公开(公告)号：US20240010636A1

公开(公告)日：2024-01-11

申请号：US18312185

申请日：2023-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeon Sook Chung ,  Eunjeong Choi ,  Eunhye AN ,  Heechoon Ahn ,  Giwook Kang ,  Eunsuk Kwon ,  Yeseul Lee ,  Dongjin Jang ,  Seowon Cho ,  Yongsik Jung ,  Hwang Suk Kim ,  Hyeonho Choi ,  Byoungki Choi

IPC: C07D403/14 ,  H10K85/60 ,  H10K50/12 ,  C09K11/06 ,  H10K50/15 ,  H10K50/16

CPC classification number: C07D403/14 ,  H10K85/6572 ,  H10K50/12 ,  C07B2200/05 ,  H10K50/15 ,  H10K50/16 ,  C09K2211/1059 ,  C09K11/06

Abstract: A heterocyclic compound represented by Formula 1:




wherein E1 is a group represented by Formula A; k1 is an integer from 1 to 5; n1 is 2 or 3; n2 is an integer from 0 to 3; d1, d2, d3, d5, and d6 are each independently an integer from 0 to 4; d4 is an integer from 0 to 3; d7 is an integer from 0 to 5; wherein the heterocyclic compound represented by Formula 1 comprises at least one deuterium; * indicates a binding site to an adjacent atom; and the remaining substituents are as defined herein.

公开(公告)号：US20240002418A1

公开(公告)日：2024-01-04

申请号：US18065690

申请日：2022-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwang Suk Kim ,  Sangho Park ,  Minsik Min ,  Hyejin Bae ,  Soonok Jeon ,  Hyesung Choi ,  Hosuk Kang ,  Jong Soo Kim ,  Joonghee Won ,  Jun Chwae

IPC: C07F15/00 ,  H10K85/30 ,  H10K50/11

CPC classification number: C07F15/0086 ,  H01L51/5012 ,  H01L51/0087

Abstract: An organometallic compound represented by Formula 1:




wherein, M is a transition metal, X11 is N or C(R11), X12 is N or C(R12), at least one of X11 and X12 is N, ring CY2, ring CY31, ring CY32, and ring CY4 are each independently a C3-C60 carbocyclic group or a C1-C60 heterocyclic group, Y2 to Y4 are each independently C or N, A2 to A4 are each independently a chemical bond, O, or S, a1 to a3 are each independently an integer from 1 to 3, and the remaining substitutions are as provided in the detailed description.

公开(公告)号：US11858950B2

公开(公告)日：2024-01-02

申请号：US16909091

申请日：2020-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bum Woo Park ,  Hwang Suk Kim ,  Youngchun Kwon ,  Dongseon Lee ,  Dong-Seok Leem ,  Ohkyu Kwon ,  Kwang Hee Lee ,  Younsuk Choi ,  Hyesung Choi

IPC: H01L29/08 ,  C07F5/02 ,  H10K30/80 ,  H10K39/32 ,  H10K85/30

CPC classification number: C07F5/02 ,  H10K30/80 ,  H10K39/32 ,  H10K85/322

Abstract: Disclosed are a compound represented by Chemical Formula 1, a film, a photoelectric diode, an organic sensor, and an electronic device.




In Chemical Formula 1, Ar1 and Ar2, Z, L1, L2, and R1 to R6 are the same as defined in the detailed description.

公开(公告)号：US20230383218A1

公开(公告)日：2023-11-30

申请号：US18324260

申请日：2023-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungjoon Kang ,  Jiwon Kim ,  Sungmin Kim ,  Hwang Suk Kim ,  Jungmin Oh ,  Hyosan Lee ,  Byoungki Choi ,  Cheol Ham ,  Kyuyoung Hwang

IPC: C11D7/26 ,  C11D11/00

CPC classification number: C11D7/265 ,  C11D11/0047

Abstract: A cleaning composition for removing residues on surfaces contains a solvent and a cleaning accelerator, but does not contain an oxidant, wherein the cleaning accelerator includes at least one of a salt represented by Formula 1A or a salt represented by Formula 1B. A method of cleaning a metal-containing film includes preparing the cleaning composition, and bring the cleaning composition into contact with a metal-containing film provided on a substrate, the metal-containing film having a surface on which residues are generated. The Formulae 1A and 1B are:

公开(公告)号：US11623934B2

公开(公告)日：2023-04-11

申请号：US17334106

申请日：2021-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohkyu Kwon ,  Hwang Suk Kim ,  Dong-Seok Leem ,  Rae Sung Kim ,  Hyesung Choi

IPC: C07D519/00 ,  H01L51/44 ,  G02B5/22 ,  G02B5/20

Abstract: An infrared absorber includes a compound represented by Chemical Formula In Chemical Formula 1, Ar1, Ar2, X1, L1, L2, R1, R2, R3, and R4 are the same as defined in the detailed description.

公开(公告)号：US20250089551A1

公开(公告)日：2025-03-13

申请号：US18824412

申请日：2024-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwang Suk Kim ,  Sangmo Kim ,  Minsik Min ,  Hyejin Bae ,  Yeon Sook Chung ,  Hyesung Choi ,  Joon Heo ,  Hosuk Kang ,  Jong Soo Kim ,  Joonghyuk Kim ,  Youngmok Son ,  Yeonkyung Lee ,  Daun Jeong ,  Kyeongsik Ju

IPC: H10K85/30 ,  C07F15/00 ,  C09K11/02 ,  C09K11/06 ,  H10K50/11

Abstract: An organometallic compound represented by Formula 1: wherein M1 is a transition metal; Y1 to Y3 are each independently C or N; R4 is a substituted or unsubstituted C1-C60 alkyl group; ring CY2 to ring CY5 are each independently a C5-C60 carbocyclic group or a C1-C60 heterocyclic group; L1 is a single bond, O, S, Se, N(R61), B(R61), C(R61)(R62), or Si(R61)(R62); a1 is 1, 2, 3, 4, or 5; b10, b20, b30, b40, and b50 are each independently 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10; and the remaining substituent groups of Formula 1 are as provided herein.

公开(公告)号：US12120951B2

公开(公告)日：2024-10-15

申请号：US17160860

申请日：2021-01-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwang Suk Kim ,  Bum Woo Park ,  Ohkyu Kwon ,  Changki Kim ,  In Sun Park ,  Dong-Seok Leem

IPC: H10K85/60 ,  C07D513/04 ,  C07D513/22 ,  C07D517/04 ,  H10K30/20

CPC classification number: H10K85/657 ,  C07D513/04 ,  C07D513/22 ,  C07D517/04 ,  H10K30/20

Abstract: An infrared absorber includes a compound represented by Chemical Formula 1. An infrared absorbing/blocking film, a photoelectric device, an organic sensor, and an electronic device may include the infrared absorber.




In Chemical Formula 1, Ar, X1, X2, Y1, Y2, R1, R2, R11, R12, R13, and R14 are the same as defined in the detailed description.

公开(公告)号：US20240244858A1

公开(公告)日：2024-07-18

申请号：US18515929

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyejin Bae ,  Sangho Park ,  Hwang Suk Kim ,  Minsik Min ,  Hyesung Choi ,  Hosuk Kang ,  Jong Soo Kim ,  Joonghyuk Kim ,  Youngmok Son ,  Joonghee Won ,  Daun Jeong ,  Yongsik Jung ,  Jun Chwae

IPC: H10K50/11 ,  C07F15/00 ,  H10K50/15 ,  H10K50/16 ,  H10K85/30

CPC classification number: H10K50/11 ,  C07F15/0086 ,  H10K50/15 ,  H10K50/16 ,  H10K85/346

Abstract: An organometallic compound represented by Formula 1:




wherein, M1 is a transition metal; X11 is N or C(R11); X12 is N or C(R12); X21 is N or C(R21); X22 is N or C(R22); X23 is N or C(R23); at least one of X21 and X22 is N; Y2 to Y4 are each independently C or N; A2 to A4 are each independently a chemical bond, O, or S; ring CY3 and ring CY4 are each independently a C5-C30 carbocyclic group or a C1-C30 heterocyclic group; a1, a2, and a3 are each independently an integer from 1 to 3; R13 is a group represented by Formula 2, and the remaining substituents are as defined herein.

公开(公告)号：US11820859B2

公开(公告)日：2023-11-21

申请号：US17242724

申请日：2021-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Jun Lee ,  Ohkyu Kwon ,  Rae Sung Kim ,  Hwang Suk Kim ,  In Sun Park ,  Dong-Seok Leem

IPC: C08G61/12 ,  G02B5/22 ,  G02B5/20 ,  H10K85/20

CPC classification number: C08G61/126 ,  G02B5/208 ,  G02B5/223 ,  H10K85/211 ,  C08G2261/3223 ,  C08G2261/3225 ,  C08G2261/3243 ,  C08G2261/3246 ,  C08G2261/50 ,  C08G2261/94

Abstract: An infrared absorbing polymer includes a first structural unit represented by Chemical Formula 1 and a second structural unit including at least one of Chemical Formula 2A to Chemical Formula 2. The infrared absorbing polymer may be included in an infrared absorbing/blocking film, a photoelectric device, a sensor, and an electronic device.

公开(公告)号：US20230313040A1

公开(公告)日：2023-10-05

申请号：US18194908

申请日：2023-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuyoung Hwang ,  Byungjoon Kang ,  Daihyun Kim ,  Sungmin Kim ,  Hwang Suk Kim ,  Mihyun Park ,  Jungmin Oh ,  Hyosan Lee ,  Byoungki Choi

IPC: C09K13/00 ,  H01L21/311

CPC classification number: C09K13/00 ,  H01L21/31111

Abstract: Provided are an etching composition including an oxidizing agent, an ammonium salt, an aqueous solvent, and an accelerator, a method of preparing a metal-containing film etching by using the same, and a method of manufacturing a semiconductor device by using the same.