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11.发明授权公开(公告)号：US10757846B2
公开(公告)日：2020-08-25
申请号：US16535528
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号：US11709530B2
公开(公告)日：2023-07-25
申请号：US17554389
申请日：2021-12-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/32 , G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
CPC classification number: G06F1/206 , G06F1/324 , G06F1/3296 , G06F1/26
Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.
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公开(公告)号：US11451074B2
公开(公告)日：2022-09-20
申请号：US16880260
申请日：2020-05-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kihyun Kim , Kyungha Koo , Wooram Lee , Changhyung Lee , Jihye Kim , Jihong Kim , Yunjeong Noh , Seho Park , Kumjong Sun , Ju-Hyang Lee , Mincheol Ha , Sangmoo Hwangbo
Abstract: An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
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公开(公告)号：US11262823B2
公开(公告)日：2022-03-01
申请号：US16109176
申请日：2018-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.
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公开(公告)号：US11221655B2
公开(公告)日：2022-01-11
申请号：US16109176
申请日：2018-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heetae Kim , Kuntak Kim , Mansu Yang , Seungchul Choi , Kyungha Koo , Soongyu Kwon , Soohyun Moon , Kyungsoo Seo , Myungkee Lee , Jihwan Lim , Hyuntae Jang , Kyejeong Jeong
IPC: G06F1/20 , G06F1/3296 , G06F1/324 , G06F1/26
Abstract: A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20200053919A1
公开(公告)日：2020-02-13
申请号：US16535528
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd
Inventor： Haejin LEE , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号：US20180288898A1
公开(公告)日：2018-10-04
申请号：US15938192
申请日：2018-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan Jeong , Kyungha Koo , Kiyoun Jang , Se-Young Jang , Han-Shil Choi
Abstract: According to various embodiments an electronic device may include a first housing comprising a hollow portion configured to receive an external electronic device, and a second housing disposed at an angle defined by a portion coupled with at least part of the hollow portion. The second housing may include a first cover facing at least part of the hollow portion and comprising a plurality of first openings, a second cover received in the first cover and comprising a plurality of second openings, and an electric fan motor disposed in a space between the first cover and the second cover, the electric fan motor configured to discharge at least part of intake air from at least some of the first openings to at least some of the second openings.
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公开(公告)号：US11881612B2
公开(公告)日：2024-01-23
申请号：US17402055
申请日：2021-08-13
Applicant: Samsung Electronics Co., Ltd. , Amotech Co., Ltd.
Inventor： Seunghoon Kang , Jinhyoung Lee , Kyungha Koo , Jinmyoung Kim , Hongki Moon , Yoonsun Park , Seyoung Jang , Seungjae Hwang
Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
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公开(公告)号：US20240008232A1
公开(公告)日：2024-01-04
申请号：US18370143
申请日：2023-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hajoong YUN , Yoonsun Park , Seunghoon Kang , Kyungha Koo , Hongki Moon , Jongkil Park , Yongjae Song
CPC classification number: H05K7/20972 , H05K5/0217 , H04M1/0268
Abstract: An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.
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公开(公告)号：US11555657B2
公开(公告)日：2023-01-17
申请号：US17375626
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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