Abstract:
An equalizer includes a first pulse width controller that is configured to generate a first signal by increasing a first pulse width of a first data signal having a first logic level, the first data signal corresponding to a current data bit, a second pulse width controller that is configured to generate a second signal by increasing a second pulse width of the first data signal having a second logic level, a first sampler that is configured to generate a first sampled signal by sampling the first signal, a second sampler that is configured to generate a second sampled signal by sampling the second signal, and a multiplexer that is configured to output the first sampled signal or the second sampled signal based on a value of a previous data bit.
Abstract:
A data signal transmitter includes a standby voltage generator, which is configured to selectively output: (i) a data signal during an active operation mode, and (ii) first and second different standby voltages during a standby operation mode, and a repeater block. The repeater block includes: a first CMOS inverter configured to receive the first standby voltage during the standby operation mode, and a second CMOS inverter configured to receive the second standby voltage during the standby operation mode.
Abstract:
Provided is a memory device including a first pad configured to receive a read enable signal from a memory controller, a second pad configured to receive a read duty cycle correct command signal from the memory controller, a first duty correction circuit configured to perform a read duty cycle correct operation, based on the read duty cycle correct command signal received from the memory controller, when the read enable signal is received, and output a data strobe signal generated based on the read duty cycle correct operation, and a second duty correction circuit configured to receive the data strobe signal from the first duty correction circuit, generate first to fourth clock signals having different phases from each other based on the data strobe signal, and perform a write duty cycle correct operation to correct a duty cycle for the first clock signal and the third clock signal which have a phase difference of 180° and to correct a duty cycle for the second clock signal and the fourth clock signal which have a phase difference of 180°, wherein the read duty cycle correct operation and the write duty cycle correct operation are performed simultaneously.
Abstract:
Provided is a memory device including a first pad configured to receive a read enable signal from a memory controller, a second pad configured to receive a read duty cycle correct command signal, a first duty correction circuit configured to perform a read duty cycle correct operation, based on the read duty cycle correct command received from the memory controller, when the read enable signal is received, and output a data strobe signal generated based on the read duty cycle correct operation, and a second duty correction circuit configured to receive the data strobe signal from the first duty correction circuit, generate a divided data strobe signal by dividing the received data strobe signal, and compare the received data strobe signal with the divided data strobe signal to perform a write duty cycle correct operation.
Abstract:
A semiconductor device includes an internal clock generation circuit configured to generate an internal clock; a plurality of unit circuits configured to have a first unit circuit and a second unit circuit operating while being synchronized with an internal clock; a plurality of transfer circuits including a first transfer circuit configured to provide a first transfer path having a first delay time, and a second transfer circuit configured to provide a second transfer path having a second delay time different from the first delay time; and a delay compensation circuit configured to compare a first clock input to the first unit circuit through the first transfer path with a second clock input to the second unit circuit through the second transfer path, and to adjust the second delay time so that the adjusted second delay time matches the first delay time.
Abstract:
A semiconductor memory module includes data buffers that exchange first data signals with an external device, nonvolatile memory devices that are respectively connected to the data buffers through data lines, and a controller connected to the data lines. The controller receives an address, a command, and a control signal from the external device, and depending on the address, the command, and the control signal, the controller controls the data buffers through first control lines and controls the nonvolatile memory devices through second control lines.
Abstract:
A semiconductor device of the inventive concept includes a timing circuit configured to receive a first timing signal of a first pulse width from an external device and output a second timing signal having a pulse width which is gradually being reduced from a second pulse width longer than the pulse width of the first timing signal, and a data input/output circuit receiving the second timing signal and outputting data to the external device in synchronization with the second timing signal.
Abstract:
A nonvolatile memory device includes a data path; and a FIFO memory including a plurality of registers connected to the data path. The plurality of registers sequentially receive data from the data path in response to data path input clocks and sequentially output the received data to an input/output pad in response to data path output clocks. The data path output clocks are clocks that are generated by delaying the data path input clocks as long as a delay time.