公开(公告)号：US20230384212A1

公开(公告)日：2023-11-30

申请号：US18097924

申请日：2023-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donghyun LEE ,  Sungyoon Ryu ,  Sooseok Lee ,  Younghoon Sohn

IPC: G01N21/17 ,  G01N21/95 ,  H01L21/66 ,  H10B43/27

CPC classification number: G01N21/1702 ,  G01N21/9501 ,  H01L22/30 ,  H01L22/12 ,  H10B43/27 ,  G01N2021/1706

Abstract: An inspection method is provided. The inspection method includes inspecting a plurality of first observation sites by detecting ultrasonic signals emitted from the plurality of first observation sites, inspecting a plurality of second observation sites by detecting ultrasonic signals emitted from the plurality of second observation sites; and inspecting a target structure by detecting an ultrasonic signal emitted from the target structure, where the target structure includes a structure of interest, and wherein the plurality of first observation sites are intermediate results of forming the target structure, respectively, and the plurality of second observation sites are structures modified from the target structure.

公开(公告)号：US20230184691A1

公开(公告)日：2023-06-15

申请号：US17881367

申请日：2022-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusin Yang ,  Sungyoon Ryu ,  Younghoon Sohn

IPC: G01N21/88 ,  G01N21/956 ,  G01N21/95 ,  G06T7/00

CPC classification number: G01N21/8806 ,  G01N21/956 ,  G01N21/9501 ,  G06T7/0004 ,  G01N2021/8887 ,  G01N2021/8835 ,  G01N2021/8848 ,  G06T2200/04 ,  G06T2207/30148 ,  G06T2207/10152 ,  G06T2207/10012 ,  G06T2207/10148

Abstract: A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to align light incident onto the wafer to be in-focus; and an image processor configured to integrate the optical intensity image with vertical level data of the in-focus to generate and analyze a three-dimensional (3D) image.

公开(公告)号：US20180096903A1

公开(公告)日：2018-04-05

申请号：US15832938

申请日：2017-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon Sohn ,  Jinsung Kim ,  Yusin Yang ,  Chungsam Jun

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768 ,  H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L21/48 ,  H01L21/02

CPC classification number: H01L22/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/4846 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67259 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76895 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/11 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2224/96 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15747

Abstract: A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

公开(公告)号：US20240035957A1

公开(公告)日：2024-02-01

申请号：US18118816

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunhong JUN ,  Jaeho Kim ,  Younghoon Sohn

IPC: G01N21/25 ,  G01N21/27

CPC classification number: G01N21/255 ,  G01N21/27 ,  G01N21/9501

Abstract: A dual resolution spectrometer includes a slit plate comprising a slit receiving light reflected from a measurement target. The slit plate directs the light reflected from the measurement target to a first mirror. The first mirror reflects light from the slit to a diffraction grating. The diffraction grating disperses light from the first mirror according to a wavelength of the light. The diffraction grating directs light in a first wavelength region to a second mirror and directs light in a second wavelength region to a third mirror. The second mirror reflects the light in the first wavelength region to a detector. The third mirror reflects the light in the second wavelength region to the detector. The detector detects the light in the first wavelength region and the light in the second wavelength region with different resolutions from each other.

公开(公告)号：US11486834B2

公开(公告)日：2022-11-01

申请号：US16709222

申请日：2019-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghoon Sohn ,  Yusin Yang ,  Chihoon Lee

IPC: G01N21/95 ,  H01L21/67 ,  G01N21/45

Abstract: Disclosed are a substrate inspection method and a method of fabricating a semiconductor device using the same. The inspection method may include measuring a target area of a substrate using a pulsed beam to obtain a first peak, measuring a near field ultrasound, which is produced by the pulsed beam in a near field region including the target area, using a first continuous wave beam different from the pulsed beam to obtain a second peak, and measuring a far field ultrasound, which is produced by the near field ultrasound in a far field region outside the near field region, using a second continuous wave beam to examine material characteristics of the substrate.

公开(公告)号：US11004712B2

公开(公告)日：2021-05-11

申请号：US16532920

申请日：2019-08-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon Ryu ,  Joonseo Song ,  Souk Kim ,  Younghoon Sohn ,  Yusin Yang ,  Chihoon Lee

IPC: H01L21/67 ,  G01B11/24 ,  G06T7/00

Abstract: Disclosed are methods of inspecting semiconductor wafers, inspection systems for performing the same, and methods of fabricating semiconductor devices using the same. A method of inspecting a semiconductor wafer including preparing a wafer including zones each having patterns, obtaining representative values for the patterns, scanning the patterns under an optical condition to obtain optical signals for the patterns, each of the optical signals including optical parameters, selecting a representative optical parameter that is one of the optical parameters that has a correlation with the representative values, obtaining a reference value of the representative optical parameter for a reference pattern, and obtaining a defect of an inspection pattern by comparing the reference value with an inspection value of the representative optical parameter for the inspection pattern.

公开(公告)号：US10460436B2

公开(公告)日：2019-10-29

申请号：US15691958

申请日：2017-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon Sohn ,  Ilsoo Kim ,  Yusin Yang

IPC: G06T7/00 ,  H01L21/66 ,  H01L23/498 ,  H01L23/00

Abstract: Disclosed are an inspection method, an inspection system, and a method of fabricating a semiconductor package using the same. The inspection method comprises obtaining a reference value by measuring a surface profile of a reference pattern, scanning reference images of the reference pattern by using a plurality of optical inspection conditions, obtaining estimation values of the reference pattern that are measured from the reference images, selecting an desired optical inspection condition among the plurality of optical inspection conditions by comparing the reference value with the estimation values, scanning a target image of a target pattern by using the desired optical inspection condition, and obtaining an error value by quantitatively comparing the target image with a design image of the target pattern.

公开(公告)号：US10088297B2

公开(公告)日：2018-10-02

申请号：US15464896

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon Ryu ,  Younghoon Sohn ,  Yusin Yang ,  Chungsam Jun ,  Yunjung Jee

IPC: G01B9/02 ,  G01B11/06

Abstract: Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

公开(公告)号：US09892980B2

公开(公告)日：2018-02-13

申请号：US15437566

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon Sohn ,  Jinsung Kim ,  Yusin Yang ,  Chungsam Jun

IPC: H01L21/66 ,  H01L21/768 ,  H01L21/027 ,  H01L21/311 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L21/56 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L22/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/4846 ,  H01L21/565 ,  H01L21/67259 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76895 ,  H01L22/20 ,  H01L24/06 ,  H01L24/11 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15747

Abstract: A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

公开(公告)号：US20250076116A1

公开(公告)日：2025-03-06

申请号：US18442539

申请日：2024-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunhong Jun ,  Sung Yoon Ryu ,  Younghoon Sohn ,  Eunsoo Hwang

IPC: G01J3/28 ,  G01J3/02

Abstract: An optical module includes: a diffraction grating configured to rotate and focus a beam, which is incident thereon from an incident path, onto a Fourier plane, a digital micromirror array (DMD) configured to assign a frequency for each wavelength of the focused beam received at the Fourier plane, and perform a Fourier transform for each frequency, and a first optical fiber configured to receive a beam that is reflected back from the DMD back and the diffraction grating, and along the incident path.