公开(公告)号：US20180159217A1

公开(公告)日：2018-06-07

申请号：US15828191

申请日：2017-11-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Jin MIKATA ,  Masaya SHIMAMURA ,  Mikio AOKI ,  Takehiko KAI ,  Taiji ITO

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q1/08 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q21/06

Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.

公开(公告)号：US20150070851A1

公开(公告)日：2015-03-12

申请号：US14090534

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Kenzo KITAZAKI ,  Masaya SHIMAMURA ,  Eiji MUGIYA ,  Takehiko KAI

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K9/0015 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/301 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.

Abstract translation: 电路模块包括具有安装表面，导体图案和绝缘保护层的布线基板，安装表面具有第一和第二区域，导体图案沿安装表面上的第一和第二区域之间的边界形成， 绝缘保护层形成在安装表面上，绝缘保护层覆盖安装表面和导体图案; 安装在所述第一和第二区域上的多个电子部件; 绝缘密封层，其具有沟槽，所述绝缘密封层覆盖所述多个电子部件，所述沟槽具有使得所述沟槽穿过所述保护层以达到所述导电图案的表面的深度; 以及具有第一和第二屏蔽部分的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的外表面，所述第二屏蔽部分电连接到所述导体图案。

公开(公告)号：US20150070849A1

公开(公告)日：2015-03-12

申请号：US14090445

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya SHIMAMURA ,  Takehiko KAI ,  Eiji MUGIYA ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0269 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0037 ,  H05K9/0083 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09972 ,  H05K2201/1056 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。