Hwang ,  Suk Jin Ham

    IPC: H01L23/00 ,  H01L21/56

    CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/48227 ,  H01L2924/3511

    Abstract: Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package.

    Abstract translation: 本文公开了一种半导体芯片封装及其制造方法。 半导体芯片封装的制造方法包括：a）将半导体芯片安装在印刷电路板（PCB）上; b）将翘曲抑制加强构件插入制造的模具的内部天花板中，以便封装其上安装有半导体芯片的PCB; c）将插入其天花板的具有翘曲抑制加强件的模具与PCB的上表面结合，以便围绕安装有半导体芯片的PCB; d）在模具中注射成型并填充模塑材料，并通过加热来硬化模塑材料，以及e）硬化模制材料，然后移除模具以完成半导体芯片封装。

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