Abstract:
An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
Abstract:
An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
Abstract:
An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
Abstract:
An integrated circuit package includes a first die attach pad (DAP) having a first bottom surface, a first semiconductor die attached to the first DAP, a second DAP having a second bottom surface, wherein the first bottom surface and the second bottom surface are coplanar, and a second semiconductor die attached to the second DAP. A nonlinear DAP linking structure couples the first DAP to the second DAP, wherein the DAP linking structure does not include any direct linear connections between the first DAP and the second DAP. The nonlinear DAP linking structure is configured to deform without causing the first DAP and the second DAP to become non-coplanar. A mold compound covers the first and second DAPs, the first and second semiconductor dies, and the nonlinear DAP linking structure.
Abstract:
A system includes first and second gas cells, each comprising a respective sealed interior waveguide. The first gas cell contains a dipolar gas and the second gas cell does not contain a dipolar gas. The system includes first and second transmit antennas coupled to the first and second gas cells, respectively, to provide first and second electromagnetic waves to the interior of the first and second gas cells, respectively; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in the first electromagnetic wave after travel through the first gas cell; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in the second electromagnetic wave after travel through the second gas cell; processor configured to calculate a background-free signal based on a difference between the first and second signals.
Abstract:
A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.
Abstract:
A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.