公开(公告)号：US11890639B2

公开(公告)日：2024-02-06

申请号：US16936132

申请日：2020-07-22

Applicant: SEMES CO., LTD.

Inventor： Chan Young Heo ,  Kihoon Choi ,  Ki-Moon Kang ,  Do Heon Kim ,  Jaeseong Lee

IPC: B05C5/02 ,  B05C11/10

CPC classification number: B05C5/0208 ,  B05C5/0225 ,  B05C11/1002 ,  B05C11/1042

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

公开(公告)号：US10471457B2

公开(公告)日：2019-11-12

申请号：US15010242

申请日：2016-01-29

Applicant: Semes Co., Ltd

Inventor： Keunhwa Yang ,  Yoon Jong Ju ,  Kihoon Choi ,  Kwangsup Kim

IPC: H01L21/66 ,  B05C11/00 ,  B05B17/06 ,  B05B1/14 ,  B05B13/02 ,  B05B14/44

Abstract: A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.

公开(公告)号：US10005092B2

公开(公告)日：2018-06-26

申请号：US15223931

申请日：2016-07-29

Applicant: Semes Co., Ltd.

Inventor： Sehoon Oh ,  Kihoon Choi ,  Jinkyu Kim

IPC: B05B3/00 ,  B05C5/02 ,  B05B7/10 ,  B05B7/06 ,  B05B7/08 ,  H01L21/67

CPC classification number: B05B7/10 ,  B05B7/06 ,  B05B7/061 ,  B05B7/0815 ,  B05C5/0208 ,  H01L21/67051

Abstract: A nozzle for supplying a fluid to a substrate, the nozzle including a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flow, wherein the body includes a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line, and a gas discharge hole that discharges the gas flowing through the gas discharge line.

公开(公告)号：US11977332B2

公开(公告)日：2024-05-07

申请号：US17017786

申请日：2020-09-11

Applicant: SEMES CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Hae-Won Choi ,  Yerim Yeon ,  Anton Koriakin ,  Kihoon Choi ,  Youngran Ko ,  Jeong Ho Cho ,  Hyungseok Kang ,  Hong Gi Min

IPC: G03F7/16 ,  G03F7/039 ,  G03F7/32 ,  H01L21/67

CPC classification number: G03F7/162 ,  G03F7/168 ,  H01L21/67225 ,  G03F7/039 ,  G03F7/322

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.

公开(公告)号：US11530375B2

公开(公告)日：2022-12-20

申请号：US16600166

申请日：2019-10-11

Applicant: SEMES CO., LTD.

Inventor： Hae-Won Choi ,  Kihoon Choi ,  Jaeseong Lee ,  Chan Young Heo ,  Anton Koriakin ,  Do Heon Kim ,  Ji Soo Jeong

IPC: B08B3/04 ,  C11D7/50 ,  B08B3/08 ,  C11D11/00 ,  H01L21/02 ,  C11D7/08 ,  C11D7/36 ,  H01L21/67 ,  C11D7/26

Abstract: A composition for cleaning a substrate is provided. According to an embodiment, the composition for cleaning the substrate includes an organic solvent having a Hansen solubility parameter of 5 or more to 12 or less for polystyrene latex to the substrate.

公开(公告)号：US11410862B2

公开(公告)日：2022-08-09

申请号：US16396736

申请日：2019-04-28

Applicant: SEMES CO., LTD.

Inventor： Jaeseong Lee ,  Kihoon Choi ,  Hae-Won Choi ,  Anton Koriakin ,  Chan Young Heo ,  Do Heon Kim ,  Ji Soo Jeong

IPC: H01L21/67 ,  H01L21/02

Abstract: An apparatus for processing a substrate includes a chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, and a temperature adjustment unit that is installed in the chamber and that adjusts temperature in the processing space. The temperature adjustment unit includes a heating member that heats the processing space and a cooling member that cools the processing space. The cooling member is located closer to a central axis of the chamber than the heating member.

公开(公告)号：US10915026B2

公开(公告)日：2021-02-09

申请号：US15995588

申请日：2018-06-01

Applicant: SEMES CO., LTD.

Inventor： Hae-Won Choi ,  Kihoon Choi ,  Ki-Moon Kang ,  Chan Young Heo ,  Anton Koriakin ,  Jaeseong Lee

IPC: G03F7/40 ,  G03F7/42 ,  H01L21/67 ,  H01L21/677 ,  H01L21/027 ,  H01L21/02 ,  G03F7/20 ,  G03F7/038 ,  G03F7/039 ,  G03F7/32

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a first process chamber configured to supply a development liquid to a substrate that is carried into the first process chamber after an exposure process is performed on the substrate, a second process chamber configured to treat the substrate through a supercritical fluid, a feeding robot configured to transfer the substrate from the first process chamber to the second process chamber, and a controller configured to control the feeding robot such that the substrate is transferred to the second process chamber in a state in which the development liquid supplied by the first process chamber resides in the substrate.

公开(公告)号：US20160221021A1

公开(公告)日：2016-08-04

申请号：US15010242

申请日：2016-01-29

Applicant: Semes Co., Ltd.

Inventor： Keunhwa Yang ,  Yoon Jong Ju ,  Kihoon Choi ,  Kwangsup Kim

IPC: B05C5/02 ,  H04N7/18 ,  H04N5/225 ,  B05B1/14

CPC classification number: B05B17/0623 ,  B05B1/14 ,  B05B13/0228 ,  B05B14/44

Abstract: Disclosed are an inspection unit, an inspection method, and a substrate treating apparatus including the same. A substrate treating apparatus includes a treatment unit including a container, and a support member situated in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit. The inspection unit includes a plate of a transparent material, a photographing member situated below the plate, a light source member that irradiates light onto a path of the treatment liquid discharged from the treatment liquid nozzle towards the plate at the inspection position, and a determination member that determines whether the treatment liquid is normally discharged, from an image photographed by the photographing member.

Abstract translation: 公开了一种检查单元，检查方法和包括该检查单元的基板处理设备。 基板处理装置包括处理单元，该处理单元包括容器和位于容器内部以支撑基板的支撑构件，所述处理单元被配置为处理所述基板，所述喷嘴单元具有用于供应处理液体的处理液喷嘴 到设置在处理单元中的基板和检查处理液是否从处理液喷嘴正常排出的检查单元。 喷嘴还包括喷嘴驱动器，其将处理液喷嘴从处理单元处理的处理位置和检查单元检查处理液喷嘴的检查位置移动。 检查单元包括透明材料板，位于板下方的拍摄构件，将光从处理液喷嘴排出的处理液的路径向检查位置朝向板照射的光源构件， 从拍摄部件拍摄的图像判定处理液是否正常地排出的部件。