MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF

    公开(公告)号:US20210065753A1

    公开(公告)日:2021-03-04

    申请号:US17012845

    申请日:2020-09-04

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

    APPARATUSES AND METHODS FOR ZQ CALIBRATION

    公开(公告)号:US20230138561A1

    公开(公告)日:2023-05-04

    申请号:US17938214

    申请日:2022-10-05

    Abstract: An apparatus and method for ZQ calibration, including determining a strong driver circuit and a weak driver circuit, which are related to an input/output (I/O) circuit connected to a signal pin, at power-up of the I/O circuit; providing a ZQ calibration code related to a sweep code to one from among the strong driver circuit and the weak driver circuit according to ZQ calibration conditions; and providing a ZQ calibration code related to a fixed code to an unselected circuit, thereby adjusting a termination resistance of the signal pin.

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