SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME
    12.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    具有多细胞阵列的半导体发光器件及其制造方法

    公开(公告)号:US20140070244A1

    公开(公告)日:2014-03-13

    申请号:US14081430

    申请日:2013-11-15

    Abstract: A semiconductor light emitting device includes a substrate and a plurality of light emitting cells arranged on the substrate. Each of the light emitting cells includes a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light. An interconnection structure electrically connects the first-conductivity-type and the second-conductivity-type semiconductor layers of one light emitting cell to the first-conductivity-type and the second-conductivity-type semiconductor layers of another light emitting cell. A light conversion part is formed in a light emitting region defined by the light emitting cells and includes a red and/or a green light conversion part respectively having a red and/or a green light conversion material.

    Abstract translation: 半导体发光器件包括衬底和布置在衬底上的多个发光单元。 每个发光单元包括第一导电型半导体层,第二导电型半导体层和设置在其间的有源层发射蓝色光。 互连结构将一个发光单元的第一导电型和第二导电型半导体层电连接到另一发光单元的第一导电型和第二导电型半导体层。 在由发光单元限定的发光区域中形成光转换部分,并且包括分别具有红色和/或绿色光转换材料的红色和/或绿色光转换部分。

    LIGHT EMITTING DEVICE
    13.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20130234611A1

    公开(公告)日:2013-09-12

    申请号:US13789601

    申请日:2013-03-07

    CPC classification number: H05B33/083 H05B33/0809 H05B33/0821

    Abstract: Light emitting devices. A light emitting device including a power source; and a plurality of light emitting diode (LED) arrays coupled to the power source unit; and at least one delay unit. Each delay unit is coupled to a corresponding light emitting diode array of the light emitting diode arrays.

    Abstract translation: 发光装置。 一种发光装置,包括电源; 以及耦合到所述电源单元的多个发光二极管(LED)阵列; 和至少一个延迟单元。 每个延迟单元耦合到发光二极管阵列的对应的发光二极管阵列。

    SEMICONDUCTOR PACKAGE
    14.
    发明申请

    公开(公告)号:US20210384143A1

    公开(公告)日:2021-12-09

    申请号:US17168337

    申请日:2021-02-05

    Abstract: A semiconductor package includes a first substrate including a circuit pattern and a dummy pattern on an upper face of the first substrate, a solder ball, a second substrate on the first substrate, and an underfill material layer between the first and second substrates. The underfill material layer wraps around the solder ball. The dummy pattern is not electrically connected to the circuit pattern. The first substrate includes a solder resist layer on the circuit pattern and the dummy pattern. The solder resist layer includes a first opening for exposing at least a part of the circuit pattern. The solder ball is in the first opening and electrically insulated from the dummy pattern by the solder resist layer. The second substrate is electrically connected to the first substrate by the solder ball. The second substrate is electrically insulated from the dummy pattern by the solder resist layer.

    CLOTHES TREATING APPARATUS
    15.
    发明申请

    公开(公告)号:US20180334767A1

    公开(公告)日:2018-11-22

    申请号:US15982889

    申请日:2018-05-17

    CPC classification number: D06B1/02 D06B23/04 H04N5/225

    Abstract: Disclosed herein is a clothes treating apparatus having a movable nozzle for spraying air jets to the garment hung on one or more hangers. The clothes treating apparatus includes a main body having a garment container, a door hinged with the main body to be rotated in front of the garment container and having a display on the front side of the door, a nozzle unit having a nozzle configured to spray air to a garment contained in the garment container, a nozzle transportation unit configured to reciprocate the nozzle unit, and a hose supplying air from a fan located on the bottom of the main body to the nozzle unit, wherein a direction of transportation of the nozzle unit intersects the direction of gravity.

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