公开(公告)号：US20230207420A1

公开(公告)日：2023-06-29

申请号：US17563789

申请日：2021-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kwang-Soo Kim ,  Vivek Kishorechand Arora ,  Woochan Kim

IPC: H01L23/373 ,  H01L29/20 ,  H01L29/772

CPC classification number: H01L23/3738 ,  H01L23/3731 ,  H01L29/2003 ,  H01L29/772

Abstract: An electronic device for use in power related applications includes a multi-layered substrate comprised of a first metal layer, a second metal layer, and an intermediate layer disposed between the first metal layer, and the second metal layer. The first metal layer is partitioned into sections, where each of the sections has a first surface and electrical circuits patterned onto the first surface. A lead frame is attached to outer portions of the first metal layer and a die is attached to the first surface of each of the sections of the first metal layer.

公开(公告)号：US20240194546A1

公开(公告)日：2024-06-13

申请号：US18078923

申请日：2022-12-10

Applicant: Texas Instruments Incorporated

Inventor： Kwang-Soo Kim ,  Vivek Arora ,  Ken Pham

IPC: H01L23/08 ,  H01L23/00 ,  H01L23/492 ,  H01L25/00 ,  H01L25/07

CPC classification number: H01L23/08 ,  H01L23/492 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32221 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247

Abstract: An electronic device includes a multilevel ceramic body, first, second, and third plates, and first and second semiconductor dies, with the multilevel ceramic body having opposite first and second sides, a first and second openings in the first side, a third opening in the second side, and a ceramic separator structure defining first and second interior portions between the first and second openings. The first plate is attached to the first side and covers the first opening, the second plate is attached to the first side and covers the second opening, the third plate is attached to the second side and covers the third opening, the first semiconductor die is in the first interior portion, and the second semiconductor die is in the second interior portion of the ceramic body.

公开(公告)号：US20240038619A1

公开(公告)日：2024-02-01

申请号：US17876621

申请日：2022-07-29

Applicant: Texas Instruments Incorporated

Inventor： Woochan Kim ,  Kwang-Soo Kim ,  Vivek Arora

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L24/83 ,  H01L24/32 ,  H01L21/4882 ,  H01L23/5389 ,  H01L23/3735 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/3512 ,  H01L2924/1711 ,  H01L2924/172 ,  H01L2924/173 ,  H01L2924/176 ,  H01L2924/1033 ,  H01L2224/83862 ,  H01L2224/3201 ,  H01L2224/83203

Abstract: An electronic device includes an embedded die frame having a cavity and a routing structure, a semiconductor die in the cavity with a gallium nitride layer on the routing structure, and a heat spreader having a thermally conductive insulator layer and a metal plate, the thermally conductive insulator layer having a first side that faces the embedded die frame and an opposite second side that faces away from the embedded die frame, with a portion of the first side of the thermally conductive insulator layer extending over a side of a silicon substrate of the semiconductor die, and the metal plate on the second side of the thermally conductive insulator layer.