公开(公告)号：US20110008081A1

公开(公告)日：2011-01-13

申请号：US12779432

申请日：2010-05-13

Applicant: Yuichi AOYAMA ,  Yasuo Katano ,  Yukimichi Someya ,  Takuma Nakamura ,  Tetsurou Sasamoto ,  Shunichi Abe ,  Masafumi Yamada

Inventor： Yuichi AOYAMA ,  Yasuo Katano ,  Yukimichi Someya ,  Takuma Nakamura ,  Tetsurou Sasamoto ,  Shunichi Abe ,  Masafumi Yamada

IPC: G03G15/20

CPC classification number: G03G15/2096

Abstract: A disclosed cleaning device for removing adhering matter from a surface of a member subject to cleaning includes a belt-shaped film member arranged in a stretched configuration capable of being wound or endlessly move in a direction opposite to a surface movement direction of the member subject to cleaning while being in contact with the surface of the member subject to cleaning, and a cleaning blade configured to abut on the surface of the member subject to cleaning via the belt-shaped film member at a position where the belt-shaped film member is brought into contact with the member subject to cleaning.

Abstract translation: 公开的用于从要清洁的构件的表面去除粘附物质的清洁装置包括：带状膜构件，其布置成拉伸构造，能够沿与所述构件受到的构件的表面移动方向相反的方向缠绕或不断地移动 在与要清洁的构件的表面接触的同时进行清洁;以及清洁刮板，其构造成在带状膜构件被带入的位置处经由带状膜构件抵接在被清洁的构件的表面上 与要清洁的成员接触。

公开(公告)号：US06867507B2

公开(公告)日：2005-03-15

申请号：US10256006

申请日：2002-09-27

Applicant: Tetsuya Uebayashi ,  Shunichi Abe ,  Naoki Izumi ,  Akira Yamazaki

Inventor： Tetsuya Uebayashi ,  Shunichi Abe ,  Naoki Izumi ,  Akira Yamazaki

IPC: H01L21/52 ,  H01L23/495 ,  H01L23/50 ,  H01L23/544

CPC classification number: H01L23/49503 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.

Abstract translation: 预定几何形状和面积的部分设置在引线框架的芯片焊盘上或芯片焊盘中，作为用于检查半导体芯片的位置的标记。 如果半导体芯片放置在X方向上的允许范围之外，则半导体芯片与标记重叠，从而改变标记的可观察部分（倾斜部分）的几何形状。 通过该变化，可以确定半导体芯片在X方向上的位置偏差。 通过观察电极是否位于该部分的某一部分的侧面的延伸部之间来确定半导体芯片在Y方向上的位置偏差。

公开(公告)号：US06784021B2

公开(公告)日：2004-08-31

申请号：US10090842

申请日：2002-03-06

Applicant: Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

Inventor： Shunichi Abe ,  Tetsuya Uebayashi ,  Naoki Izumi ,  Akira Yamazaki

IPC: H01L2144

CPC classification number: H01L24/83 ,  H01L21/2007 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/07802

Abstract: In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.

Abstract translation: 在半导体器件制造方法中，将具有多个芯片的多个晶片承载并放置在管芯接合器中。 从多个晶片取出的芯片分别结合在一起，并通过结合层叠在堆叠中以形成芯片组件。 通过接合层将芯片组合到芯片焊盘。 因此，芯片接合器能够将由多个芯片组成的芯片组件接合到芯片焊盘，使得用于将多个芯片接合到管芯焊盘的管芯接合工艺的处理时间相对较短，半导体制造 设备以提高生产率生产半导体器件，规模相对较小，需要相对较低的设备投资。

公开(公告)号：US5724726A

公开(公告)日：1998-03-10

申请号：US614552

申请日：1996-03-13

Applicant: Yoshihiro Tomita ,  Naoto Ueda ,  Yoshirou Nishinaka ,  Shunichi Abe ,  Hideyuki Ichiyama

Inventor： Yoshihiro Tomita ,  Naoto Ueda ,  Yoshirou Nishinaka ,  Shunichi Abe ,  Hideyuki Ichiyama

IPC: H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01R43/00

CPC classification number: H01L24/06 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/85207 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172

Abstract: A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.

Abstract translation: 制造具有芯片上芯片结构的半导体器件的方法包括从外框架向外弯曲从外框延伸的芯片焊盘。 此后，当芯片焊盘处于便利位置时，半导体芯片被芯片焊接到芯片焊盘。 此后，芯片焊盘向外框架弯曲，使得它大致平行于外框架，但与外框架大致平行于半导体芯片延伸。 半导体芯片的电极通过引线接合连接到从外框延伸的引线。 在树脂成型之后，将位于树脂封装外部的外框切断并移除，从而完成了片上半导体器件。

公开(公告)号：US5674527A

公开(公告)日：1997-10-07

申请号：US478970

申请日：1995-06-07

Applicant: Tadaaki Inoue ,  Hideto Kodaira ,  Yoshihito Nawa ,  Ryoichiro Murashima ,  Shunichi Abe ,  Kazumasa Yokoyama

Inventor： Tadaaki Inoue ,  Hideto Kodaira ,  Yoshihito Nawa ,  Ryoichiro Murashima ,  Shunichi Abe ,  Kazumasa Yokoyama

IPC: A23L1/29 ,  A23L1/30 ,  A23L1/304 ,  A23L1/305 ,  A61K9/00 ,  A61K31/70 ,  A61K33/30 ,  A61K45/06 ,  A61K9/127

CPC classification number: A61K33/30 ,  A23L33/115 ,  A23L33/16 ,  A23L33/175 ,  A23L33/40 ,  A61K31/70 ,  A61K45/06 ,  A61K9/0029 ,  A23V2002/00 ,  Y10S514/938 ,  Y10S514/943

Abstract: Disclosed is an infusion preparation for nutrient supply use. It comprises a sugar, amino acids, electrolytes and a fat emulsion. It has an excellent shelf life without causing precipitation, denaturation and the like in spite of the simultaneous presence of these components. Also disclosed is a container filled with infusion liquids comprising a first and a second compartments separated from each other by a separation means, wherein an infusion liquid containing a fat emulsion and a sugar is included in the first compartment and another infusion liquid containing amino acids and electrolytes is included in the second compartment. Further disclosed are an infusion preparation comprising a fat emulsion and a sugar, and an infusion preparation comprising amino acids and electrolytes. An infusion preparation containing a sugar, amino acids, electrolytes and a fat emulsion can be obtained easily and aseptically upon use, by simply removing a separation means attached to the container and mixing the two infusion liquids.

Abstract translation: 公开了用于营养供应使用的输液制剂。 它包含糖，氨基酸，电解质和脂肪乳剂。 尽管同时存在这些组分，它具有优异的保质期而不引起沉淀，变性等。 还公开了一种装有输液的容器，其包括通过分离装置彼此分离的第一和第二隔室，其中含有脂肪乳液和糖的输注液体包含在第一隔室中，另一个输注液体含有氨基酸和 电解质被包括在第二隔室中。 还公开了包含脂肪乳剂和糖的输注制剂，以及包含氨基酸和电解质的输注制剂。 通过简单地除去附着在容器上的分离装置并混合两种输注液，可以容易地和无菌地获得含有糖，氨基酸，电解质和脂肪乳剂的输液制剂。

公开(公告)号：US5626880A

公开(公告)日：1997-05-06

申请号：US589207

申请日：1996-01-22

Applicant: Tadaaki Inoue ,  Hideto Kodaira ,  Yoshihito Nawa ,  Ryoichiro Murashima ,  Shunichi Abe ,  Kazumasa Yokoyama

Inventor： Tadaaki Inoue ,  Hideto Kodaira ,  Yoshihito Nawa ,  Ryoichiro Murashima ,  Shunichi Abe ,  Kazumasa Yokoyama

IPC: A23L1/29 ,  A23L1/30 ,  A23L1/304 ,  A23L1/305 ,  A61K9/00 ,  A61K31/70 ,  A61K33/30 ,  A61K45/06 ,  A61K9/14

CPC classification number: A61K33/30 ,  A23L33/115 ,  A23L33/16 ,  A23L33/175 ,  A23L33/40 ,  A61K31/70 ,  A61K45/06 ,  A61K9/0029 ,  A23V2002/00 ,  Y10S514/938 ,  Y10S514/943

Abstract: Disclosed is an infusion preparation for nutrient supply use. It comprises a sugar, amino acids, electrolytes and a fat emulsion. It has an excellent shelf life without causing precipitation, denaturation and the like in spite of the simultaneous presence of these components. Also disclosed is a container filled with infusion liquids comprising a first and a second compartments separated from each other by a separation means, wherein an infusion liquid containing a fat emulsion and a sugar is included in the first compartment and another infusion liquid containing amino acids and electrolytes is included in the second compartment. Further disclosed are an infusion preparation comprising a fat emulsion and a sugar, and an infusion preparation comprising amino acids and electrolytes. An infusion preparation containing a sugar, amino acids, electrolytes and a fat emulsion can be obtained easily and aseptically upon use, by simply removing a separation means attached to the container and mixing the two infusion liquids.

Abstract translation: 公开了用于营养供应使用的输液制剂。 它包含糖，氨基酸，电解质和脂肪乳剂。 尽管同时存在这些组分，它具有优异的保质期而不引起沉淀，变性等。 还公开了一种装有输液的容器，其包括通过分离装置彼此分离的第一和第二隔室，其中含有脂肪乳液和糖的输注液体包含在第一隔室中，另一个输注液体含有氨基酸和 电解质被包括在第二隔室中。 还公开了包含脂肪乳剂和糖的输注制剂，以及包含氨基酸和电解质的输注制剂。 通过简单地除去附着在容器上的分离装置并混合两种输注液，可以容易地和无菌地获得含有糖，氨基酸，电解质和脂肪乳剂的输液制剂。

公开(公告)号：US5609287A

公开(公告)日：1997-03-11

申请号：US335995

申请日：1994-11-08

Applicant: Goro Izuta ,  Shunichi Abe ,  Yoshirou Nishinaka ,  Katsuyuki Fukutome ,  Naoto Ueda ,  Toshio Takeuchi ,  Yoshihiro Kashiba ,  Masaaki Namatame

Inventor： Goro Izuta ,  Shunichi Abe ,  Yoshirou Nishinaka ,  Katsuyuki Fukutome ,  Naoto Ueda ,  Toshio Takeuchi ,  Yoshihiro Kashiba ,  Masaaki Namatame

IPC: B23K35/02 ,  B23K35/26 ,  H01L21/60 ,  H01L21/58

CPC classification number: H01L24/32 ,  B23K35/0238 ,  B23K35/268 ,  H01L24/29 ,  H01L24/83 ,  B23K35/262 ,  H01L2224/04026 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/351

Abstract: A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material-having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprise putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.

Abstract translation: 焊料材料包括第一焊料板和第二焊料板，其具有等于或大于1微米的厚度，其设置在包含材料的第一焊料板的两个表面处，所述第一焊料板具有比与第一焊料反应的第一焊料或材料更低的熔点 第一焊料以产生熔点低于第一焊料的合金。 接合方法包括将插入在两个物体之间的上述焊料材料相互连接; 将焊料材料加热到高于第二焊料或合金的熔点并低于所述第一焊料的熔点的温度，从而熔化第二焊料或合金; 然后将焊料材料冷却或保持在熔点附近的温度，从而将要连接的物体彼此接合。 第二焊盘优选具有小于5微米的厚度，并且第一焊料板优选具有等于或大于30微米的厚度。 通过这种结构，要连接的物体之间的间隔可以被控制到预定厚度，并且可以放松对物体起作用的应力，并且不会在物体之间产生位置偏差。

公开(公告)号：US5072304A

公开(公告)日：1991-12-10

申请号：US652369

申请日：1991-02-07

Applicant: Shunichi Abe ,  Masaharu Ohkubo ,  Akio Suzuki ,  Yoshihiro Takada

Inventor： Shunichi Abe ,  Masaharu Ohkubo ,  Akio Suzuki ,  Yoshihiro Takada

IPC: G06T3/60 ,  H04N1/23 ,  H04N1/387

CPC classification number: H04N1/2323 ,  G06T3/60 ,  H04N1/2307 ,  H04N1/387

Abstract: An image reading and recording apparatus comprises a reader for reading an image of a document by scanning a document and a recorder for effecting recording of the image read by the reader on a recording medium by scanning one side of the recording medium. A driving and controlling device drives and controls the reader and the recorder in such a manner that the image recorded on one side of the recording medium by means of the recorder will be inverted with respect to the image of the document.

公开(公告)号：US4958240A

公开(公告)日：1990-09-18

申请号：US198515

申请日：1988-05-25

Applicant: Shunichi Abe

Inventor： Shunichi Abe

IPC: G03B21/00 ,  G03B21/14 ,  G03B27/72 ,  H04N1/00 ,  H04N1/10 ,  H04N1/40

CPC classification number: H04N1/00267 ,  H04N1/1017 ,  H04N1/1043 ,  H04N1/1048 ,  H04N1/40056 ,  H04N1/00249 ,  H04N2201/0404 ,  H04N2201/0418 ,  H04N2201/0438

Abstract: An original reading apparatus which prevents lamp blackening includes a lamp for illuminating the original, and reading circuitry for reading an image formed on the illuminated original. Control circuitry is provided to apply to the lamp a first predetermined voltage after reading the image formed on the original has been completed, if a voltage applied to the lamp at the time of original image reading is lower than a second predetermined voltage. The first predetermined voltage is higher than the voltage applied to the lamp at the time of the original image reading.

Abstract translation: 防止灯黑化的原始读取装置包括用于照亮原稿的灯和用于读取形成在照明原稿上的图像的读取电路。 如果在原始图像读取时施加到灯的电压低于第二预定电压，则控制电路被提供以在读取形成在原稿上的图像已经完成之后向灯施加第一预定电压。 第一预定电压高于原始图像读取时施加到灯的电压。

公开(公告)号：US4422756A

公开(公告)日：1983-12-27

申请号：US286196

申请日：1981-07-23

Applicant: Shunichi Abe ,  Mitsuo Akiyama

Inventor： Shunichi Abe ,  Mitsuo Akiyama

IPC: G03B27/34 ,  G03B27/50 ,  G03G15/04 ,  G03G15/041

CPC classification number: G03G15/041

Abstract: During original document scanning, the forward clutch effects scanning travel of the optics unit in a copying machine having user selectable modes for magnification copying and is normally disengaged by detection of the trailing edge of a transfer sheet being transported through the machine; the return clutch for reverse optics unit travel is simultaneously actuated by detection of the sheet's trailing edge to return the optics unit to its original position. In the event that the trailing edge is not detected before expiration of a predetermined time period corresponding to maximum permissable forward travel of the optics unit for the selected magnification mode, the forward clutch is immediately disengaged, although the return clutch is not engaged until the sheet's trailing edge is subsequently detected.

Abstract translation: 在原稿扫描期间，前进离合器在具有用户可选择的模式用于放大复印的复印机中实现光学单元的扫描行程，并且通过检测通过机器传送的转印纸的后缘通常脱离; 用于反向光学单元行程的返回离合器通过检测片材的后缘同时致动，以将光学单元返回到其原始位置。 在对应于所选择的放大模式的光学单元的最大允许向前行程的预定时间段期满之前没有检测到后缘的情况下，尽管返回离合器不接合直到片材的 随后检测后缘。