公开(公告)号：US11487381B2

公开(公告)日：2022-11-01

申请号：US16512020

申请日：2019-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G01L1/18 ,  G06F3/041 ,  G01L1/16 ,  G01L1/22

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.

公开(公告)号：US20170123548A1

公开(公告)日：2017-05-04

申请号：US14926265

申请日：2015-10-29

Applicant: Texas Instruments Incorporated

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G06F3/041

CPC classification number: G06F3/0414 ,  G06F3/0416

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.

公开(公告)号：US20190339806A1

公开(公告)日：2019-11-07

申请号：US16512020

申请日：2019-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G06F3/041

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.

公开(公告)号：US10353503B2

公开(公告)日：2019-07-16

申请号：US14926265

申请日：2015-10-29

Applicant: Texas Instruments Incorporated

Inventor： Wei-Yan Shih ,  Steve Kummerl ,  Mark Stephen Toth ,  Alok Lohia ,  Terry Lee Sculley ,  Seung Bae Lee ,  Scott Robert Summerfelt

IPC: G06F3/041

Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element may include a conditioning circuit, temperature gauge, FRAM and a processor core.

公开(公告)号：US09842797B2

公开(公告)日：2017-12-12

申请号：US14071403

申请日：2013-11-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Brian A. Carpenter ,  Christopher Sanzo ,  William T. Harrison ,  Alok Lohia ,  Matthew D. Romig

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/16 ,  H01L25/07

CPC classification number: H01L23/49575 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/4118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/0665 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A stacked die power converter package includes a lead frame including a die pad and a plurality of package pins, a first die including a first power transistor switch (first power transistor) attached to the die pad, and a first metal clip attached to one side of the first die. The first metal clip is coupled to at least one package pin. A second die including a second power transistor switch (second power transistor) is attached to another side on the first metal clip. A controller is provided by a controller die attached to a non-conductive layer on the second metal clip on one side of the second die.

公开(公告)号：US20140061884A1

公开(公告)日：2014-03-06

申请号：US14071403

申请日：2013-11-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Brian A. Carpenter ,  Christopher Sanzo ,  William T. Harrison ,  Alok Lohia ,  Matthew D. Romig

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/4118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/0665 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A stacked die power converter package includes a lead frame including a die pad and a plurality of package pins, a first die including a first power transistor switch (first power transistor) attached to the die pad, and a first metal clip attached to one side of the first die. The first metal clip is coupled to at least one package pin. A second die including a second power transistor switch (second power transistor) is attached to another side on the first metal clip. A controller is provided by a controller die attached to a non-conductive layer on the second metal clip on one side of the second die.

Abstract translation: 堆叠式芯片功率转换器封装包括：引线框架，包括管芯焊盘和多个封装引脚;第一管芯，包括附接到管芯焊盘的第一功率晶体管开关（第一功率晶体管）和附接到一侧的第一金属夹 的第一个死亡。 第一金属夹与至少一个封装销连接。 包括第二功率晶体管开关（第二功率晶体管）的第二裸片附接到第一金属夹的另一侧。 控制器由连接在第二金属夹上的第二金属夹上的非导电层上的控制器芯片提供在第二管芯的一侧上。