APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20230352275A1

    公开(公告)日:2023-11-02

    申请号:US17733653

    申请日:2022-04-29

    CPC classification number: H01J37/3244 H01J37/32091 H01J2237/186

    Abstract: A substrate processing apparatus and method for increasing substrate processing efficiency are provided. The substrate processing apparatus comprises a process chamber, in which a reaction gas is processed to have a first pressure therein, a first pumping module for pumping the process chamber to have a second pressure smaller than the first pressure, a second pumping module for pumping the process chamber to have a third pressure smaller than the second pressure, and a first automatic pressure control module for adjusting a magnitude of the second pressure by adjusting a pumping pressure of the first pumping module.

    Substrate treating apparatus and treatment liquid nozzle

    公开(公告)号:US10211074B2

    公开(公告)日:2019-02-19

    申请号:US15006359

    申请日:2016-01-26

    Applicant: Semes Co., Ltd

    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing having a space for treating a substrate in the interior thereof, a spin head which supports and rotates the substrate inside the housing, and an ejection unit having a first nozzle member for ejecting a first treatment liquid onto the substrate positioned on the spin head. The first nozzle member includes a body having an ejection passage, through which the first treatment liquid flows, therein and a first discharge hole communicated with the ejection passage to eject the first treatment liquid onto the substrate, and a vibrator installed in the body to provide vibration for the first treatment liquid flowing through the ejection passage. The vibrator has an interference preventing recess for preventing an interference by reflective waves therein.

    NOZZLE, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD
    4.
    发明申请
    NOZZLE, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD 审中-公开
    喷嘴,包括其的基板处理装置和基板处理方法

    公开(公告)号:US20160346795A1

    公开(公告)日:2016-12-01

    申请号:US15160136

    申请日:2016-05-20

    CPC classification number: H01L21/68721 H01L21/67051

    Abstract: Disclosed is a nozzle for supplying a treatment liquid to a substrate, the nozzle including a body having a passage, through which the treatment liquid flows, in the interior thereof, and having a discharge hole communicated with the passage and through which the treatment liquid is discharged, and a piezoelectric element that pressurize the treatment liquid flowing through the body to discharge the treatment liquid through the discharge hole in a state of droplets, wherein an average diameter of the droplets discharged through the discharge hole is equal to or greater than 5 micrometers and is less than 15 micrometers.

    Abstract translation: 公开了一种用于将处理液供给到基板的喷嘴,所述喷嘴包括具有通道的主体,处理液在其内部流动,并具有与通道连通的排出孔,处理液通过该通道 以及压电元件,其对流过身体的处理液体进行加压,以便以液滴的状态通过排出孔排出处理液,其中通过排出孔排出的液滴的平均直径等于或大于5微米 并且小于15微米。

    INSPECTION UNIT, INSPECTION METHOD, AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
    5.
    发明申请
    INSPECTION UNIT, INSPECTION METHOD, AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME 审中-公开
    检查单元,检查方法和基板处理装置,包括它们

    公开(公告)号:US20160221021A1

    公开(公告)日:2016-08-04

    申请号:US15010242

    申请日:2016-01-29

    CPC classification number: B05B17/0623 B05B1/14 B05B13/0228 B05B14/44

    Abstract: Disclosed are an inspection unit, an inspection method, and a substrate treating apparatus including the same. A substrate treating apparatus includes a treatment unit including a container, and a support member situated in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit. The inspection unit includes a plate of a transparent material, a photographing member situated below the plate, a light source member that irradiates light onto a path of the treatment liquid discharged from the treatment liquid nozzle towards the plate at the inspection position, and a determination member that determines whether the treatment liquid is normally discharged, from an image photographed by the photographing member.

    Abstract translation: 公开了一种检查单元,检查方法和包括该检查单元的基板处理设备。 基板处理装置包括处理单元,该处理单元包括容器和位于容器内部以支撑基板的支撑构件,所述处理单元被配置为处理所述基板,所述喷嘴单元具有用于供应处理液体的处理液喷嘴 到设置在处理单元中的基板和检查处理液是否从处理液喷嘴正常排出的检查单元。 喷嘴还包括喷嘴驱动器,其将处理液喷嘴从处理单元处理的处理位置和检查单元检查处理液喷嘴的检查位置移动。 检查单元包括透明材料板,位于板下方的拍摄构件,将光从处理液喷嘴排出的处理液的路径向检查位置朝向板照射的光源构件, 从拍摄部件拍摄的图像判定处理液是否正常地排出的部件。

    Apparatus and method for processing substrate using plasma

    公开(公告)号:US12176185B2

    公开(公告)日:2024-12-24

    申请号:US17712055

    申请日:2022-04-01

    Abstract: Provided are a substrate processing apparatus and method for increasing the uniformity of substrate processing. The substrate processing apparatus comprises a first space disposed between an electrode and an ion blocker, a second space disposed between the ion blocker and a shower head, and a processing space for processing a substrate under the shower head, wherein the ion blocker includes a first region and a second region that are separated from each other, and includes a plurality of first supply ports for supplying a first reaction gas to the second space, wherein the plurality of first supply ports are formed in the first region and not formed in the second region, wherein the shower head includes a third region corresponding to the first region, a fourth region corresponding to the second region, and a plurality of second supply ports for supplying a second reaction gas to the second space, wherein the plurality of second supply ports are not formed in the third region, and are formed in the fourth region.

    Substrate processing apparatus and nozzle unit

    公开(公告)号:US11167326B2

    公开(公告)日:2021-11-09

    申请号:US16502272

    申请日:2019-07-03

    Abstract: An apparatus for processing a substrate comprises a processing vessel having a processing space inside, a substrate support unit that supports and rotates the substrate in the processing vessel, and a nozzle unit that dispenses a processing liquid onto the substrate. The nozzle unit comprises a nozzle that dispenses the processing liquid and an ultraviolet (UV) light supply unit that emits UV light to activate radicals of the processing liquid dispensed onto the substrate.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US10964557B2

    公开(公告)日:2021-03-30

    申请号:US16051059

    申请日:2018-07-31

    Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.

    Inspection unit, inspection method, and substrate treating apparatus including the same

    公开(公告)号:US10471457B2

    公开(公告)日:2019-11-12

    申请号:US15010242

    申请日:2016-01-29

    Applicant: Semes Co., Ltd

    Abstract: A substrate treating apparatus includes a treatment unit including a container, and a support member in the interior of the container to support a substrate, the treatment unit being configured to treat the substrate a nozzle unit having a treatment liquid nozzle for supplying a treatment liquid to the substrate provided in the treatment unit and an inspection unit that inspects whether the treatment liquid is normally discharged from the treatment liquid nozzle. The nozzle further includes a nozzle driver that moves the treatment liquid nozzle from a process position at which the substrate is treated by the treatment unit and an inspection position at which the treatment liquid nozzle is inspected by the inspection unit.

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