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    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    11.
    发明申请
    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20210098335A1

    公开(公告)日：2021-04-01

    申请号：US16921916

    申请日：2020-07-06

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chen-Hua Yu ,  Chun-Hui Yu ,  Jeng-Nan Hung ,  Kuo-Chung Yee

    IPC: H01L23/42 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

    Abstract: A package structure includes a wafer-form semiconductor package and a thermal dissipating system. The wafer-form semiconductor package includes semiconductor dies electrically connected with each other. The thermal dissipating system is located on and thermally coupled to the wafer-form semiconductor package, where the thermal dissipating system has a hollow structure with a fluidic space, and the fluidic space includes a ceiling and a floor. The thermal dissipating system includes at least one inlet opening, at least one outlet opening and a plurality of first microstructures. The at least one inlet opening and the at least one outlet opening are spatially communicated with the fluidic space. The first microstructures are located on the floor, and at least one of the first microstructures is corresponding to the at least one outlet opening.

    INTEGRATED FAN-OUT PACKAGE AND METHOD FOR FABRICATING THE SAME
    12.
    发明申请
    INTEGRATED FAN-OUT PACKAGE AND METHOD FOR FABRICATING THE SAME 审中-公开

    公开(公告)号：US20200066642A1

    公开(公告)日：2020-02-27

    申请号：US16671188

    申请日：2019-11-01

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chen-Hua Yu ,  Chun-Hui Yu ,  Kuo-Chung Yee

    IPC: H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/367 ,  H01L25/065

    Abstract: An integrated fan-out package includes an integrated circuit, a plurality of semiconductor devices, a first redistribution circuit structure, and an insulating encapsulation. The integrated circuit has an active surface and a rear surface opposite to the active surface. The semiconductor devices are electrically connected the integrated circuit. The first redistribution circuit structure is disposed between the integrated circuit and the semiconductor devices. The first redistribution circuit structure is electrically connected to the integrated circuit and the semiconductor devices respectively. The first redistribution circuit structure has a first surface, a second surface opposite to the first surface, and lateral sides between the first surface and the second surface. The insulating encapsulation encapsulates the integrated circuit and the semiconductor devices and covers the first surface and the second surface of the first redistribution circuit structure. Furthermore, methods for fabricating the integrated fan-out package are also provided.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    19.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20200176357A1

    公开(公告)日：2020-06-04

    申请号：US16655257

    申请日：2019-10-17

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chen-Hua Yu ,  Chun-Hui Yu ,  Jeng-Nan Hung ,  Kuo-Chung Yee

    IPC: H01L23/473 ,  H01L25/065 ,  H01L25/18 ,  H01L23/31 ,  H01L21/50

    Abstract: A semiconductor package includes a semiconductor package, a cap, a seal, and microstructures. The semiconductor package includes at least one semiconductor die. The cap is disposed over an upper surface of the semiconductor package. The seal is located on the semiconductor package and between the cap and the semiconductor package. The cap includes an inflow channel and an outflow channel. The active surface of the at least one semiconductor die faces away from the cap. The cap and an upper surface of the semiconductor package define a circulation recess providing fluidic communication between the inflow channel and the outflow channel. The seal is disposed around the circulation recess. The microstructures are located within the circulation recess, and the microstructures are connected to at least one of the cap and the at least one semiconductor die.

    Integrated fan-out package and method for fabricating the same
    20.
    发明授权
    Integrated fan-out package and method for fabricating the same 有权

    公开(公告)号：US10475747B2

    公开(公告)日：2019-11-12

    申请号：US15676958

    申请日：2017-08-14

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chen-Hua Yu ,  Chun-Hui Yu ,  Kuo-Chung Yee

    IPC: H01L23/538 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/78

    Abstract: An integrated fan-out package includes an integrated circuit, a plurality of semiconductor devices, a first redistribution circuit structure, and an insulating encapsulation. The integrated circuit has an active surface and a rear surface opposite to the active surface. The semiconductor devices are electrically connected the integrated circuit. The first redistribution circuit structure is disposed between the integrated circuit and the semiconductor devices. The first redistribution circuit structure is electrically connected to the integrated circuit and the semiconductor devices respectively. The first redistribution circuit structure has a first surface, a second surface opposite to the first surface, and lateral sides between the first surface and the second surface. The insulating encapsulation encapsulates the integrated circuit and the semiconductor devices and covers the first surface and the second surface of the first redistribution circuit structure. Furthermore, methods for fabricating the integrated fan-out package are also provided.

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