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公开(公告)号：US11487381B2
公开(公告)日：2022-11-01
申请号：US16512020
申请日：2019-07-15
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Wei-Yan Shih , Steve Kummerl , Mark Stephen Toth , Alok Lohia , Terry Lee Sculley , Seung Bae Lee , Scott Robert Summerfelt
Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.
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公开(公告)号：US09751108B2
公开(公告)日：2017-09-05
申请号：US14814542
申请日：2015-07-31
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih , Xiaochen Xu
CPC classification number: B06B1/0629 , B06B1/0292 , B06B1/0622
Abstract: An ultrasonic transducer. The ultrasonic transducer has an interposer having electrical connectivity contacts. The ultrasonic transducer also has an ultrasonic receiver, comprising an array of receiving elements, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer. The ultrasonic transducer also has at least one ultrasonic transmitter, separate from the ultrasonic receiver, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer.
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公开(公告)号：US20170123548A1
公开(公告)日：2017-05-04
申请号：US14926265
申请日：2015-10-29
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih , Steve Kummerl , Mark Stephen Toth , Alok Lohia , Terry Lee Sculley , Seung Bae Lee , Scott Robert Summerfelt
IPC: G06F3/041
CPC classification number: G06F3/0414 , G06F3/0416
Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.
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公开(公告)号：US20160052781A1
公开(公告)日：2016-02-25
申请号：US14467616
申请日：2014-08-25
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Stuart M. Jacobsen , Wei-Yan Shih
CPC classification number: B81B7/0051 , B81B2207/07 , B81B2207/097 , B81C1/00333 , B81C1/00349 , B81C1/00396 , B81C1/00523 , B81C1/00666
Abstract: A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
Abstract translation: 通过将下部聚合物膜施加到包含多个MEMS器件的公共衬底的顶表面上并形成下部聚合物膜以形成围绕每个MEMS器件的部件的顶部空间壁来形成MEMS器件。 随后，将上部聚合物干膜施加到顶部空间壁的顶表面并且被图案化以形成隔离每个MEMS器件的部件的顶部空间盖。 随后，将MEMS器件分开以提供单独的MEMS器件。
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公开(公告)号：US12091311B2
公开(公告)日：2024-09-17
申请号：US15463246
申请日：2017-03-20
Applicant: Texas Instruments Incorporated
Inventor： Stuart M. Jacobsen , Wei-Yan Shih
CPC classification number: B81B7/0051 , B81C1/00333 , B81C1/00349 , B81C1/00396 , B81C1/00523 , B81C1/00666 , B81B2207/07 , B81B2207/097
Abstract: A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
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Patent Agency Ranking
公开(公告)号：US12072229B2
公开(公告)日：2024-08-27
申请号：US17462090
申请日：2021-08-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Michael Zwerg , Sudhanshu Khanna , Steven C. Bartling , Brian Elies , Krishnasawamy Nagaraj , Wei-Yan Shih
IPC: G01H11/08
CPC classification number: G01H11/08
Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
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公开(公告)号：US20220011177A1
公开(公告)日：2022-01-13
申请号：US17486818
申请日：2021-09-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Wei-Yan Shih
Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
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公开(公告)号：US20210389174A1
公开(公告)日：2021-12-16
申请号：US17462090
申请日：2021-08-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Michael Zwerg , Sudhanshu Khanna , Steven C. Bartling , Brian Elies , Krishnasawamy Nagaraj , Wei-Yan Shih
IPC: G01H11/08
Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
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公开(公告)号：US11105676B2
公开(公告)日：2021-08-31
申请号：US16191430
申请日：2018-11-14
Applicant: Texas Instruments Incorporated
Inventor： Michael Zwerg , Sudhanshu Khanna , Steven C. Bartling , Brian Elies , Krishnasawamy Nagaraj , Wei-Yan Shih
IPC: G01H11/08
Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
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公开(公告)号：US20200168786A1
公开(公告)日：2020-05-28
申请号：US16201808
申请日：2018-11-27
Applicant: Texas Instruments Incorporated
Inventor： Sudhanshu Khanna , Michael Zwerg , Steven C. Bartling , Brian Elies , Krishnasawamy Nagaraj , Wei-Yan Shih
IPC: H01L41/08 , H01L41/107 , H01L41/04 , H01L41/047
Abstract: An improved differential sensor and corresponding apparatus implementing same. The differential sensor includes a substrate, an amplifier coupled to the substrate, and a plurality of highly-matched piezoelectric capacitors formed onto the substrate. A first set of the highly-matched piezoelectric capacitors are electrically coupled to a non-inverting input of the amplifier, and a second set of the highly-matched piezoelectric capacitors are electrically coupled to an inverting input of the amplifier to form an open loop differential amplifier.
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