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    Light emitting diode package having anodized insulation layer and fabrication method therefor
    11.
    发明授权
    Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
    具有阳极氧化绝缘层的发光二极管封装及其制造方法

    公开(公告)号：US08030762B2

    公开(公告)日：2011-10-04

    申请号：US11730966

    申请日：2007-04-05

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L23/34 ,  H01L33/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

    摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

    Insulation structure for high temperature conditions and manufacturing method thereof
    12.
    发明授权
    Insulation structure for high temperature conditions and manufacturing method thereof 有权
    高温条件的绝缘结构及其制造方法

    公开(公告)号：US07998879B2

    公开(公告)日：2011-08-16

    申请号：US11723236

    申请日：2007-03-19

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L21/31

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

    摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

    摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

    Light emitting diode package
    13.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US07566912B2

    公开(公告)日：2009-07-28

    申请号：US11717154

    申请日：2007-03-13

    申请人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

    摘要： A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

    摘要翻译： 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。

    Light emitting diode package having anodized insulation layer and fabrication method therefor
    14.
    发明申请
    Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
    具有阳极氧化绝缘层的发光二极管封装及其制造方法

    公开(公告)号：US20070235743A1

    公开(公告)日：2007-10-11

    申请号：US11730966

    申请日：2007-04-05

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

    摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
    17.
    发明授权
    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权

    公开(公告)号：US08586128B2

    公开(公告)日：2013-11-19

    申请号：US12467513

    申请日：2009-05-18

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： B05D5/12

    CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

    Light emitting diode package
    19.
    发明申请
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20070221928A1

    公开(公告)日：2007-09-27

    申请号：US11717154

    申请日：2007-03-13

    申请人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

    摘要： A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

    摘要翻译： 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。