Abstract:
A material independent profiler system and method for measuring a slope on the surface of an object such as a thin film disk, a silicon wafer, or a glass substrate is disclosed. In one embodiment, the system comprises an electromagnetic energy source to generate a beam of electromagnetic energy, a polarizer to polarize the beam of electromagnetic energy into a first component having a first polarization orientation and a second component having a second polarization orientation, a radiation targeting assembly to direct the first component onto the surface in a first direction and a first plane of orientation, direct the second component onto the surface in a second direction and a second plane of orientation, wherein the second direction is opposite the first direction, a radiation detector assembly to generate a first signal from a portion of the first component reflected from the surface, generate a second signal from a portion of the second component reflected from the surface, and a processor to generate a surface measurement from the first signal and the second signal.
Abstract:
Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a single and dual multiple beam techniques. In one embodiment, this the invention uses a pair of orthogonally oriented white light beams, one in the radial and one in the circumferential direction. The scattered light from the radial and circumferential beams allows the detection and classification of particles, pits and scratches. In other embodiments, single beam techniques are used to classify radial and circumferential defects.
Abstract:
In one embodiment a system to detect multi-domain regions in the soft under layer of a perpendicular magnetic media comprises a radiation targeting assembly to target a polarized radiation beam onto a surface of a substrate covered by the soft under layer of a perpendicular magnetic media, a radiation collecting assembly that collects radiation reflected from the surface, a processor coupled to the first radiation collecting assembly, and a memory module coupled to the processor. The memory module comprises logic instructions which, when executed by the processor, configure the processor to record signal values from radiation reflected by the radiation beam at different positions on the surface and analyze the signal values to detect a region of multiple magnetic domains in the soft under layer of a perpendicular magnetic media.
Abstract:
A problem in the inspection of transparent wafers and disks is the detection of top surface particles. More precisely, it is being able to assign a scattering site as being due to a particle at the top or bottom surface of a transparent wafer. A method of the present invention is to use an elliptical mirror, with a pinhole at its top focus, together with a focused beam. The focused beam will diverge as it passes through the transparent wafer and as a result any particle on the bottom surface will see a lower optical intensity and will appear weaker than a top surface particle. The suppression of scattered light from the bottom surface occurs because the source of the scattered light (the bottom surface) is far from the bottom foci of the elliptical mirror. This means that the light from the bottom surface, which arrives inside the ellipsoid, will be out of focus at the top foci of the ellipsoid and as a result very little light from the bottom surface will pass through the pinhole at the top foci of the elliptical mirror. This reduction of light from the bottom surface can be further improved by making the pinhole diameter to be substantially less than the thickness of the transparent wafer.
Abstract:
A system and method for performing a magnetic imaging, optical profiling, and measuring lubricant thickness and degradation, carbon wear, carbon thickness, and surface roughness of thin film magnetic disks and silicon wafers at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat is provided. The system and method involve a focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. This generates both reflected and scattered light that may be measured to determine various values and properties related to the surface of the disk, including identifying the Kerr-effect in reflected light for determination of point magnetic properties. In addition, the present invention can mark the position of an identified defect.
Abstract:
A combined optical profiler, ellipsometer, reflectometer and scatterometer is described which is configured to have user selectable spot sizes. An attached computer allows the user to select via software the desired spot size on the substrate.
Abstract:
An analyzing laser system determines a physical characteristic of a repetitive texture pattern formed on a substrate surface. In one embodiment the system uses diffracted laser light to compute the average height of texturing bumps on a substrate surface. A laser beam is directed to the substrate surface and overlaps a group of individual marks or bumps formed in a repetitive pattern. A scanning linear photodector array receives light diffracted from the surface. The digitized output of the array is the angular distribution of diffracted light intensities. In the preferred embodiment for determining the average height of laser-induced bumps formed on a specular magnetic recording disk substrate, the angular positions of the first and second diffraction peaks or rings are determined and the intensities are integrated around those diffraction peaks or rings. These position and integrated intensity values are then compared to position and integrated intensity values for bumps of known height on calibration disk substrates. If the individual marks or bumps making up the repetitive pattern are also symmetrical then the angular distribution of diffracted light intensities is the square of the absolute value of the Fourier transform of the cross sectional profile of the bumps. Mathematical operations, including an inverse Fourier transform, are then performed on the digitized array output to yield the average cross sectional shape of the bumps illuminated by the analyzing laser.
Abstract:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second lens, a field stop, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The first lens focuses scattered radiation from the sample to generate multiple scan lines at a first focal plane. The field stop is positioned at the first focal plane to block one or more scan lines at the first focal plane. The scan line not blocked by the field stop propagates to the second lens. The second lens de-scans the scan line and generates a point of scattered radiation at a second focal plane where the detector input is located.
Abstract:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.