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    PRESSURE-SENSITIVE ADHESIVE COMPOUND CONTAINING A CROSS-LINKED NANOPARTICLE NETWORK, METHOD OF PRODUCTION AND USE THEREOF
    11.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOUND CONTAINING A CROSS-LINKED NANOPARTICLE NETWORK, METHOD OF PRODUCTION AND USE THEREOF 审中-公开
    包含交联纳米粒子网络的压敏粘合剂化合物，其生产方法和用途

    公开(公告)号：US20150322296A1

    公开(公告)日：2015-11-12

    申请号：US14648423

    申请日：2014-01-13

    Applicant: TESA SE

    Inventor： Klaus KEITE-TELGENBÜSCHER ,  Christian SCHUH ,  Bernd LÜHMANN ,  Thilo DOLLASE ,  Minyoung BAI ,  Thorsten KRAWINKEL

    IPC: C09J7/02 ,  C09J125/08 ,  C09J153/00

    Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

    Abstract translation: 包含至少两种形成一相的组分的压敏粘合剂化合物，通过交联起始反应从其产生具有至少两相的IPN，第一相具有至少软化点温度小于23℃ ℃，第二相在堆积反应后具有大于23℃的软化温度，两相在堆积反应后具有交联纳米颗粒网络的形态。

    Pressure-sensitive adhesive compound and redetachable self-adhesive products comprising the pressure-sensitive adhesive compound
    12.
    发明申请
    Pressure-sensitive adhesive compound and redetachable self-adhesive products comprising the pressure-sensitive adhesive compound 有权

    公开(公告)号：US20250066642A1

    公开(公告)日：2025-02-27

    申请号：US18812453

    申请日：2024-08-22

    Applicant: TESA SE

    Inventor： Thilo DOLLASE ,  Julia GARBERS

    IPC: C09J7/38 ,  C09J7/24 ,  C09J7/25 ,  C09J11/08

    Abstract: Pressure-sensitive adhesive compound containing: a) at least 28% by weight and at most 60% by weight of an elastomer component, wherein i. the elastomer component contains at least 60% by weight and preferably at most 90% by weight, based in each case on the elastomer component, of at least one hydrogenated polyvinylaromatic-polydiene block copolymer having a polyvinylaromatic fraction of at least 18% by weight and a peak molecular weight of 100,000 to 500,000 g/mol, determined according to GPC (Test i), ii. the polydiene blocks are substantially fully hydrogenated, iii. the hydrogenated polyvinylaromatic-polydiene block copolymer has an ABA structure, (AB)nZ structure with n=2 or radial (AB)n structure or radial (AB)n−Z structure with n≥3, wherein A=polyvinylaromatic, B=ethylene and butylene or ethylene and propylene and Z=derivative of a coupling substance, and wherein the ethylene fraction in the B blocks is preferably at least 50% by weight, and iv. the elastomer component contains at least one kind of a hydrogenated diblock copolymer having an A′B′ structure or (A′B′)nZ structure with n=1, wherein A′=polyvinylaromatic, B′=ethylene and butylene or ethylene and propylene, Z=derivative of a coupling substance, and possibly A′=A and B′=B, b) a tackifier resin component, c) optionally a plasticizer component, d) at least 2.5% by weight to 22% by weight, preferably at least 4% by weight to 18% by weight, of a reinforcing component which is at least one resin having an MMAP value between −10° C. and +30° C., preferably between 0° C. and +20° C., and a softening point of at least 140° C., e) optionally further adjuvants, the fraction of the elastomer component being based on the total weight of the pressure-sensitive adhesive compound.

    WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE
    15.
    发明申请
    WATER VAPOR-BLOCKING ADHESIVE COMPOUND HAVING HIGHLY FUNCTIONALIZED POLY(METH)ACRYLATE 审中-公开

    公开(公告)号：US20200377766A1

    公开(公告)日：2020-12-03

    申请号：US16998508

    申请日：2020-08-20

    Applicant: TESA SE

    Inventor： Thilo DOLLASE ,  Jessika GARGIULO ,  Marco KUPSKY ,  Bastian WEDEL

    IPC: C09J7/38 ,  C08F220/32 ,  C09J133/06 ,  C08L33/06 ,  C09J7/22 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

    Abstract: Single- or double-sided adhesive tapes and methods at least partly encapsulate an (opto)electronic structure. The tapes and method include a carrier and at least one layer of a curable adhesive composition having the following components: (A) 20% to 99.9% by weight (based on the entirety of the curable adhesive composition) of a (co)polymer functionalized with epoxy groups and having a weight-average molar mass of at least 5000 g/mol, based on more than 30% to 100% by weight, (based on the entirety of the parent monomers of the epoxy-functionalized (co)polymer) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group; and (B) 0.1% to 5% by weight (based on the entirety of the curable adhesive composition) of at least one curing agent configured to induce curing of the (co)polymer (A) with reaction of its epoxy groups by thermal means and/or by supply of UV radiation.

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