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    CAVITY FILTER AND ANTENNA MODULE INCLUDING THE SAME
    11.
    发明申请
    CAVITY FILTER AND ANTENNA MODULE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200235484A1

    公开(公告)日：2020-07-23

    申请号：US16747887

    申请日：2020-01-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seungtae KO ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H01Q15/00

    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A cavity filter is provided. The cavity filter includes a plate of the cavity filter and including a feeder part for supplying an electrical signal, a housing forming an exterior of the cavity filter and coupled to the plate to form a shielded space inside the cavity filter, and a metal structure having a first end coupled to an inside of the housing and a second end that extends toward the feeder part and resonates to filter frequencies in the shielded space.

    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING SAME
    12.
    发明申请
    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20200007193A1

    公开(公告)日：2020-01-02

    申请号：US16485009

    申请日：2018-02-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seungku HAN ,  Byungchul KIM ,  Seungtae KO ,  Youngju LEE

    IPC: H04B5/00 ,  H02J50/10 ,  H02J7/02 ,  H01F38/14 ,  H01F27/36

    Abstract: Various embodiments of the present invention relate to an antenna device and an electronic device including the same. Specifically, various embodiments of the present invention relate to an antenna device for providing short-range wireless communication of a millimeter wave (mmWave) band and an electronic device including the same. An antenna device for providing short-range wireless communication, according to various embodiments of the present invention, comprises: a first member comprising a first surface; a second member which comprises a hole or groove formed on at least a partial area thereof and a second surface facing the first surface; and an antenna module disposed at the position of the hole or groove, wherein the first surface and the second surface are spaced a predetermined distance apart from each other to induce an electromagnetic wave for the short-range wireless communication.

    SEPARABLE ANTENNA AND ELECTRONIC DEVICE COMPRISING SAME
    14.
    发明公开
    SEPARABLE ANTENNA AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20230299506A1

    公开(公告)日：2023-09-21

    申请号：US18192910

    申请日：2023-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanghoon PARK ,  Kwanghyun BAEK ,  Juneseok LEE ,  Dohyuk HA ,  Jungho PARK ,  Youngju LEE ,  Jungyub LEE ,  Jinsu HEO

    IPC: H01Q21/28 ,  H01Q1/22

    CPC classification number: H01Q21/28 ,  H01Q1/2283

    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.

    ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
    18.
    发明申请
    ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20230112285A1

    公开(公告)日：2023-04-13

    申请号：US18075850

    申请日：2022-12-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bumhee LEE ,  Seungtae KO ,  Junsig KUM ,  Yoongeon KIM ,  Seokmin LEE ,  Youngju LEE ,  Jongmin LEE ,  Seungho CHOI

    IPC: H01Q21/00 ,  H01Q1/24

    Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.

    COVER APPARATUS FOR OPTIMAL BEAM IMPLEMENTATION FOR ANTENNA IN WIRELESS COMMUNICATION SYSTEM
    19.
    发明申请
    COVER APPARATUS FOR OPTIMAL BEAM IMPLEMENTATION FOR ANTENNA IN WIRELESS COMMUNICATION SYSTEM 有权

    公开(公告)号：US20230030388A1

    公开(公告)日：2023-02-02

    申请号：US17786870

    申请日：2020-12-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanghoon PARK ,  Juneseok LEE ,  Dohyuk HA ,  Jinsu HEO ,  Youngju LEE

    IPC: H01Q1/42

    Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.

    ANTENNA MODULE AND DEVICE INCLUDING SAME
    20.
    发明申请
    ANTENNA MODULE AND DEVICE INCLUDING SAME 有权

    公开(公告)号：US20230019144A1

    公开(公告)日：2023-01-19

    申请号：US17946688

    申请日：2022-09-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juneseok LEE ,  Youngsub KIM ,  Sanghoon PARK ,  Jungho PARK ,  Kwanghyun BAEK ,  Youngju LEE ,  Jungyub LEE ,  Dohyuk HA ,  Jinsu HEO

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/38

    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

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