公开(公告)号：US12264747B2

公开(公告)日：2025-04-01

申请号：US17724214

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: F16K3/02 ,  F16K27/00 ,  F16K51/02 ,  H01L21/67

Abstract: A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

公开(公告)号：US20240379384A1

公开(公告)日：2024-11-14

申请号：US18608633

申请日：2024-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongseong Ko ,  Daeyong Kim ,  Donghyun Kim ,  Pyungkang Kim ,  Kihong Park ,  Jungjoon Park ,  Jungjun Park ,  Jooyoung Park ,  Hoseok Song ,  Kongwoo Lee ,  Hyunyoung Lee ,  Chuyoung Choung ,  Jeongmin Hwang ,  Jisu Kim ,  Junhyeok Park ,  Chiho Ahn

IPC: H01L21/67

Abstract: The present disclosure relates to wire grippers, wire processing apparatuses, and wire processing methods. An example wire gripper comprises a gripper body, a wire supply in the gripper body and supplying a wire, a wire cutting section including a cutter that cuts the wire supplied from the wire supply, a pressure roller below the wire supply and providing a guide groove to guide the wire supplied from the wire supply, a twister on a side of the pressure roller, and a reloader that drives an end of the wire to move from the wire supply to the twister. The twister holds and twists the end of the wire guided by the pressure roller.

公开(公告)号：US20240021452A1

公开(公告)日：2024-01-18

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/687 ,  B65G47/90

CPC classification number: H01L21/67259 ,  H01L21/67201 ,  H01L21/68707 ,  B65G47/905 ,  B65G47/907

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20230230865A1

公开(公告)日：2023-07-20

申请号：US18062285

申请日：2022-12-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Jinhyuk CHOI ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Duckjin Kim ,  Kyusang Lee ,  Hyunjoo Jeon

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67745

Abstract: A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.

公开(公告)号：US20230072147A1

公开(公告)日：2023-03-09

申请号：US17718574

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Jonghwi Seo ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

公开(公告)号：US20170173796A1

公开(公告)日：2017-06-22

申请号：US15278402

申请日：2016-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Jun Kim ,  Doojin Kim ,  Kongwoo Lee ,  Joohyung Kim ,  Kyungbin Park ,  Nam-Su Yuk

IPC: B25J9/16 ,  B65G47/90 ,  G05D1/02

CPC classification number: B25J9/1697 ,  B25J9/1612 ,  B25J9/162 ,  B25J9/1679 ,  B65G47/905 ,  G05B2219/40053 ,  G05B2219/40538 ,  G05B2219/40613 ,  G05D1/0225 ,  G05D1/0234 ,  G05D1/0246 ,  G05D2201/0216 ,  Y10S901/01

Abstract: The present disclosure relates to a transfer robot and a method for controlling the same. The transfer robot includes a robot main body and a driving unit configured to move the robot main body toward a stage. The robot main body includes a distance sensor unit configured to obtain distance information between the robot main body and the stage, a first image acquisition unit configured to receive an image of a first mark of the stage and obtain a first image information, a manipulation unit configured to pick up a target object disposed on the stage, and a control unit configured to control the driving unit using the distance information and the first image information and thereby to causing the robot main body to be placed at a desired position spaced apart from the stage.