VERTICAL STRUCTURE NON-VOLATILE MEMORY DEVICE HAVING INSULATING REGIONS THAT ARE FORMED AS AIR GAPS
    17.
    发明申请
    VERTICAL STRUCTURE NON-VOLATILE MEMORY DEVICE HAVING INSULATING REGIONS THAT ARE FORMED AS AIR GAPS 审中-公开
    具有作为空气尺寸形成的绝缘区域的垂直结构非易失性存储器件

    公开(公告)号:US20150263021A1

    公开(公告)日:2015-09-17

    申请号:US14726065

    申请日:2015-05-29

    Abstract: A vertical structure non-volatile memory device includes semiconductor regions that vertically extend on a substrate, a plurality of memory cell strings that vertically extend on the substrate along sidewalls of the semiconductor regions and include a plurality of memory cells and at least one or more first selection transistors, which are disposed on sides of the memory cells and are adjacent to one another. A plurality of wordlines is connected to the memory cells of the memory cell strings. A first selection line is connected to the selection transistors of the memory cell strings and insulating regions are formed as air gaps between the first selection transistors of the adjacent memory cell strings.

    Abstract translation: 垂直结构的非易失性存储器件包括在衬底上垂直延伸的半导体区域,沿着半导体区域的侧壁在衬底上垂直延伸的多个存储单元串,并且包括多个存储单元和至少一个或多个第一 选择晶体管,它们设置在存储单元的侧面并彼此相邻。 多个字线连接到存储单元串的存储单元。 第一选择线连接到存储单元串的选择晶体管,绝缘区形成为相邻存储单元串的第一选择晶体管之间的气隙。

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