公开(公告)号：US20100117222A1

公开(公告)日：2010-05-13

申请号：US12638112

申请日：2009-12-15

申请人： Seah Sun Too ,  Hsiang Wan Liau ,  Janet Kirkland ,  Tek Seng Tan ,  Maxat Touzelbaev ,  Raj N. Master

发明人： Seah Sun Too ,  Hsiang Wan Liau ,  Janet Kirkland ,  Tek Seng Tan ,  Maxat Touzelbaev ,  Raj N. Master

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L23/373 ,  H01L23/40

CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511

摘要： Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.

摘要翻译： 提供热界面材料及其在包装中的使用方法。 在一个方面，提供一种热界面材料，其包括具有第一表面和与第一表面相对的第二表面的铟预制件，内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。

公开(公告)号：US20070284737A1

公开(公告)日：2007-12-13

申请号：US11422795

申请日：2006-06-07

申请人： Seah Sun Too ,  Hsiang Wan Liau ,  Janet Kirkland ,  Tek Seng Tan ,  Maxat Touzelbaev ,  Raj N. Master

发明人： Seah Sun Too ,  Hsiang Wan Liau ,  Janet Kirkland ,  Tek Seng Tan ,  Maxat Touzelbaev ,  Raj N. Master

IPC分类号： H01L23/48

CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511

摘要： Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.

摘要翻译： 提供热界面材料及其在包装中的使用方法。 在一个方面，提供一种热界面材料，其包括具有第一表面和与第一表面相对的第二表面的铟预制件，内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。

公开(公告)号：US20130309814A1

公开(公告)日：2013-11-21

申请号：US13952392

申请日：2013-07-26

申请人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

发明人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

IPC分类号： H01L21/50

CPC分类号： H01L21/50 ,  H01L23/10 ,  H01L23/42 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/9205 ,  H01L2224/92225 ,  H01L2924/1082 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.

摘要翻译： 提供了将盖附接到集成电路基板的各种方法。 一方面，提供了将盖附着到具有位于其上的集成电路的基板的方法。 将粘合剂施加到基板上，并将铟膜施加到集成电路。 盖子位于粘合剂上。 粘合剂被部分硬化并且铟膜被回流。 粘合剂固化。

公开(公告)号：US07860599B2

公开(公告)日：2010-12-28

申请号：US11693156

申请日：2007-03-29

申请人： Seah Sun Too

发明人： Seah Sun Too

IPC分类号： G06F19/00

CPC分类号： H01L21/50 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

摘要： Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

摘要翻译： 提供了用于组装半导体芯片封装的装置和方法。 一方面，提供一种制造方法，其包括将第一组半导体芯片封装衬底放置在第一处理站的第一组插座中。 第一组半导体芯片封装衬底中的每一个具有第一覆盖区。 第一组的容器的尺寸被设计成适应第一印迹。 第二组半导体芯片封装基板被放置在第一处理站的第二组插座中。 第二组半导体芯片封装衬底中的每一个具有大于第一覆盖区的第二覆盖区。 第二组的容器的尺寸被设计成适应第二印迹。 将第一组盖放置在第一组半导体芯片封装基板上，将第二组盖放置在第二组半导体芯片封装基板上。

公开(公告)号：US06870258B1

公开(公告)日：2005-03-22

申请号：US10458802

申请日：2003-06-16

申请人： Seah Sun Too

发明人： Seah Sun Too

IPC分类号： H01L21/50 ,  H01L23/12

CPC分类号： H01L21/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

摘要： A fixture suitable for coupling a lid to a substrate having a semiconductor chip coupled thereto and a method for coupling the lid to the substrate. A support structure has a cavity having a floor and a pedestal protruding from the floor. A guide extends from the support structure. A compression mechanism is coupled to the guide wherein the compression mechanism includes an actuator plate coupled to a compression plate by a compressible means. An actuator is coupled to the compression mechanism. A packaging substrate having a semiconductor chip is mounted to the packaging substrate and a lid is mounted over the semiconductor chip to form a semiconductor component. The semiconductor component is placed on a support structure and the actuator is activated to urge the compression plate to apply a uniform force against the lid.

摘要翻译： 一种适于将盖子耦合到具有耦合到其上的半导体芯片的基板的固定器以及用于将盖子耦合到基板的方法。 支撑结构具有具有从地板突出的地板和基座的空腔。 指南从支撑结构延伸。 压缩机构联接到引导件，其中压缩机构包括通过可压缩装置联接到压缩板的致动器板。 致动器联接到压缩机构。 具有半导体芯片的封装基板安装在封装基板上，盖子安装在半导体芯片上以形成半导体部件。 半导体部件被放置在支撑结构上，致动器被致动以促使压缩板对盖子施加均匀的力。

公开(公告)号：US08497162B1

公开(公告)日：2013-07-30

申请号：US11379741

申请日：2006-04-21

申请人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

发明人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

IPC分类号： H01L21/00

CPC分类号： H01L21/50 ,  H01L23/10 ,  H01L23/42 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/9205 ,  H01L2224/92225 ,  H01L2924/1082 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.

摘要翻译： 提供了将盖附接到集成电路基板的各种方法。 一方面，提供了将盖附着到具有位于其上的集成电路的基板的方法。 将粘合剂施加到基板上，并将铟膜施加到集成电路。 盖子位于粘合剂上。 粘合剂被部分硬化并且铟膜被回流。 粘合剂固化。

公开(公告)号：US20090057884A1

公开(公告)日：2009-03-05

申请号：US11846642

申请日：2007-08-29

申请人： Seah Sun Too ,  James Hayward

发明人： Seah Sun Too ,  James Hayward

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/04 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

摘要： Various semiconductor chip packages and package lids are disclosed. In one aspect, a method of manufacturing is provided that includes forming a semiconductor chip package lid with a peripheral wall that defines a first interior space. A first bridge structure is formed in the first interior space. The first bridge structure is adapted to engage a surface of a substrate.

摘要翻译： 公开了各种半导体芯片封装和封装盖。 一方面，提供一种制造方法，其包括：形成具有限定第一内部空间的周壁的半导体芯片封装盖。 在第一内部空间中形成第一桥结构。 第一桥结构适于接合衬底的表面。

公开(公告)号：US07256065B1

公开(公告)日：2007-08-14

申请号：US10859673

申请日：2004-06-03

申请人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

发明人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

IPC分类号： H01L21/00

CPC分类号： H01L23/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00

摘要： A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.

摘要翻译： 一种用于将盖连接到具有与其连接的半导体芯片的支撑基板和夹具固定装置的方法。 每个半导体部件具有安装到半导体部件的半导体芯片和通过盖子连接材料连接到支撑基板的盖子。 使用包括部分固化步骤然后是无钳位固化步骤的两步工艺或通过在不包括预固化步骤的情况下将夹具附着材料固化在夹具夹具中来固化盖附接材料。 半导体部件制造基于成本和正在制造的半导体部件的数量来决定固化方法。 如果半导体制造商选择用夹具固定固化，则夹具夹具包括其上放置半导体部件的基板插件和包括其上设置有压缩材料的压缩板的压缩机构。

公开(公告)号：US08865527B2

公开(公告)日：2014-10-21

申请号：US13952392

申请日：2013-07-26

申请人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

发明人： Seah Sun Too ,  Maxat Touzelbaev ,  Janet Kirkland

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/42 ,  H01L23/00

CPC分类号： H01L21/50 ,  H01L23/10 ,  H01L23/42 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/9205 ,  H01L2224/92225 ,  H01L2924/1082 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.

摘要翻译： 提供了将盖附接到集成电路基板的各种方法。 一方面，提供了将盖附着到具有位于其上的集成电路的基板的方法。 将粘合剂施加到基板上，并将铟膜施加到集成电路。 盖子位于粘合剂上。 粘合剂被部分硬化并且铟膜被回流。 粘合剂固化。

公开(公告)号：US20080242001A1

公开(公告)日：2008-10-02

申请号：US11693156

申请日：2007-03-29

申请人： Seah Sun Too

发明人： Seah Sun Too

IPC分类号： H01L21/00

CPC分类号： H01L21/50 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152

摘要： Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

摘要翻译： 提供了用于组装半导体芯片封装的装置和方法。 一方面，提供一种制造方法，其包括将第一组半导体芯片封装衬底放置在第一处理站的第一组插座中。 第一组半导体芯片封装衬底中的每一个具有第一覆盖区。 第一组的容器的尺寸被设计成适应第一印迹。 第二组半导体芯片封装基板被放置在第一处理站的第二组插座中。 第二组半导体芯片封装衬底中的每一个具有大于第一覆盖区的第二覆盖区。 第二组的容器的尺寸被设计成适应第二印迹。 将第一组盖放置在第一组半导体芯片封装基板上，将第二组盖放置在第二组半导体芯片封装基板上。