中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.02 seconds)

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
    11.
    发明公开
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230352432A1

    公开(公告)日：2023-11-02

    申请号：US18218909

    申请日：2023-07-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sangkyu Lee ,  Jingu Kim ,  Yongkoon Lee

    IPC: H01L23/00 ,  H01L23/31

    CPC classification number: H01L24/20 ,  H01L23/3121 ,  H01L24/08 ,  H01L2224/221 ,  H01L2224/081 ,  H01L2224/48227 ,  H01L24/13 ,  H01L25/0657

    Abstract: A semiconductor package includes a support member, a semiconductor chip arranged in the support member such that a front surface and a backside surface of the semiconductor chip are exposed from a second surface of the support member and a first surface opposite to the second surface respectively, a lower redistribution wiring layer covering the second surface of the support member and including first redistribution wirings electrically connected to chip pads provided at the front surface of the semiconductor chip and vertical connection structures of the support member respectively, and an upper redistribution wiring layer covering the first surface of the support substrate, and including second redistribution wirings electrically connected to the vertical connection structures and a thermal pattern provided on the exposed backside surface of the semiconductor chip.

    Semiconductor package with an antenna substrate
    13.
    发明申请
    Semiconductor package with an antenna substrate 有权

    公开(公告)号：US20230096506A1

    公开(公告)日：2023-03-30

    申请号：US18061763

    申请日：2022-12-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myungsam Kang ,  Sangkyu Lee ,  Yongkoon Lee

    IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L23/31

    Abstract: A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

    SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
    14.
    发明申请
    SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY 有权

    公开(公告)号：US20250062240A1

    公开(公告)日：2025-02-20

    申请号：US18611488

    申请日：2024-03-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： MyungDo Cho ,  Youngchan Ko ,  Byung Ho Kim ,  Yongkoon Lee ,  Jeongho Lee

    IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

    Abstract: An example semiconductor package includes a first redistribution layer, a bridge chip attached to a top surface of the first redistribution layer, a mold layer on the first redistribution layer and enclosing the bridge chip, a second redistribution layer disposed on the mold layer, a conductive post extending through the mold layer vertically and connecting the first redistribution layer and the second redistribution layer, and a first semiconductor chip mounted on the second redistribution layer. The first redistribution layer includes a pad layer and an interconnection layer disposed on the pad layer. The pad layer includes a first insulating layer and pads in the first insulating layer. Top surfaces of the pads are exposed to an outside of a top surface of the first insulating layer, and bottom surfaces of the pads are exposed to an outside of a bottom surface of the first insulating layer.

    Semiconductor package including antenna
    15.
    发明授权
    Semiconductor package including antenna 有权

    公开(公告)号：US12154873B2

    公开(公告)日：2024-11-26

    申请号：US18125989

    申请日：2023-03-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

    IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q9/04 ,  H01Q19/00

    Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

    SEMICONDUCTOR PACKAGE
    18.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220262748A1

    公开(公告)日：2022-08-18

    申请号：US17737472

    申请日：2022-05-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myungsam KANG ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/522

    Abstract: A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

    SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
    19.
    发明申请
    SEMICONDUCTOR PACKAGE INCLUDING ANTENNA 有权

    公开(公告)号：US20250046737A1

    公开(公告)日：2025-02-06

    申请号：US18925155

    申请日：2024-10-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongkoon Lee ,  Jingu Kim ,  Sangkyu Lee ,  Seokkyu Choi

    IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01Q9/04 ,  H01Q19/00

    Abstract: A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

Patent Agency Ranking