公开(公告)号：US11651981B2

公开(公告)日：2023-05-16

申请号：US16996211

申请日：2020-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jiao-Rou Liao ,  Sheng-Hsiang Chuang ,  Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: H01L21/67 ,  H04N5/232 ,  G01B11/14 ,  G06T7/00 ,  H04N5/225 ,  H04N7/18

CPC classification number: H01L21/67288 ,  G01B11/14 ,  G06T7/001 ,  H04N5/2256 ,  H04N5/23299 ,  H04N7/183 ,  G06T2207/30148

Abstract: A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.

公开(公告)号：US11334080B2

公开(公告)日：2022-05-17

申请号：US16580977

申请日：2019-09-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Cheng-Hung Chen ,  Yan-Han Chen ,  Feng-Kuang Wu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC: G05D1/02 ,  G01S17/931 ,  B25J5/00 ,  G05D1/00

Abstract: In an embodiment a system includes: an automated vehicle configured to traverse a first predetermined path; and a sensor system located on the automated vehicle, the sensor system configured to detect a vertical obstacle along the first predetermined path along one or two floorboards ahead of the automated vehicle, wherein the automated vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

公开(公告)号：US11152238B2

公开(公告)日：2021-10-19

申请号：US16201312

申请日：2018-11-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Sheng-Hsiang Chuang ,  Cheng-Hung Chen

IPC: G05B19/18 ,  H01L21/67 ,  H01L21/687

Abstract: In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.

公开(公告)号：US20210242043A1

公开(公告)日：2021-08-05

申请号：US17110122

申请日：2020-12-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Fei Yu ,  Chang-Chen TSAO ,  Ting-Yau Shiu ,  Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/66 ,  H01L21/02 ,  B32B43/00

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

公开(公告)号：US20190118522A1

公开(公告)日：2019-04-25

申请号：US16220163

申请日：2018-12-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

IPC: B32B38/10 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68

CPC classification number: B32B38/10 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/6838

Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

公开(公告)号：US20230282494A1

公开(公告)日：2023-09-07

申请号：US18197312

申请日：2023-05-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Fei YU ,  Chang-Chen Tsao ,  Ting-Yau Shiu ,  Cheng-Kang Hu ,  Hsu-Shui Liu ,  Jiun-Rong Pai

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/02 ,  B32B43/00 ,  H01L21/66

CPC classification number: H01L21/67092 ,  H01L24/799 ,  H01L24/98 ,  H01L21/02079 ,  B32B43/006 ,  H01L22/12 ,  H01L21/02032 ,  B32B2457/14

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

公开(公告)号：US10714364B2

公开(公告)日：2020-07-14

申请号：US15965701

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Shou-Wen Kuo ,  Sheng-Hsiang Chuang ,  Jiun-Rong Pai ,  Hsu-Shui Liu

IPC: G01M3/38 ,  H01L21/67 ,  H01L21/677

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load port outside the housing; a robot arm inside the housing; and a processor. The load port is coupled to the wall and configured to load a wafer carrier for inspection. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20190067057A1

公开(公告)日：2019-02-28

申请号：US15965701

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang Hu ,  Shau-Wen Kuo ,  Sheng-Hsiang Chuang ,  Jiun-Rong Pai ,  Hsu-Shui Liu

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load port outside the housing; a robot arm inside the housing; and a processor. The load port is coupled to the wall and configured to load a wafer carrier for inspection. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20180147825A1

公开(公告)日：2018-05-31

申请号：US15613963

申请日：2017-06-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Chen Tsao ,  Kuo Liang Lu ,  Ru-Liang Lee ,  Sheng-Hsiang Chuang ,  Yu-Hung Cheng ,  Yeur-Luen Tu ,  Cheng-Kang Hu

IPC: B32B38/10 ,  H01L21/67 ,  H01L21/683 ,  H01L21/68

CPC classification number: B32B38/10 ,  H01L21/67011 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/6838

Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.